Specifications
| Type | Description |
|---|---|
| Part Number | XL-HD3535UGC-A4 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 3535 SMD LED, 3.5 x 3.5 x 2.2 mm |
| Outline Dimensions | 3.5 x 3.5 x 2.2 mm |
| Luminous Color | Green |
| Colloid / Lens | Transparent colloid |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Meets RoHS requirements |
| Power Dissipation | 3000 mW |
| Forward Current | 700 mA |
| Electrostatic Discharge | 2000 V |
| Operating Temperature Range | -40 to +105°C |
| Storage Temperature Range | -40 to +85°C |
| Lead Soldering Temperature | 260°C max, <=6 s |
| Pulse Condition Note | Pulse width <=0.1 ms, duty <=1/10 |
| Luminous Flux | 110-150 lm |
| Dominant Wavelength | 515-535 nm |
| Peak Wavelength | 525 nm typ |
| Forward Voltage | 2.8-3.4 V |
| Half-Intensity Viewing Angle | 120 deg typ |
| Junction Temperature | 125°C max |
| Reverse Current | 5 uA max |
| Brightness Bin K4 | 110-120 lm |
| Brightness Bin K5 | 120-130 lm |
| Brightness Bin K6 | 130-140 lm |
| Brightness Bin K7 | 140-150 lm |
| Voltage Bin N13-3 | 2.8-3.0 V |
| Voltage Bin N13-4 | 3.0-3.2 V |
| Voltage Bin N13-5 | 3.2-3.4 V |
| Wavelength Bin HG02 | 515-520 nm |
| Wavelength Bin HG03 | 520-525 nm |
| Wavelength Bin HG04 | 525-530 nm |
| Wavelength Bin HG05 | 530-535 nm |
| Test Environment Temperature | 25±5°C |
| Room Temperature Life Test | 1000 hours, 22 pcs, 0 failures |
| High Temperature Storage Test | 1000 hours, 22 pcs, 0 failures |
| Low Temperature Storage Test | 1000 hours, 22 pcs, 0 failures |
| High Temperature Humidity Test | 1000 hours, 22 pcs, 0 failures |
| Cold/Heat Strike Test | 50 cycles, 22 pcs, 0 failures |
| Cold and Heat Cycle Test | 50 cycles, 22 pcs, 0 failures |
| Reliability Judging Criterion - Forward Voltage | max initial data x 1.1 |
| Reliability Judging Criterion - Reverse Current | 10 uA max |
| Reliability Judging Criterion - Luminous Intensity | min initial data x 0.7 |
| Outline Dimension Tolerance | ±0.25 mm |
| Tape/Reel Dimension Tolerance | ±0.1 mm |
| Hand Soldering Iron Power | <30 W recommended |
| Hand Soldering Temperature | <300°C |
| Hand Soldering Time | <3 s per terminal |
| Reflow Soldering Limit | maximum two times |
| Recommended Maximum Reflow Temperature | 240±5°C for 6 s |
| Cleaning Condition | alcohol cleaning under 30°C for 3 min or 50°C for 30 s |
| Ultrasonic Cleaning Power | <=300 W recommended maximum |
| Unopened Storage Life | 1 year |
| Storage Before Opening | <=30°C, <=60% RH |
| Storage After Opening | <=30°C, <=40% RH, use within 168 hours / 7 days |
| Recommended Workshop Condition | <=30°C, <=60% RH |
| Baking Condition | 60±5°C for 24 hours |
| Datasheet Status | request_only |
Product Overview
The XL-HD3535UGC-A4 is a XINGLIGHT green high-power SMD LED built in a 3535 package. Its outline dimensions are 3.5 x 3.5 x 2.2 mm, with transparent colloid used for the green LED package resin. The device is listed as MSL 3 and meets RoHS requirements.
At IF=350 mA and Ta=25°C, the LED provides 110-150 lm luminous flux, 515-535 nm dominant wavelength, 525 nm typical peak wavelength, and 2.8-3.4 V forward voltage. The half-intensity viewing angle is 120 degrees typical, supporting wide-angle green emission from a compact SMD footprint.
Assembly and handling limits include a 260°C maximum lead soldering temperature for no more than 6 seconds, a recommended maximum Pb-free reflow temperature of 240±5°C for 6 seconds, and a maximum of two reflow soldering cycles. Storage guidance includes 1 year unopened at <=30°C and <=60% RH, and use within 168 hours after opening at <=30°C and <=40% RH.
Key Features
- Green high-power SMD LED in 3535 package
- 3.5 x 3.5 x 2.2 mm outline
- Transparent colloid package resin for green emission
- 110-150 lm luminous flux at IF=350 mA
- 515-535 nm dominant wavelength range
- 2.8-3.4 V forward voltage at IF=350 mA
- 120 degree typical half-intensity viewing angle
- 700 mA absolute maximum forward current
- 3000 mW absolute maximum power dissipation
- MSL 3 moisture sensitivity level
- Meets RoHS requirements
- -40 to +105°C operating temperature range
Typical Applications
- Green illumination modules
- Status indicator lighting
- Signal and marker lamps
- Wide-angle green light sources
- Compact SMD LED assemblies
- Color-coded equipment indicators
- High-current LED boards
Procurement Notes
When requesting a quote for XL-HD3535UGC-A4, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size does XL-HD3535UGC-A4 use?
XL-HD3535UGC-A4 uses a 3535 SMD LED package with outline dimensions of 3.5 x 3.5 x 2.2 mm. The outline dimension tolerance is ±0.25 mm unless otherwise noted.
What are the main optical ratings at 350 mA?
At IF=350 mA and Ta=25°C, the device is specified for 110-150 lm luminous flux, 515-535 nm dominant wavelength, 525 nm typical peak wavelength, and a 120 degree typical half-intensity viewing angle.
What soldering limits apply to this LED?
The absolute maximum lead soldering temperature is 260°C for no more than 6 seconds. The recommended maximum Pb-free reflow condition is 240±5°C for 6 seconds, with reflow limited to a maximum of two times.
How should the LED be stored after opening?
After opening, the storage condition is <=30°C and <=40% RH, with use required within 168 hours or 7 days. If package or desiccant conditions fail, baking at 60±5°C for 24 hours is specified.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.