Tech Hub

Practical insights on components & sourcing

XL-HD3535UGC-A4 Green LED: Thermal & Optical Bin Analysis

The XINGLIGHT XL-HD3535UGC-A4 is a 3.5x3.5mm green SMD LED designed for high-intensity applications such as mobile camera flashes and signal lighting. This technical brief analyzes critical optical and electrical para...

XL-HD3535UGC-A4 Green LED: Thermal & Optical Bin Analysis

📌 Product Overview

The XL-HD3535UGC-A4 from XINGLIGHT is a high-power Green SMD LED housed in a compact 3.5x3.5x2.2mm package with a transparent colloid. Designed for applications requiring substantial luminous flux, this component delivers a typical output of 110–150 lm under 350mA drive conditions. 💡 The device features a wide 120-degree viewing angle, making it suitable for both focused illumination and area lighting tasks. Its robust construction supports a forward current of up to 700mA, positioning it as a viable solution for portable lighting fixtures and signal indicators where board space is constrained but output intensity is critical.

🎯 Typical Applications

Based on the datasheet parameters and optical characteristics, the XL-HD3535UGC-A4 is engineered for the following specific use cases:

  • Mobile Camera Flash: The high output power and compact footprint allow for integration into smartphone strobe modules or tablet camera flashes.
  • Digital Video (DV) Lighting: Suitable for flashlight modules in digital video recording devices requiring consistent, high-intensity green illumination.
  • Signage and Symbol Lights: Effective for traffic signals, industrial indicator panels, and emergency exit signs due to high visibility and long lifespan.
  • Decorative Entertainment: Used in ambient lighting systems, stage effects, and decorative fixtures where color consistency and longevity are required.

📊 Key Technical Specifications

The following table outlines the electro-optical characteristics ($T_a=25^\circ C$) necessary for circuit design and binning selection.

ParameterSymbolTest ConditionsMinTypMaxUnit
Luminous Flux$\Phi$$I_F=350mA$110-150lm
Forward Voltage$V_F$$I_F=350mA$2.8-3.4V
Peak Wavelength$\lambda_p$$I_F=350mA$-525-nm
Main Wavelength$\lambda_D$$I_F=350mA$515525535nm
Half-Intensity Angle$2\theta_{1/2}$$I_F=350mA$-120-Deg
Reverse Current$I_R$$V_R=5V$--5uA

👇 Design Note: Engineers should utilize the provided Brightness (K4-K7) and Voltage (N13-3 to N13-5) grading codes to ensure uniformity in mass production.

⚠️ Absolute Maximum Ratings & Process Limits

Exceeding these values may cause permanent device failure. Stress testing indicates these limits are critical for reliability.

ParameterSymbolValueUnitNotes
Power Dissipation$P_D$3000mW
DC Forward Current$I_F$700mA
Reverse Voltage$V_R$5V
ESD Tolerance-2000VHuman Body Model (HBM)
Junction Temperature$T_j$125$^\circ C$
Storage Temperature$T_{stg}$-40 to +85$^\circ C$
Operating Temp$T_{opr}$-40 to +105$^\circ C$

⚠️ Caution: The datasheet specifies a pulse width limit of $\le 0.1ms$ and duty cycle $\le 1/10$ for peak operation. For soldering, lead temperature must not exceed $260^\circ C$ for longer than 6 seconds.

📦 Package, Dimensions & Assembly Notes

Physical Characteristics:

  • Package Type: 3535 Surface Mount Device (SMD)
  • Dimensions: 3.5mm (L) x 3.5mm (W) x 2.2mm (H)
  • Tolerance: $\pm 0.25mm$ (unless noted)
  • Moisture Sensitivity: MSL 3 (Floor life: 168 hours at $<30^\circ C / 60% RH$)

Assembly Guidelines:
🔒 Soldering Profile: Reflow soldering should not exceed two cycles. The recommended profile follows standard Pb-free guidelines.

  • Hand Soldering: Use an iron $<30W$. Tip temperature must remain $<300^\circ C$. Duration per terminal must be $<3$ seconds.
  • Mechanical Stress: Do not apply pressure to the lens during the heating phase of reflow, as this can cause internal mechanical damage or delamination.

🚀 Sourcing & Supply Considerations

  • Binning Verification: Always specify brightness (K4-K7) and voltage (N13) codes when placing orders to maintain color and power consistency across batches.
  • Authenticity: Source from authorized channels to verify compliance with ROHS environmental standards.
  • Handling: Given the MSL 3 rating, ensure proper dry packing storage if components are not mounted within 168 hours of opening.

❓ FAQ

Q: What is the maximum current I can drive the XL-HD3535UGC-A4 with?
A: The Absolute Maximum Rating for DC Forward Current is 700mA. However, for continuous operation, proper thermal management is required to keep the junction temperature ($T_j$) below $125^\circ C$.

Q: What does the "K4-K7" brightness grading mean?
A: These codes define the luminous flux bins. K4 ranges from 110-120 lm, while K7 ranges from 140-150 lm (tested at 350mA). Selecting a single bin ensures visual uniformity in your lighting application.

Q: Can this LED be used for outdoor lighting?
A: Yes, the operating temperature range is -40 to +105$^\circ C$, and the storage range extends down to -40$^\circ C$, making it suitable for harsh environments. However, the IP rating depends on your enclosure design.

Q: What are the precautions for reflow soldering?
A: Do not perform reflow soldering more than twice. Ensure the peak temperature does not exceed $260^\circ C$ and avoid placing any mechanical stress on the LED body during the liquidus phase.

Q: Is this component RoHS compliant?
A: Yes, the datasheet explicitly states that the XL-HD3535UGC-A4 is an environmental protection product meeting ROHS requirements.

About Leon Zhang

Founder and Strategic Sourcing Lead, LDeepAI

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

Expertise: electronic component sourcing, China supply-chain verification, LED components, memory and storage sourcing, RFQ risk screening.

Connect on LinkedIn

How to Use This Insight

For procurement teams

This Tech Hub article is written for OEM, EMS, distributor and engineering teams evaluating component supply risk, allocation pressure and sourcing timing.

What LDeepAI supports

LDeepAI provides AI-assisted electronic component sourcing support, verified China channel screening and RFQ risk review for global buyers.

LED sourcing scope

For LED requirements, LDeepAI can help review RFQs and sourcing paths for SMD LEDs, through-hole LEDs, automotive LEDs, IR / UV LEDs and custom LED sourcing demand.

Business boundary

LDeepAI does not imply brand authorization for memory or IC categories unless explicitly stated. These categories are handled through verified trade channels and risk-screened workflows.

More Insights

View all →

Send Your Component RFQ

Send us your part number, BOM file, target quantity, package requirement, application and delivery country. LDeepAI will review available sourcing options and respond with next-step recommendations.

Need sourcing support? Submit RFQ