Specifications
| Type | Description |
|---|---|
| Part Number | XL101X-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | LSOP4 |
| Component Type | Other |
| Current Transfer Ratio | 50-600 %; IF=5mA, VCE=5V |
| Current Transfer Ratio | 63-320 %; IF=10mA, VCE=5V |
| Isolation Voltage | 5000 Vrms; AC for 1 minute, 40-60% RH |
| Collector-Emitter Breakdown Voltage | >=80 V; IC=0.1mA, IF=0 |
| Operating Temperature | -55 to +110 °C; operating range |
| Case | LSOP4; mechanical data |
| Molding Compound Flammability Rating | UL 94V-0; mechanical data |
| Terminal Finish | Matte tin-plated leads; solderability per MIL-STD-202, Method 208 |
| Forward Current | 60 mA; maximum rating, TA=25°C |
| Input Peak Forward Current | 1.5 A; pulse width <=1us, duty ratio 0.001, TA=25°C |
| Reverse Voltage | 6 V; maximum rating, TA=25°C |
| Input Power Dissipation | 100 mW; maximum rating, TA=25°C |
| Collector Power Dissipation | 150 mW; maximum rating, TA=25°C |
| Output Collector Current | 50 mA; maximum rating, TA=25°C |
| Collector-Emitter Voltage | 80 V; maximum rating, TA=25°C |
| Emitter-Collector Voltage | 7 V; maximum rating, TA=25°C |
| Total Power Dissipation | 250 mW; maximum rating, TA=25°C |
| Storage Temperature Range | -55 to +125 °C; storage range |
| Soldering Temperature | 260 °C; for 10 seconds |
| Forward Voltage | typ 1.3 V, max 1.5 V; IF=50mA, TA=25°C |
| Reverse Current | max 10 uA; VR=6V, TA=25°C |
| Input Capacitance | typ 50 pF; VR=0V, f=1kHz, TA=25°C |
| Collector-Emitter Dark Current | max 100 nA; VCE=20V, IF=0, TA=25°C |
| Collector-Emitter Breakdown Voltage | min 80 V; IC=0.1mA, IF=0, TA=25°C |
| Emitter-Collector Breakdown Voltage | min 7 V; IE=0.1mA, IF=0, TA=25°C |
| Current Transfer Ratio | min 22 %; IF=1mA, VCE=5V, TA=25°C |
| Collector-Emitter Saturation Voltage | typ 0.1 V, max 0.3 V; IF=10mA, IC=1mA, TA=25°C |
| Isolation Resistance | min 1×10^12 ohm; VIO=500Vdc, 40-60% RH |
| Floating Capacitance | max 1.0 pF; VIO=0, f=1MHz |
| Turn-On Time | min 1 us, typ 4 us, max 19 us; VCE=5V, IC=5mA, RL=100 ohm |
| Turn-Off Time | min 1 us, typ 3 us, max 19 us; VCE=5V, IC=5mA, RL=100 ohm |
| Rise Time | max 18 us; VCE=5V, IC=5mA, RL=100 ohm |
| Fall Time | max 18 us; VCE=5V, IC=5mA, RL=100 ohm |
| CTR Rank XL1010 | 50-600 %; IF=5mA, VCE=5V |
| CTR Rank XL1017 | 80-160 %; IF=5mA, VCE=5V |
| CTR Rank XL1018 | 130-260 %; IF=5mA, VCE=5V |
| CTR Rank XL1019 | 200-400 %; IF=5mA, VCE=5V |
| CTR Rank XL1012 | 63-125 %; IF=10mA, VCE=5V |
| CTR Rank XL1013 | 100-200 %; IF=10mA, VCE=5V |
| CTR Rank XL1014 | 160-320 %; IF=10mA, VCE=5V |
| CTR Rank XL1012 | min 22 %; IF=1mA, VCE=5V |
| CTR Rank XL1013 | min 34 %; IF=1mA, VCE=5V |
| CTR Rank XL1014 | min 56 %; IF=1mA, VCE=5V |
| Package Shipping Quantity | 3000 pcs/reel; LSOP4 package |
| Marking Code | XL101X; part marking |
| CTR Rank Options | 0, 2, 3, 4, 7, 8, 9; X denotes CTR rank |
| Halogen Option | G: Halogen free; none: Halogen free |
| Reflow Preheat Temperature | 150-200 °C; reflow soldering profile |
| Reflow Preheat Time | 60-120 s; reflow soldering profile |
| Reflow Ramp-Up Rate | max 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; reflow soldering profile |
| Reflow Time Above Liquidus | 60-150 s; temperature above TL |
| Reflow Peak Temperature | 260 °C; reflow soldering profile |
| Reflow Time Near Peak | 30 s; Tc between TP-5 and TP |
| Reflow Ramp-Down Rate | max 6 °C/s; TP to TL |
| Maximum Reflow Cycles | No more than 3 times; recommended reflow soldering |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; wave soldering profile |
| Wave Soldering Heating Rate During Preheat | typ 1-2 °C/s, max 4 °C/s; wave soldering profile |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp |
| Wave Soldering Time Within Peak Temperature | 10 s; tp |
| Wave Soldering Ramp-Down Rate | max 5 °C/s; wave soldering profile |
| Hand Soldering Iron Temperature | 360 °C +5 °C; within 3 s, rework or sample testing only |
| Packing Form | Reel, 330 mm diameter; LSOP4 package |
| Quantity Per Box | 6000 pcs; 2 reels per box, 3000 pcs/reel |
| Quantity Per Carton | 60000 pcs; 10 boxes per carton |
| Antistatic Bag Specification | 380*420 mm; packing specification |
| Box Specification | 350*340*60 mm; packing specification |
| Carton Specification | 365*330*370 mm; packing specification |
| Guard Band Speed | 200 mm/min; packing note |
| Datasheet Status | request_only |
Product Overview
XL101X-G is a XINGLIGHT phototransistor optocoupler classified in the LED category and supplied in an LSOP4 package. The part uses an input LED and phototransistor output structure, with current transfer ratio specified across multiple operating points and rank options.
Electrical data includes 5000 Vrms isolation voltage, minimum 80 V collector-emitter breakdown voltage, minimum 7 V emitter-collector breakdown voltage, and maximum 100 nA collector-emitter dark current at VCE=20V with IF=0. Switching parameters are specified at VCE=5V, IC=5mA, RL=100 ohm, with turn-on time of 1 us minimum, 4 us typical, and 19 us maximum, and turn-off time of 1 us minimum, 3 us typical, and 19 us maximum.
Mechanical and assembly facts include LSOP4 case construction, UL 94V-0 molding compound, matte tin-plated leads, 330 mm reel packing, and 3000 pcs/reel packaging. Soldering data covers 260 °C reflow peak, 217 °C liquidus temperature, and hand soldering at 360 °C +5 °C within 3 seconds for rework or sample testing only.
Key Features
- Phototransistor optocoupler in LSOP4 package
- 5000 Vrms isolation voltage for one minute
- CTR range 50-600% at IF=5mA
- CTR range 63-320% at IF=10mA
- Minimum 80 V collector-emitter breakdown voltage
- Operating temperature range -55 to +110 °C
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads for MIL-STD-202 solderability
- Turn-on time typ 4 us at specified load
- Turn-off time typ 3 us at specified load
- 260 °C reflow peak temperature profile
- 3000 pcs per reel LSOP4 packaging
Typical Applications
- Isolated signal coupling
- Phototransistor output interfaces
- Low-current CTR-ranked circuits
- LSOP4 surface-mount assemblies
- 5000 Vrms isolation designs
- Reflow soldered optocoupler boards
- Matte tin lead solder assemblies
Procurement Notes
When requesting a quote for XL101X-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is XL101X-G?
XL101X-G is a XINGLIGHT phototransistor optocoupler in the LED category. The extracted datasheet facts identify the product type as a phototransistor optocoupler and the package case as LSOP4.
What isolation rating is specified for XL101X-G?
The isolation voltage is specified as 5000 Vrms under an AC test for 1 minute at 40-60% relative humidity. Isolation resistance is listed as minimum 1×10^12 ohm at VIO=500Vdc and 40-60% RH.
What current transfer ratio ranges are available?
The extracted facts list 50-600% CTR at IF=5mA, VCE=5V and 63-320% at IF=10mA, VCE=5V. Rank options include 0, 2, 3, 4, 7, 8, and 9.
What are the main voltage and current limits?
Maximum ratings include 60 mA forward current, 1.5 A input peak forward current under the stated pulse condition, 80 V collector-emitter voltage, 7 V emitter-collector voltage, and 50 mA output collector current at TA=25°C.
What soldering conditions are listed for this package?
The soldering data includes 260 °C for 10 seconds, reflow preheat of 150-200 °C for 60-120 seconds, 260 °C reflow peak temperature, and no more than three reflow cycles. Hand soldering is listed as 360 °C +5 °C within 3 seconds for rework or sample testing only.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.