XL-1010RGBC-WS2812B Addressable RGB SMD LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-1010RGBC-WS2812B Addressable RGB SMD LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-1010RGBC-WS2812B
Manufacturer
XINGLIGHT
Package
1010 SMD, 1.0 x 1.0 x 0.8 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-1010RGBC-WS2812B from XINGLIGHT is an LED in a 1010 SMD, 1.0 x 1.0 x 0.8 mm package. It is an addressable RGB SMD LED with an integrated external single-line cascade constant-current IC inside the package. Key parameters include 3.5-5.5 V supply operation, 800 Kbps data transmission, GRB 24-bit data structure, 256-level PWM grayscale, 5 mA/channel preset current, and 120 degree typical viewing angle. The device supports cascaded RGB display points, compact color lighting modules, matrix pixels, and serially controlled indicator or decorative lighting assemblies.

Specifications

TypeDescription
Part NumberXL-1010RGBC-WS2812B
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Package / Case1010 SMD, 1.0 x 1.0 x 0.8 mm
Outline Dimensions1.0 x 1.0 x 0.8 mm; L/W/H
Luminous ColorColorful magic RGB; transparent colloid
Moisture Sensitivity LevelMSL 5
RoHS ComplianceComplies with RoHS Directive
Integrated IC TypeExternal single-line cascade constant-current IC; integrated inside 1010 LED package
Data Transmission Frequency800 Kbps; WS2812B functional characteristic
Refresh Capability>=1024 points at 30 frames/s; 800 Kbps data transmission
Grayscale Resolution256 levels; PWM output control
Port Scan Frequency1.5 kHz; PWM output control
Preset Constant Current5 mA/channel; optimized preset constant-current mode
Intra-chip Current Error<1.5%; constant-current accuracy
Inter-chip Current Error<3%; constant-current accuracy
Supply Voltage Absolute Maximum Rating3.5-5.5 V; Ta=25°C
Logic Input Voltage-0.4 to VDD+0.4 V; Ta=25°C absolute maximum rating
Output Port Withstand Voltage16 V; Ta=25°C absolute maximum rating
Operating Temperature-40 to +85 °C; absolute maximum rating
Storage Temperature-40 to +85 °C; absolute maximum rating
Reflow Soldering Temperature260°C for 6 s; absolute maximum rating
ESD Sensitivity2000 V HBM; absolute maximum rating
Red Luminous Intensity200 mcd typ; Ta=25°C
Green Luminous Intensity800 mcd typ; Ta=25°C
Blue Luminous Intensity300 mcd typ; Ta=25°C
Red Dominant Wavelength620-630 nm; IF=20 mA, Ta=25°C
Green Dominant Wavelength520-530 nm; IF=20 mA, Ta=25°C
Blue Dominant Wavelength465-475 nm; IF=20 mA, Ta=25°C
Red Peak Wavelength625 nm typ; Ta=25°C
Green Peak Wavelength525 nm typ; Ta=25°C
Blue Peak Wavelength470 nm typ; Ta=25°C
Half Intensity Viewing Angle120 deg typ; 2θ1/2, Ta=25°C
Chip Power Supply Voltage3.5-5.5 V; electrical parameters, Ta=25°C
Static Current0.35 mA typ; VDD=4.5 V, IOUT off
Input High Threshold Voltage2.8 V min; DIN input high level
Input Low Threshold Voltage1.6 V max; DIN input low level
DOUT Output High Current-35 mA typ; DOUT high, 10 Ω resistor to GND
DOUT Sink Current35 mA typ; DOUT low, supply current into DOUT
OUT RGB Output Current5 mA typ; VDD=5 V, VDS=1 V
OUT RGB Inflection Point Voltage0.6 V typ; Lout=5 mA
Output Current Variation vs VDS0.5% typ; IOUT=5 mA, VDS=1.0-3.0 V
Output Current Variation vs VDD0.5% typ; IOUT=5 mA, VDD=4.5-5.5 V
Output Current Variation vs Temperature5.0% typ; IOUT=5 mA, TA=-40°C to +85°C
Output PWM Frequency1.0 kHz typ; Iout=5 mA, OUT port through 200 Ω resistor to VDD
Signal Transmission Delay tPLH67 ns typ; DOUT load capacitance 30 pF, DIN to DOUT
Signal Transmission Delay tPHL93 ns typ; DOUT load capacitance 30 pF, DIN to DOUT
DOUT Conversion Time tTLH15 ns typ; DOUT load capacitance 30 pF
DOUT Conversion Time tTHL23 ns typ; DOUT load capacitance 30 pF
OUT RGB Rise Time104 ns typ; IOUTR/G/B=5 mA, OUTR/G/B through 200 Ω to VDD, load capacitance 30 pF
OUT RGB Fall Time298 ns typ; IOUTR/G/B=5 mA, OUTR/G/B through 200 Ω to VDD, load capacitance 30 pF
Data Structure24-bit; high order first, GRB order
Color Data OrderGRB; 24-bit data transmission
Input 0 Code High Time0.3 us min; signal transmission definition
Input 1 Code High Time0.9 us min; signal transmission definition
Input 0 Code Low Time0.9 us min; signal transmission definition
Input 1 Code Low Time0.3 us min; signal transmission definition
0/1 Code Cycle1.2 us min; signal transmission definition
Reset Code Low Time>200 us; signal transmission definition
Code Low-Level Time Limit<20 us; low-level time of code 0 and code 1 when programming
Room Temperature Life Test1000 hours, 22 pcs, 0 failures; Ta=25°C±5°C, IF=5 mA, JIS7021:B4
High Temperature Storage Test1000 hours, 22 pcs, 0 failures; Ta=85°C±5°C, JIS7021:B10 / MIL-STD-202:210A / MIL-STD-750:2031
Low Temperature Storage Test1000 hours, 22 pcs, 0 failures; Ta=-35°C±5°C, JIS7021:B12
High Temperature Humidity Test1000 hours, 22 pcs, 0 failures; Ta=85°C±5°C, RH=85%, JIS7021:B11 / MIL-STD-202:103D
Cold/Heat Strike Test100 cycles, 22 pcs, 0 failures; -10°C±5°C to 100°C±5°C, 30 min / 5 min / 5 min timing, MIL-STD-202:107D / MIL-STD-750:1026
Cold and Heat Cycle Test100 cycles, 22 pcs, 0 failures; -35°C to 25°C to 85°C to -35°C, JIS7021:A3 / MIL-STD-202:107D / MIL-STD-705:105E
Reliability Forward Voltage CriterionMax initial data x1.1; IF=5 mA
Reliability Reverse Current Criterion1 uA max; VR=5 V
Reliability Luminous Intensity CriterionMin initial data x0.7; IF=5 mA
Pin 1 FunctionDO, display data cascade output; pin function table
Pin 2 FunctionVDD, internal IC power positive and RGB positive; pin function table
Pin 3 FunctionGND, signal ground and power ground; pin function table
Pin 4 FunctionDI, display data input; pin function table
Outline Dimension Tolerance±0.1 mm; unless otherwise noted
Tape/Reel Dimension Tolerance±0.25 mm; unless otherwise noted
Hand Soldering Iron Power<30 W; manual soldering for repair/rework
Hand Soldering Temperature<300°C; each terminal once only
Hand Soldering Time<3 s; per terminal, one time only
Maximum Reflow Count2 times; secondary reflow completed within 8 hours
Recommended Maximum Soldering Temperature240±5°C for 6 s; product recommended maximum welding temperature
Alcohol Cleaning Condition≤30°C for 3 min or ≤50°C for 30 s; after soldering
Ultrasonic Cleaning Power≤300 W; pretest required to confirm no LED damage
Unopened Shelf Life3 months; sealed moisture-proof anti-static bag with desiccant
Storage Before Opening≤30°C, ≤60% RH; before opening package
Storage After Opening≤30°C, ≤40% RH, solder within 24 hours; after opening package
Recommended Workshop Condition≤30°C, ≤60% RH; product operation environment
Baking Condition60±5°C for 24 hours; if moisture absorbent fails or storage time exceeded
Signal Protection Resistor Range20 Ω to 2 kΩ; series resistors R1/R2 on signal input/output terminals; depends on cascade count and distance
Typical Signal Protection ResistorApproximately 500 Ω; recommended typical value, actual value depends on use case
Datasheet Statusrequest_only

Product Overview

The XL-1010RGBC-WS2812B is a XINGLIGHT addressable RGB SMD LED using a 1010 package with 1.0 x 1.0 x 0.8 mm outline dimensions. The luminous color is specified as colorful magic RGB with transparent colloid, and the package integrates an external single-line cascade constant-current IC.

Key Features

  • 1010 SMD package, 1.0 x 1.0 x 0.8 mm
  • Colorful magic RGB output with transparent colloid
  • Integrated single-line cascade constant-current IC
  • 800 Kbps data transmission frequency
  • 24-bit high-order-first GRB data structure
  • 256-level PWM grayscale output control
  • Preset 5 mA/channel constant-current mode
  • 120 degree typical half-intensity viewing angle
  • 3.5-5.5 V chip power supply range
  • MSL 5 moisture sensitivity rating

Typical Applications

  • Cascaded RGB LED arrays
  • Addressable RGB display points
  • Compact color lighting modules
  • Serially controlled indicator pixels
  • RGB matrix or strip assemblies
  • Decorative color lighting

Procurement Notes

When requesting a quote for XL-1010RGBC-WS2812B, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package does XL-1010RGBC-WS2812B use?

XL-1010RGBC-WS2812B uses a 1010 SMD package with 1.0 x 1.0 x 0.8 mm outline dimensions. Unless otherwise noted, the outline dimension tolerance is specified as ±0.1 mm.

What data format is used by this LED?

The device uses a 24-bit data structure sent high order first. The color data order is GRB, and the signal transmission definition lists separate high and low timing limits for code 0 and code 1.

What supply voltage range is specified?

The datasheet lists 3.5-5.5 V for the supply voltage absolute maximum rating at Ta=25°C and also lists 3.5-5.5 V as the chip power supply voltage under electrical parameters.

What assembly limits apply to soldering?

The reflow soldering absolute maximum rating is 260°C for 6 s. The recommended maximum soldering temperature is 240±5°C for 6 s, with a maximum of two reflows and secondary reflow completed within 8 hours.

How should opened packages be stored?

After opening, storage is specified at ≤30°C and ≤40% RH, with soldering within 24 hours. If the moisture absorbent fails or storage time is exceeded, baking is specified at 60±5°C for 24 hours.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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