XL-0807RGBC-WS2812B-S Addressable RGB LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-0807RGBC-WS2812B-S Addressable RGB LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-0807RGBC-WS2812B-S
Manufacturer
XINGLIGHT
Package
0807 SMD, 2.0 x 1.8 x 0.8 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-0807RGBC-WS2812B-S from XINGLIGHT is an addressable RGB LED in an 0807 SMD package measuring 2.0 x 1.8 x 0.8 mm. It uses single-line cascade data transmission at 800 Kbps with 24-bit high-order-first GRB data, 256 grayscale levels, and a 4.5 kHz typical output PWM frequency. The device operates from a 3.5-5.5 V chip supply and provides 5 mA typical RGB output current. Optical parameters include RGB transparent-colloid emission, 120 degree typical viewing angle, and typical luminous intensities of 80 mcd red, 280 mcd green, and 60 mcd blue at Ta=25°C. It is suited to compact cascaded RGB LED designs requiring controlled data timing.

Specifications

TypeDescription
Part NumberXL-0807RGBC-WS2812B-S
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Package / Case0807 SMD, 2.0 x 1.8 x 0.8 mm
Outline Dimensions2.0 x 1.8 x 0.8 mm; L/W/H
Luminous ColorRGB; transparent colloid
Moisture Sensitivity LevelMSL 5; moisture sensitivity level
Data Transmission Frequency800 Kbps; single-line cascade data transmission
Refresh Capability>=1024 points at 30 frames/s; screen refresh rate 30 fps
Grayscale256 levels; PWM output port control
Port Scan Frequency1.5 kHz; output port PWM control
Preset Constant Current5 mA/channel; optimized preset constant-current mode
Intra-chip Current Error<1.5%; constant-current accuracy
Inter-chip Current Error<3%; constant-current accuracy
Supply Voltage Absolute Maximum3.5-5.5 V; Ta=25°C
Logic Input Voltage-0.5 to VDD+5.5 V; Ta=25°C absolute maximum rating
Output Port Withstand Voltage10 V; Ta=25°C absolute maximum rating
Operating Temperature-40 to +85 °C; absolute maximum rating
Storage Temperature-40 to +85 °C; absolute maximum rating
Soldering Temperature260 °C for 6 s; reflow/circle solder temperature absolute maximum rating
ESD Sensitivity3000 V HBM; absolute maximum rating
Red Luminous Intensity80 mcd typ; Ta=25°C
Green Luminous Intensity280 mcd typ; Ta=25°C
Blue Luminous Intensity60 mcd typ; Ta=25°C
Red Dominant Wavelength620-630 nm; IF=5mA, Ta=25°C
Green Dominant Wavelength520-530 nm; IF=5mA, Ta=25°C
Blue Dominant Wavelength460-475 nm; IF=5mA, Ta=25°C
Red Peak Wavelength625 nm typ; Ta=25°C
Green Peak Wavelength525 nm typ; Ta=25°C
Blue Peak Wavelength470 nm typ; Ta=25°C
Half Intensity Viewing Angle120 deg typ; 2θ1/2, Ta=25°C
Chip Power Supply Voltage3.5-5.5 V; electrical parameters, Ta=25°C
Static Current0.35 mA typ; VDD=5V, IOUT off
Input High Threshold Voltage0.55 x VDD min; DIN input high level
Input Low Threshold Voltage0.3 x VDD max; DIN input low level
DOUT High Output Current15 mA typ; DOUT high output, 10 ohm resistor to GND
DOUT Low Sink Current17 mA typ; DOUT low output, sink current from supply to DOUT
OUT RGB Output Current5 mA typ; VDD=5V, VDS=1V
Output Current Variation vs VDS0.5% typ; IOUT=5mA, VDS=1.0-3.0V
Output Current Variation vs VDD5.0% typ; IOUT=5mA, VDD=4.5-5.5V
Output Current Variation vs Temperature5.0% typ; IOUT=5mA, TA=-40°C to +85°C
Output PWM Frequency4.5 kHz typ; Iout=5mA, OUT port with 200 ohm resistor to VDD
Signal Transmission Delay tPLH80 ns typ; DOUT load capacitance 30pF, DIN to DOUT
Signal Transmission Delay tPHL80 ns typ; DOUT load capacitance 30pF, DIN to DOUT
DOUT Conversion Time tTLH12 ns typ; DOUT load capacitance 30pF
DOUT Conversion Time tTHL10 ns typ; DOUT load capacitance 30pF
OUT RGB Rise Time500 ns typ; IOUTR/G/B=5mA, OUTR/G/B port with 200 ohm resistor to VDD, load capacitance 30pF
OUT RGB Fall Time500 ns typ; IOUTR/G/B=5mA, OUTR/G/B port with 200 ohm resistor to VDD, load capacitance 30pF
Data Structure24 bit; high order first, GRB order
Input 0 Code High-Level Time0.3 us min; signal transmission definition
Input 1 Code High-Level Time0.9 us min; signal transmission definition
Input 0 Code Low-Level Time0.9 us min; signal transmission definition
Input 1 Code Low-Level Time0.3 us min; signal transmission definition
0/1 Code Cycle1.2 us min; signal transmission definition
Reset Code Low-Level Time>200 us; signal transmission definition
Data Low-Level Time Limit<20 us; 0-code and 1-code low-level time when programming
Pin 1 FunctionDO, display data cascade output; pin function table
Pin 2 FunctionGND, signal ground and power ground; pin function table
Pin 3 FunctionDI, display data input; pin function table
Pin 4 FunctionVDD, internal IC power positive and RGB positive; pin function table
Outline Dimension Tolerance±0.1 mm; unless otherwise noted
Carrier Tape Dimension Tolerance±0.25 mm; unless otherwise noted
Room Temperature Life Test1000 hrs, 22 samples, 0 failures; Ta=25°C±5°C, IF=5mA, JIS7021:B4
High Temperature Storage Test1000 hrs, 22 samples, 0 failures; Ta=85°C±5°C, JIS7021:B10, MIL-STD-202:210A, MIL-STD-750:2031
Low Temperature Storage Test1000 hrs, 22 samples, 0 failures; Ta=-35°C±5°C, JIS7021:B12
High Temperature Humidity Test1000 hrs, 22 samples, 0 failures; Ta=85°C±5°C, RH=85%, JIS7021:B11, MIL-STD-202:103D
Cold/Heat Strike Test100 cycles, 22 samples, 0 failures; -10°C±5°C to 100°C±5°C, JIS7021:B4, MIL-STD-202:107D, MIL-STD-750:1026
Cold and Heat Cycle Test100 cycles, 22 samples, 0 failures; -35°C to 25°C to 85°C to -35°C, JIS7021:A3, MIL-STD-202:107D, MIL-STD-705:105E
Reliability Criterion Forward Voltagemax initial data x 1.1; IF=5mA
Reliability Criterion Reverse Current1 uA max; VR=5V
Reliability Criterion Luminous Intensitymin initial data x 0.7; IF=5mA
Hand Soldering Iron Power<30 W; manual soldering for repair/rework
Hand Soldering Temperature<300 °C; each terminal once only
Hand Soldering Duration<3 s; each terminal once only
Reflow Soldering CountMaximum 2 times; interval between secondary reflow soldering within 8 hours
Recommended Maximum Reflow Temperature240±5 °C for 6 s; product recommended maximum welding temperature
Cleaning ConditionAlcohol cleaning under 30°C for 3 min or under 50°C for 30 s; after soldering
Ultrasonic Cleaning Power<=300 W; pretest required to confirm no LED damage
Unopened Shelf Life3 months; sealed moisture-proof anti-static bag with desiccant
Pre-Opening Storage<=30°C, <=60% RH; before opening package
Post-Opening Storage<=30°C, <=40% RH, solder within 24 hours; after opening package
Recommended Workshop Condition<=30°C, <=60% RH; product operation environment
Baking Condition60±5°C for 24 hours; if desiccant/package failed or storage time exceeded
Recommended Signal Protection Resistor20 ohm to 2 kohm, typically around 500 ohm; series resistor at signal input/output terminals; value depends on cascade count and distance
Datasheet Statusrequest_only

Product Overview

The XL-0807RGBC-WS2812B-S is a XINGLIGHT addressable RGB LED integrating RGB emitters with single-line cascade data handling. Its 0807 SMD body has 2.0 x 1.8 x 0.8 mm outline dimensions, transparent colloid RGB emission, and a pinout with DO, GND, DI, and VDD connections for cascaded display data input and output.

Key Features

  • 0807 SMD package, 2.0 x 1.8 x 0.8 mm
  • RGB transparent colloid luminous color
  • Single-line cascade data transmission at 800 Kbps
  • 24-bit high-order-first GRB data structure
  • 256-level grayscale with PWM output control
  • 5 mA/channel preset constant-current mode
  • 4.5 kHz typical output PWM frequency
  • 3.5-5.5 V chip power supply range
  • 120 degree typical half-intensity viewing angle
  • MSL 5 moisture sensitivity level

Typical Applications

  • Cascaded RGB LED pixels
  • Compact display modules
  • Addressable indicator lighting
  • RGB status displays
  • Decorative LED arrays
  • Microcontroller-driven lighting strings
  • Small-format animated signage

Procurement Notes

When requesting a quote for XL-0807RGBC-WS2812B-S, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package does XL-0807RGBC-WS2812B-S use?

XL-0807RGBC-WS2812B-S uses an 0807 SMD package with outline dimensions of 2.0 x 1.8 x 0.8 mm. The datasheet lists an outline dimension tolerance of ±0.1 mm unless otherwise noted.

What data format is used by this addressable RGB LED?

The device uses a 24-bit data structure, transmitted high order first in GRB order. The signal definition lists 0/1 code timing with a 1.2 us minimum cycle and a reset low-level time greater than 200 us.

What supply and current values are specified?

The chip power supply voltage is specified as 3.5-5.5 V at Ta=25°C. The OUT RGB output current is 5 mA typical at VDD=5V and VDS=1V, matching the 5 mA/channel preset constant-current mode.

What soldering limits are listed for assembly?

The datasheet lists an absolute maximum soldering temperature of 260°C for 6 s. Recommended maximum reflow temperature is 240±5°C for 6 s, with a maximum of two reflow cycles and an 8-hour interval condition for secondary reflow.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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