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XL-0807RGBC-WS2812B-S: SMD LED for High-Density RGB Cascading

The XL-0807RGBC-WS2812B-S is a miniature 0807 SMD LED with integrated WS2812B control IC. This datasheet provides critical specifications for designers evaluating RGB LEDs for signage, displays, and decorative lightin...

XL-0807RGBC-WS2812B-S: SMD LED for High-Density RGB Cascading

📌 Product Overview

The XL-0807RGBC-WS2812B-S is a surface-mountable RGB LED with an integrated single-wire control IC. Designed for high-density applications, its compact 2.0x1.8x0.8mm footprint is ideal for space-constrained designs. The device is engineered for full-color luminous displays, featuring precise color binning and a transparent colloid for optimal light output. Its core design focus is on simplifying integration for automated SMT assembly while ensuring uniform brightness and color consistency across cascaded modules.

🚀 Typical Applications

  • LED full-color luminous word lamp strings
  • RGB LED display modules
  • Flexible and rigid light strips, guardrail tubes
  • Architectural and scene lighting
  • Custom-shaped LED screens
  • Electronic equipment running lights (marquee effects)

🔑 Key Technical Specifications

ParameterSymbolMinTypMaxUnitTest Condition
Light IntensityIV-80/280/60-mcdIF=5mA (R/G/B)
Main WavelengthλD620/520/460-630/530/475nmIF=5mA (R/G/B)
Half Intensity Angle2θ1/2-120-Deg-
Output CurrentLout-5-mAVDD=5V, VDS=1V
PWM FrequencyFpwm-4.5-KHzIout=5mA

⚠️ Absolute Maximum Ratings & Process Limits

ParameterSymbolValueUnit
Supply VoltageVDD3.5 - 5.5V
Logic Input VoltageVDI-0.5 ~ VDD+5.5V
Operating TemperatureTopr-40 ~ +85°C
Reflow Solder TempTsol260 (6 sec)°C
ESD SensitivityESD3000V HBM

📦 Package, Dimensions & Assembly Notes

The XL-0807RGBC-WS2812B-S is supplied in EIA standard packaging suitable for SMT automated production. Its outline dimensions are 2.0x1.8x0.8mm (L/W/H). The device has a Moisture Sensitivity Level (MSL) of 5 and is compatible with infrared reflow soldering processes. Assembly must adhere to the provided soldering guidelines to prevent damage to the integrated control IC and LED chips.

📈 Sourcing & Supply Considerations

  • Ensure supply chain partners offer authentic, ROHS-compliant components.
  • Verify sample availability for initial design validation and color testing.
  • Confirm lead-time and MOQ for mass production to support project timelines.
  • Request detailed binning data for critical color consistency in large-scale deployments.

❓ FAQ

Q: What is the primary benefit of the integrated WS2812B IC?
A: The integrated IC enables single-wire data control, allowing for individual addressability of each LED and simplified cascading of thousands of LEDs with minimal wiring.

Q: How does the 0807 package size impact design?
A: The ultra-compact 0807 (2.0x1.8mm) footprint allows for extremely high pixel density, making it ideal for fine-pitch displays and intricate lighting designs where space is a critical constraint.

Q: What is the significance of the LED chips being "pre-optical processed"?
A: Pre-binning ensures high color and brightness uniformity across all LEDs in a production batch, which is essential for creating visually consistent and high-quality display panels.

Q: Can this LED be used in outdoor applications?
A: While the LED itself has a wide operating temperature (-40°C to +85°C), its suitability for outdoor use depends on the overall design of the module or fixture, including the IP rating of the housing and driver circuit protection.

Q: What is the recommended data transmission frequency?
A: The device supports a data transmission frequency of 800Kbps, enabling refresh rates of 30fps for displays with up to 1024 LEDs in a single data chain.

About Leon Zhang

Founder and Strategic Sourcing Lead, LDeepAI

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

Expertise: electronic component sourcing, China supply-chain verification, LED components, memory and storage sourcing, RFQ risk screening.

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