📌 Product Overview
The XL-1005UBC is a miniature 0402 (1.0x0.5x0.4mm) surface-mount LED, emitting a blue light from a colorless transparent package. Designed for high-density applications, its primary focus is on seamless integration into automated SMT assembly and reflow soldering processes. This component is engineered for reliability in demanding environments, making it suitable for applications where space and manufacturing efficiency are critical.
🎯 Typical Applications
- Automotive electronics: backlight key lights, indicator lights
- Industrial products: electronic instrument panels, industrial equipment
- Consumer electronics: LED backlights, general indicators
- Communication products: mobile phone button lamps, routers, set-top boxes
- Computer and mobile digital devices
🔬 Key Technical Specifications
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test Condition |
|---|---|---|---|---|---|---|
| Luminous Intensity | Iv | 80 | / | 240 | mcd | IF=20mA |
| Dominant Wavelength | λd | 460 | / | 475 | nm | IF=20mA |
| Peak Wavelength | λp | / | 465 | / | nm | IF=20mA |
| Forward Voltage | VF | 2.6 | / | 3.4 | V | IF=20mA |
| Viewing Angle | 2Ø1/2 | / | 120° | / | deg | IF=20mA |
⚠️ Absolute Maximum Ratings & Process Limits
Electrical and thermal parameters must not be exceeded to ensure device integrity. The device is rated for a maximum continuous forward current (IF) of 20 mA and a peak pulse current (IFP) of 80 mA (≤0.1ms pulse width, ≤1/10 duty cycle). The operating and storage temperature range is -40°C to +85°C. For assembly, the lead soldering temperature is 260°C for a maximum of 6 seconds. The MSL is 3.
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Max. Continuous Forward Current | IF | 20 | mA |
| Peak Forward Current | IFP | 80 | mA |
| Operating Temperature Range | TOPR | -40 ~ +85 | °C |
| Moisture Sensitivity Level | MSL | 3 | - |
| Lead Soldering Temp/Time | TSOL | 260℃≤6S | - |
📦 Package, Dimensions & Assembly Notes
The XL-1005UBC is packaged in standard EIA-compliant tape and reel, suitable for automated SMT placement. Its outline dimensions are 1.0mm (L) x 0.5mm (W) x 0.40mm (H). The device is compliant with RoHS standards. For reliable soldering, it is recommended to follow standard reflow profiles. The IR-reflow process must adhere to specific temperature profiles, with a maximum peak temperature of 235°C for leaded processes and 255°C for lead-free processes.
🚀 Sourcing & Supply Considerations
- Parameter Binning: The XL-1005UBC is available in brightness (D2-D6), voltage (M18-8 to M19-6), and wavelength (HB04-HB06) grades to meet specific application requirements.
- Supply Chain: For volume orders, lead times, and minimum order quantities (MOQs), please contact our sales team for direct support.
- Verification: Always verify component authenticity and specifications through authorized XINGLIGHT distributors to ensure quality and reliability.
❓ FAQ
Q: What are the brightness options for the XL-1005UBC?
A: The LED is graded into six brightness bins (D2-D6), ranging from 80 mcd to 240 mcd at 20mA, with a brightness error tolerance of ±10%.
Q: Is the XL-1005UBC suitable for lead-free soldering processes?
A: Yes, it is suitable for lead-free reflow processes. The peak temperature must not exceed 255°C, with a dwell time of 5-10 seconds, following the J-STD-020C standard.
Q: What is the Moisture Sensitivity Level (MSL) for this component?
A: The MSL is 3, which means it requires specific handling and baking procedures before SMT assembly if exposed to ambient conditions for an extended period.
Q: Can the XL-1005UBC be used in automotive applications?
A: Yes, its robust specifications and reliability make it suitable for automotive applications like backlight keys and indicator lights, provided it is used within its absolute maximum ratings.
