Specifications
| Type | Description |
|---|---|
| Part Number | XL-0807RGB-MS |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD, 2.0 x 1.8 x 0.8 mm |
| Outline Dimensions | 2.0 x 1.8 x 0.8 mm; L/W/H |
| Luminous Color | RGB flashing; transparent/water-clear colloid |
| Moisture Sensitivity Level | MSL 3; storage/assembly handling |
| RoHS Compliance | Complies with RoHS Directive; environmental protection process |
| Maximum Power Dissipation - Red | 50 mW; Ta=25°C |
| Maximum Power Dissipation - Green | 70 mW; Ta=25°C |
| Maximum Power Dissipation - Blue | 70 mW; Ta=25°C |
| Maximum Continuous Forward Current - Red | 20 mA; Ta=25°C |
| Maximum Continuous Forward Current - Green | 20 mA; Ta=25°C |
| Maximum Continuous Forward Current - Blue | 20 mA; Ta=25°C |
| Peak Forward Current - Red | 80 mA; Ta=25°C, pulse width <=0.1 ms, duty <=1/10 |
| Peak Forward Current - Green | 80 mA; Ta=25°C, pulse width <=0.1 ms, duty <=1/10 |
| Peak Forward Current - Blue | 80 mA; Ta=25°C, pulse width <=0.1 ms, duty <=1/10 |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Withstand Voltage | 2000 V; Ta=25°C |
| Operating Temperature Range | -40 to +85°C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85°C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature/Time | 260°C <=6 s; Ta=25°C absolute maximum rating table |
| Working Voltage | Min 3.0 V, Max 4.5 V; Ta=25°C |
| Luminous Intensity - Red | Typ 130 mcd; IF=20 mA, Ta=25°C |
| Luminous Intensity - Green | Typ 750 mcd; IF=20 mA, Ta=25°C |
| Luminous Intensity - Blue | Typ 200 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength - Red | Typ 620 nm; IF=20 mA, Ta=25°C |
| Dominant Wavelength - Green | Typ 515 nm; IF=20 mA, Ta=25°C |
| Dominant Wavelength - Blue | Typ 465 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength - Red | Typ 625 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength - Green | Typ 532 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength - Blue | Typ 470 nm; IF=20 mA, Ta=25°C |
| Half Wave Width - Red | Typ 20 nm; IF=20 mA, Ta=25°C |
| Half Wave Width - Green | Typ 30 nm; IF=20 mA, Ta=25°C |
| Half Wave Width - Blue | Typ 25 nm; IF=20 mA, Ta=25°C |
| Reverse Current | Max 5 µA; VR=5 V, Ta=25°C |
| Half-Light Viewing Angle | Typ 120 deg; IF=20 mA, Ta=25°C |
| Flicker Period | Typ 35 s; IF=20 mA, Ta=25°C |
| General Test Ambient Temperature | 25 ±5°C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature and High Humidity Storage Test | 240 hours ±2 hours; IR reflow in-board 2 times, Ta=85±5°C, RH=90-95% |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100±5°C for 20 min, -40±5°C for 20 min |
| Anti-Tin Test | 260±5°C for 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C for 10-15 s; heat-up <=3°C/s from 183°C to peak; 125±25°C <=120 s; above 183°C for 60-150 s; cooling <=6°C/s |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C for 5-10 s; heat-up <=3°C/s from 217°C to peak; 175±25°C <=180 s; above 217°C for 60-120 s; cooling <=6°C/s |
| Weldability Test | Tin loading rate >=95% pad area; soldering temperature 235±5°C, immersion speed 25±2.5 mm/s, immersion time 2±0.5 s |
| Outline Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm; belt and disk dimensions, dimensions in mm |
| Hand Soldering Iron Power | <30 W; manual soldering for repair/rework only |
| Hand Soldering Temperature/Time | <300°C, <3 s per terminal, one time only; manual soldering |
| Maximum Reflow Count | 2 times; reflow soldering |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; product recommendation after soldering guideline |
| Cleaning With Alcohol | <=30°C for 3 min or <=50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest required before ultrasonic cleaning |
| Unopened Storage Condition | <=30°C, <=60%RH, use within 1 year; before opening moisture-proof anti-static package |
| Opened Storage Condition | <=30°C, <=40%RH, solder within 168 hours (7 days); after opening package |
| Recommended Workshop Condition | <=30°C, <=60%RH; operation/workshop handling |
| Baking Condition | 60±5°C for 24 hours; if moisture absorbent material faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
The XINGLIGHT XL-0807RGB-MS is an RGB flashing SMD LED supplied in a compact 2.0 x 1.8 x 0.8 mm surface-mount package. The luminous color is specified as RGB flashing with a transparent/water-clear colloid, supporting compact visual indication designs that need red, green, and blue output from one package.
Electrical ratings at Ta=25°C include 20 mA maximum continuous forward current per red, green, and blue channel, 80 mA peak forward current per channel under pulse width <=0.1 ms and duty <=1/10, and 5 V maximum reverse voltage. The working voltage range is 3.0 V minimum to 4.5 V maximum. Typical optical values at IF=20 mA include 620 nm red, 515 nm green, and 465 nm blue dominant wavelengths, with a typical 120 degree viewing angle.
Assembly information includes MSL 3 storage and handling, a maximum reflow count of 2 times, and lead-free reflow peak temperature of 255°C +0/-5°C for 5-10 s. Opened packages should be soldered within 168 hours at <=30°C and <=40%RH.
Key Features
- RGB flashing output in transparent water-clear colloid
- 2.0 x 1.8 x 0.8 mm SMD package
- 3.0 V to 4.5 V working voltage range
- 20 mA continuous forward current per RGB channel
- Typical 120 degree half-light viewing angle
- Typical 35 s flicker period at 20 mA
- MSL 3 storage and assembly handling classification
- RoHS Directive compliant environmental protection process
- Lead-free reflow peak 255°C for 5-10 s
- Opened package soldering window is 168 hours
Typical Applications
- RGB flashing status indicators
- Compact SMD visual alerts
- Panel indication lighting
- Consumer device indicators
- Electronic assembly signal lights
- Reflow-assembled indicator boards
- Moisture-controlled LED production
Procurement Notes
When requesting a quote for XL-0807RGB-MS, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package size does XL-0807RGB-MS use?
XL-0807RGB-MS uses an SMD package with outline dimensions of 2.0 x 1.8 x 0.8 mm. The datasheet also lists an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main electrical ratings at 25°C?
At Ta=25°C, each red, green, and blue channel is rated for 20 mA maximum continuous forward current and 80 mA peak forward current with pulse width <=0.1 ms and duty <=1/10. Maximum reverse voltage is 5 V.
What optical output values are specified for each color?
At IF=20 mA and Ta=25°C, typical luminous intensity is 130 mcd red, 750 mcd green, and 200 mcd blue. Dominant wavelengths are typically 620 nm red, 515 nm green, and 465 nm blue.
What soldering limits apply to this SMD LED?
The datasheet specifies a maximum reflow count of 2 times. Lead-free reflow peak temperature is 255°C +0/-5°C for 5-10 s, while manual soldering is limited to <300°C for <3 s per terminal, one time only.
How should opened packages be stored before soldering?
After opening the moisture-proof anti-static package, storage should be <=30°C and <=40%RH, and the LEDs should be soldered within 168 hours, or 7 days. Recommended workshop conditions are <=30°C and <=60%RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.