📌 Product Overview
💡 The 1.8x6.0mm Flip Chip LED represents a high-density lighting solution engineered for demanding environments where space and thermal efficiency are critical. Utilizing advanced Flip Chip technology, this component minimizes thermal resistance while offering a luminous flux range of 800 to 1200 lumens at 700mA.
👇 This device is specifically structured for high-reliability sectors. It operates as a cool beam light source with a wide viewing angle of 120 degrees, making it suitable for integration into compact automotive assemblies and industrial fixtures requiring consistent white light output within the 5500K–7000K color temperature range.
🔦 Typical Applications
Based on the absolute maximum ratings and thermal characteristics, this LED is optimized for the following scenarios:
- Automotive Lighting: Exterior and interior illumination systems requiring high vibration resistance and stability.
- Electric Motorcycle Lighting: Headlamps and signal indicators demanding high luminous intensity in a compact form factor.
- Industrial & Commercial Fixtures: High-bay lighting and task lamps where thermal management is a primary design constraint.
- General Exterior Lighting: Applications exposed to harsh environmental conditions, validated by its operating range of -40°C to +135°C.
⚡ Key Technical Specifications
🔒 The following table outlines the electro-optical performance under standard test conditions (Ta=25°C). Designers must account for the forward voltage variance when configuring constant current drivers.
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Forward Voltage | Vf | IF = 700mA | 8.7 | - | 9.6 | V |
| Luminous Flux | Φ | IF = 700mA | 800 | - | 1200 | lm |
| Color Temperature | Tc | IF = 700mA | 5500 | - | 7000 | K |
| Viewing Angle | 2θ1/2 | IF = 700mA | - | 120 | - | Deg |
| Junction Temp | Tj | IF = 700mA | - | - | 145 | °C |
| Thermal Resistance | Rth(j-s) | IF = 700mA | - | - | 3-5 | °C/W |
⚠️ Absolute Maximum Ratings & Process Limits
🚨 Exceeding these parameters may result in permanent device failure. Note that the Forward Current (IF) of 1000mA is the absolute maximum; typical operation is recommended at 700mA to ensure longevity.
| Parameter | Symbol | Max Rating | Unit | Notes |
|---|---|---|---|---|
| Power Dissipation | Pd | 10 | W | Dependent on heatsink |
| Forward Current | If | 1000 | mA | Continuous operation |
| Pulse Forward Current | Ifp | 1500 | mA | 1/10 duty cycle, 0.1ms pulse |
| Operating Temp | Topr | -40 to +135 | °C | Case temperature dependent |
| Storage Temp | Tstg | -40 to +85 | °C | |
| Soldering Temp | Tsld | 260 | °C | Reflow: 6 seconds max |
📦 Package, Dimensions & Assembly Notes
🏗️ The component features a compact footprint with an appearance dimension of 1.8mm (W) x 6.0mm (L) x 0.7mm (H).
- Moisture Sensitivity: The LED is classified as MSL 3. Components must be baked and mounted according to J-STD-033 standards to prevent popcorning during reflow.
- Soldering Profile: For the Lead-Free Process, the peak temperature must not exceed 255°C (with a tolerance of +0/-5°C). The time above 217°C should be strictly controlled between 60 to 120 seconds.
- ESD Protection: The device has an ESD withstand voltage of 2000V (HBM). Proper grounding protocols are required during handling.
🏭 Sourcing & Supply Considerations
✅ To ensure yield rates in mass production, procurement teams should verify the specific bin codes (Brightness N3-N6, Voltage S13-3 to S13-5) required for the BOM.
- Binning Consistency: Verify color temperature (UW7-10 to UW11-10) and flux bins to maintain uniformity across batches.
- Cross-Reference: Confirm the "Cool beam" and "Yellow fog" colloid specifications match existing optical designs.
- Authenticity: Source through verified channels to ensure ROHS compliance and Flip Chip technology integrity.
❓ Frequently Asked Questions
Q: What is the recommended drive current for this LED to balance lifespan and brightness?
A: While the Absolute Maximum Rating is 1000mA, the typical parameters are measured at 700mA. For optimal thermal management and lifespan, driving the LED at 700mA is recommended, utilizing a heatsink to keep the junction temperature below 145°C.
Q: Can this LED be used in high-temperature automotive environments?
A: Yes, the component is rated for an operating temperature range of -40°C to +135°C. However, the junction temperature (Tj) must not exceed 145°C, which requires careful thermal design at the upper ambient limits.
Q: What are the storage requirements before assembly?
A: The LED has a Moisture Sensitivity Level (MSL) of 3. If the packaging is opened, the components should be soldered within 168 hours (floor life) or baked according to IPC/JEDEC J-STD-033 standards to prevent moisture-induced damage during reflow.
Q: How does the Flip Chip technology benefit this design?
A: The Flip Chip process allows for a lower thermal resistance (3-5°C/W) compared to traditional wire-bonded LEDs. This structure enables better heat dissipation from the junction to the solder pad, which is critical for high-power applications in compact spaces like automotive lighting.
Q: What is the tolerance for Luminous Flux?
A: The datasheet indicates a radiant flux measurement tolerance of ±10%. When sourcing, refer to the brightness grading codes (N3 through N6) to select the specific lumen output range required for your application.
