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XL-1010SURSYGC SMD LED: Specifying for SMT & Backlight Designs

The XL-1010SURSYGC is a compact 1.0x1.0x0.4mm SMD LED available in red and green. This datasheet provides detailed specifications to support engineering evaluation, design validation, and mass production planning. It ...

XL-1010SURSYGC SMD LED: Specifying for SMT & Backlight Designs

📌 Product Overview

The XL-1010SURSYGC is a surface-mount LED from XINGLIGHT, featuring a miniature footprint ideal for space-constrained designs. This dual-color (Red/Green) device with a transparent colloid is engineered for high-volume manufacturing, specifically compatible with SMT assembly and infrared reflow processes. Its primary focus is on providing reliable visual indicators and backlighting in modern electronic products.

🔍 Typical Applications

  • Backlight displays for consumer electronics
  • Status indicators in household appliances
  • Instrument panels in automotive applications
  • Visual feedback in Bluetooth audio equipment
  • Decorative elements in lighting fixtures
  • Integration in smart home devices

📊 Key Technical Specifications

ParameterSymbolRedGreenUnitTest Condition
Luminous IntensityIV80 / 21050 / 80mcdIF=20mA
Dominant WavelengthλD615 / 630565 / 575nmIF=20mA
Forward VoltageVF1.9 / 2.31.9 / 2.3VIF=20mA
Half Intensity Angle2θ1/2/ 120 // 120 /degIF=20mA

⚠️ Absolute Maximum Ratings & Process Limits

ParameterSymbolValueUnit
Max Power DissipationPD50mW
Max Continuous Forward CurrentIF20mA
Max Peak Forward CurrentIFP60mA
Max Reverse VoltageVR5V
Operating TemperatureTOPR-40 to +85°C
Lead Soldering Temp/TimeTSOL260℃ / ≤6s/

📦 Package, Dimensions & Assembly Notes

The XL-1010SURSYGC utilizes an ultra-compact package measuring 1.0x1.0x0.4mm (L/W/H). It is classified as MSL 3 and is suitable for SMT automated production. The device is compliant with EIA standard packaging and designed for compatibility with infrared reflow soldering, ensuring robust performance in standard manufacturing environments.

🚀 Sourcing & Supply Considerations

  • Sample Support: Request samples to validate optical and electrical binning requirements for your specific application.
  • Volume Production: Confirm lead-times and minimum order quantities for mass production quantities.
  • Supply Chain: Verify distribution channels to ensure authenticity and avoid counterfeit components.
  • Alternatives: Consider cross-referencing with similar models for BOM optimization or risk mitigation.

❓ FAQ

Q: What is the moisture sensitivity level (MSL) for the XL-1010SURSYGC?
A: The device has a Moisture Sensitivity Level (MSL) of 3, requiring careful handling and baking procedures before soldering if exposed to ambient conditions for an extended period.

Q: What is the recommended soldering profile for this LED?
A: The XL-1010SURSYGC is suitable for infrared reflow processes. For lead-free soldering, the peak temperature should not exceed 255°C, with a dwell time of 5-10 seconds. For leaded processes, the peak temperature is 235°C with a 10-15 second dwell.

Q: How is the brightness graded for the red version of this LED?
A: The red LED's luminous intensity is graded into five bins (D1-D5) at IF=20mA, ranging from a minimum of 50 mcd (D1) to a maximum of 210 mcd (D5), with a typical brightness of 210 mcd.

Q: Can this LED be used in high-temperature automotive environments?
A: While the operating temperature range is -40°C to +85°C, use in automotive applications requires careful evaluation against specific AEC-Q102 or other relevant automotive reliability standards, as this datasheet does not explicitly state AEC compliance.

About Leon Zhang

Founder and Strategic Sourcing Lead, LDeepAI

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

Expertise: electronic component sourcing, China supply-chain verification, LED components, memory and storage sourcing, RFQ risk screening.

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