📌 Product Overview
The XL-1608SYGC-04 is a surface-mount LED in the compact 0603 package (1.6x0.8x0.4mm). Its yellow-green luminous color and transparent epoxy colloid make it suitable for applications requiring status indication and backlighting in space-constrained environments. This component is engineered for seamless integration into automated SMT assembly processes, with a focus on reliability in demanding industrial and consumer electronics.
📌 Typical Applications
- Medical Equipment: Endoscopes, oximeters
- Automotive Electronics: Backlight key lights, indicator lights
- Industrial Products: Electronic instrument panels, industrial equipment
- Smart Home: White appliances, nixie tube LEDs
- Communication Products: Mobile phone button lamps, routers, TV boxes
📌 Key Technical Specifications
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test Conditions |
|---|---|---|---|---|---|---|
| Luminous Intensity | Iv | 50 | / | 120 | mcd | IF=20mA |
| Dominant Wavelength | λd | 565 | / | 575 | nm | IF=20mA |
| Forward Voltage | VF | 1.8 | / | 2.4 | V | IF=20mA |
| Viewing Angle | 2Ø1/2 | / | 120° | / | deg | IF=20mA |
📌 Absolute Maximum Ratings & Process Limits
Electrical and thermal parameters that must not be exceeded under any operating condition. Exceeding these values may cause permanent damage to the device. These ratings are critical for ensuring long-term reliability and preventing field failures.
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Max. Continuous Forward Current | IF | 20 | mA |
| Max. Peak Forward Current | IFP | 80 | mA |
| Max. Reverse Voltage | VR | 5 | V |
| Operating Temperature Range | TOPR | -40 ~ +85 | °C |
| Lead Soldering Temperature/Time | TSOL | 260℃ / ≤6s | / |
📌 Package, Dimensions & Assembly Notes
The XL-1608SYGC-04 is packaged in a standard 0603 (0603 metric) SMD package with dimensions of 1.6x0.8x0.4mm. It is compliant with EIA standard packaging and suitable for automated SMT placement. The device is designed for compatibility with infrared reflow soldering processes. Its Moisture Sensitivity Level (MSL) is 3, requiring standard baking and handling procedures before soldering to prevent pop-corning defects.
📌 Sourcing & Supply Considerations
- Binning & Consistency: The product is graded for brightness (D1, D2) and forward voltage (M17-9 to M18-5), ensuring parameter consistency for mass production.
- Supply Chain: RoHS compliant and packaged to EIA standards for reliable supply chain logistics.
- Verification: Ensure components are sourced from authorized distributors to guarantee authenticity and adherence to datasheet specifications.
📌 FAQ
Q: What is the Moisture Sensitivity Level (MSL) for the XL-1608SYGC-04?
A: The MSL is 3. This requires components to be baked if exposed to ambient conditions for more than 72 hours before reflow soldering to prevent moisture-induced damage.
Q: Is the XL-1608SYGC-04 suitable for automotive applications?
A: While it is used in automotive electronics like backlight indicators, designers must independently verify its compliance with specific automotive standards (e.g., AEC-Q102) for their particular application.
Q: What is the recommended soldering profile for this LED?
A: The device is suitable for infrared reflow soldering. The peak temperature should not exceed 260°C, and the time above liquidus (TAL) should be within specified limits, typically ≤10 seconds at 235°C, as per J-STD-020C.
Q: Can I use this LED for pulse drive applications?
A: Yes, the maximum peak forward current (IFP) is 80 mA for pulses with a width ≤0.1ms and a duty cycle ≤1/10. This is useful for achieving higher brightness without exceeding the continuous current rating.
