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XL-2835UGC-05 SMD LED — Technical Specifications & Design Guide

LED Technology · 2026-03-09

XL-2835UGC-05 SMD LED — Technical Specifications & Design Guide

📌 Product Overview

The XL-2835UGC-05 is a high-efficiency surface-mount device (SMD) LED from XINGLIGHT, housed in a compact 2.8mm x 3.5mm x 0.8mm package. It features a transparent water-clear colloid optimized for green light emission with a dominant wavelength range of 510nm to 530nm. 💡 This component is specifically engineered for high-density lighting arrays where board space and thermal management are critical constraints.

While the primary application is general illumination, the real design focus lies in balancing the 150mA drive current against the 500mW power dissipation limit. 🔒 Engineers must ensure proper thermal PCB design to maintain luminous flux and reliability, particularly in high-ambient environments.

🚀 Typical Applications

Based on its optical characteristics and robust thermal ratings, the XL-2835UGC-05 is suitable for a wide range of commercial and consumer lighting products.

  • Indoor Lighting: Ideal for LED tubes, light strips, and downlights where consistent color rendering is required.
  • Commercial Signage: High-intensity output makes it perfect for advertising words and light boxes.
  • Backlighting: Suitable for LCD backlighting in displays and indicator panels.
  • Decorative Lighting: 📈 Flexible strip lighting that requires a compact footprint and high reliability.

📊 Key Technical Specifications

The following optical and electrical parameters are measured under standard test conditions (Ta=25°C, IF=150mA).

ParameterSymbolMin.Typ.Max.UnitNotes
Luminous FluxΦ334052LMIF=150mA
Dominant Wavelengthλd510-530nmGreen
Peak Wavelengthλp-525-nmIF=150mA
Forward VoltageVF2.8-3.4VIF=150mA
Viewing Angle2Ø1/2-120-deg
Reverse CurrentIR--≤5μAVR=5V

⚠️ Absolute Maximum Ratings & Process Limits

Exceeding these ratings may cause permanent device failure or significant degradation in optical performance. These limits are critical for designing robust protection circuits.

ParameterSymbolMax. ValueUnitConditions
Max Power DissipationPD500mWTa=25°C
Max Continuous Forward CurrentIF150mA
Peak Forward CurrentIFP300mAPulse width ≤0.1ms
Max Reverse VoltageVR5V
ESD ToleranceESD2000VHuman Body Model
Operating TemperatureTOPR-40 ~ +85°C
Storage TemperatureTSTR-40 ~ +85°C

⚠️ Note: Soldering temperature must not exceed 260°C for longer than 6 seconds to prevent package damage.

📦 Package, Dimensions & Assembly Notes

The XL-2835UGC-05 utilizes the industry-standard 2835 footprint, making it compatible with automated SMT assembly lines.

  • Dimensions: The outline measures 2.8mm (L) x 3.5mm (W) x 0.8mm (H). ✨ This low profile allows for sleek luminaire designs.
  • Soldering: Designed for infrared reflow soldering processes. For lead-free processes, peak body temperature should be controlled (max 255°C) with specific time profiles above 217°C (60-120s).
  • MSL Level: The component is rated at Moisture Sensitivity Level (MSL) 3. Floor life is 168 hours; bake before use if exposed beyond this limit to prevent "popcorning" during reflow.

🛒 Sourcing & Supply Considerations

When integrating the XL-2835UGC-05 into mass production, supply chain consistency is as vital as technical performance.

  • Bin Selection: The product is sorted by Brightness (J4-J6), Voltage (N13-3 to N13-5), and Wavelength (HG01-HG04). ✨ Verify specific bin codes with your supplier to ensure color consistency.
  • Authenticity: Source exclusively from authorized XINGLIGHT channels to avoid counterfeits that may not meet the 2000V ESD rating or ROHS compliance.
  • Sampling: Always request samples from the specific production batch for validation before full-scale procurement.

❓ Frequently Asked Questions

Q: What is the recommended footprint for PCB layout? A: The footprint should follow the standard 2835 EIA package dimensions. Ensure thermal pads are connected to adequate copper areas to dissipate the 500mW max power efficiently.

Q: Can this LED be driven at 150mA continuously? A: Yes, the datasheet specifies 150mA as the Max Continuous Forward Current. However, adequate heat sinking is required to keep the junction temperature within the -40°C to +85°C operating range.

Q: What does the "Water-clear colloid" indicate? A: This refers to the transparent encapsulation resin used. It typically offers higher light transmission efficiency compared to diffused options, resulting in higher luminous intensity.

Q: How should I handle components that have exceeded the MSL 3 floor life? A: If the components have been exposed to the ambient environment for more than 168 hours (MSL 3), they must be baked according to IPC/JEDEC J-STD-033 standards to remove moisture before reflow soldering.

Q: Are there specific bin codes for color consistency? A: Yes, XINGLIGHT provides wavelength binning codes (HG01 through HG04) ranging from 510nm to 530nm. Selecting a single bin code ensures uniform color appearance in the final product.

Q: What is the typical forward voltage range? A: At 150mA, the forward voltage typically ranges between 2.8V and 3.4V. Designers should account for the upper limit (3.4V) when calculating the total number of LEDs per driver string.

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