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XL-2835UYC-02FJ SMD LED — Technical Specifications & Design Guide

The XL-2835UYC-02FJ is a high-performance Yellow SMD LED designed by XINGLIGHT for compact, high-brightness lighting solutions. 💡 Housed in a standard 2835 package (2.8mm x 3.5mm x 0.8mm), it features a water-clear colloid that maximizes light output while maintaining a compact footprint for dense arrays.

XL-2835UYC-02FJ SMD LED — Technical Specifications & Design Guide

📌 Product Overview

The XL-2835UYC-02FJ is a high-performance Yellow SMD LED designed by XINGLIGHT for compact, high-brightness lighting solutions. 💡 Housed in a standard 2835 package (2.8mm x 3.5mm x 0.8mm), it features a water-clear colloid that maximizes light output while maintaining a compact footprint for dense arrays.

Target applications primarily include indoor lighting, commercial signage, and LCD backlights. However, the real design focus lies in its thermal management. With a power dissipation of up to 200mW at 60mA drive current, engineers must carefully evaluate the 120° viewing angle and forward voltage characteristics to prevent luminous depreciation in sealed fixtures.

🚀 Typical Applications

Based on its dominant wavelength (585-595nm) and high luminous intensity (1450-1800 mcd), this component is ideal for environments requiring warm, high-contrast visibility.

  • Commercial Lighting: 📈 High-intensity advertising words and light boxes where the yellow color cuts through ambient light effectively.
  • Decorative Lighting: Flexible light strips that benefit from the low 0.8mm profile and 120° wide beam angle for even mixing.
  • Indoor Illumination: Downlights and fluorescent tube replacements.
  • Backlighting: LCD indicator lights requiring specific HY03-HY06 wavelength bins for color consistency.

⚡ Key Technical Specifications

The following optical and electrical parameters are measured under standard conditions (Ta=25°C, IF=60mA). Designers should pay close attention to the Voltage Grading and Brightness Grading codes when specifying for mass production to ensure uniformity.

ParameterSymbolMin.Typ.Max.Unit
Luminous IntensityIv1450-1800mcd
Dominant Wavelengthλd585590595nm
Forward VoltageVf1.8-2.4V
Viewing Angle2Ø1/2-120°-deg
Reverse CurrentIr--≤5μA
  • Note: 💡 Bin codes (e.g., N12-7 for Voltage, HY03 for Color) are available for tight sorting.

🔒 Absolute Maximum Ratings & Process Limits

Exceeding these ratings may cause permanent device failure. The limits below define the safety boundaries for both electrical stress and environmental conditions.

ParameterSymbolMax. ValueUnitConditions
Max Power DissipationPd200mWTa=25°C
Max Continuous Forward CurrentIf60mA-
Peak Forward CurrentIfp200mAPulse ≤0.1ms, Duty ≤1/10
Max Reverse VoltageVr5V-
ESD AbilityESD2000VHuman Body Model
Operating TemperatureTopr-40 ~ +85°C-
  • ⚠️ Warning: While the LED can withstand up to 260°C soldering for ≤6S, prolonged operation near the max current requires adequate PCB heat sinking to maintain luminous efficacy.

📦 Package, Dimensions & Assembly Notes

The XL-2835UYC-02FJ utilizes a surface-mount technology (SMT) design optimized for automated assembly.

  • Dimensions: The compact 2.8 x 3.5 x 0.8mm outline allows for high-density placement on rigid or flexible PCBs.
  • Soldering Compatibility: 👇 Suitable for both Lead-free (Max 260°C) and Lead (Max 235°C) infrared reflow processes.
    • Peak Temp: 255°C (Lead-free) / 235°C (Lead).
    • Time above 217°C: 60-120 seconds.
  • Moisture Sensitivity: The component is classified as MSL 3. Ensure proper baking before reflow if the moisture barrier bag has been open for more than 168 hours to prevent "popcorning" damage.

📥 Sourcing & Supply Considerations

To ensure supply chain stability and product authenticity, consider the following procurement strategies:

  • Bin Selection: Always specify the Brightness (F4/F5) and Voltage (N12-7/8/9) bins to avoid color or brightness variation in batches.
  • Sample Verification: Request pre-production samples to verify the CRI (Color Rendering Index) and Vf consistency in your specific driver circuit.
  • Packaging: The product follows EIA standard packaging, compatible with most modern pick-and-place machines.
  • Authenticity: Source exclusively through authorized XINGLIGHT channels or verified distributors to avoid counterfeits that fail to meet the 2000V ESD rating.

❓ FAQ

Q: What is the typical forward voltage for this Yellow LED?
A: The forward voltage ranges from 1.8V to 2.4V when driven at 60mA. Designers should select the appropriate voltage bin (N12-7 to N12-9) to match their driver capabilities.

Q: Can this LED be used in outdoor signages?
A: While it is rated for an operating temperature of -40°C to +85°C, it is primarily designed for indoor use. Outdoor applications require additional waterproofing (IP rating) measures at the module level, as the device itself is not inherently waterproof.

Q: What does the "MSL 3" rating mean for my assembly process?
A: MSL 3 (Moisture Sensitivity Level) means the components must be soldered within 168 hours (1 week) of opening the vacuum-sealed bag. If not used in this time, they must be baked at 80°C for 24 hours to remove absorbed moisture before reflow soldering.

Q: How should I handle the ESD protection for these components?
A: The XL-2835UYC-02FJ has an antistatic ability of 2000V. However, during assembly, standard ESD precautions (wrist straps, grounded mats, and ionizers) are mandatory to prevent latent damage that could reduce lifespan.

Q: What is the recommended footprint for this component?
A: The footprint should accommodate the 2.8mm x 3.5mm body size. Refer to the "Outline Dimensions" section of the datasheet for the specific pad layout recommendations to ensure optimal mechanical strength and heat dissipation.

About Leon Zhang

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

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