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XL-3570 COB LED: Thermal Management & 2000mA Drive Design

The XINGLIGHT XL-3570 is a 3.5x7.0mm Chip-on-Board (COB) LED designed for high-power illumination, capable of handling drive currents up to 2000mA. This technical brief analyzes critical parameters such as forward vol...

XL-3570 COB LED: Thermal Management & 2000mA Drive Design

📌 Product Overview

The XL-3570 from XINGLIGHT is a high-power surface-mounted LED utilizing Flip Chip technology on a compact ceramic substrate. 💡 With package dimensions of 3.5 x 7.0 x 0.7mm, it is engineered to provide dense luminous flux output while maintaining a low thermal resistance profile. This component is specifically designed for applications requiring high-intensity illumination in confined spaces, utilizing a cool beam characteristic to ensure safe contact during operation.

Targeted primarily at the automotive and industrial sectors, the XL-3570 supports a wide operating temperature range from -40°C to +135°C. 👇 The design prioritizes thermal efficiency and luminous consistency, making it suitable for rigorous environments where reliability under high current loads is critical.

🚀 Typical Applications

Based on the XL-3570's robust thermal and electrical ratings, this component is optimized for the following scenarios:

  • Automotive Lighting: Ideal for high-beam headlights, daytime running lights (DRL), and fog light assemblies requiring high lumen density.
  • Electric Motorcycle Lighting: Supports compact headlight designs for e-bikes and electric motorcycles where thermal management is constrained.
  • Industrial & Commercial Fixtures: Suitable for high-bay lights, spotlights, and downlights requiring stable color temperature (5500K–7000K) and high CRI.
  • Exterior/Interior Illumination: Used in architectural lighting and security lighting where wide viewing angles (120°) are beneficial.

⚡ Key Technical Specifications

The following electrical and optical characteristics are measured under standard test conditions (Ta=25°C).

ParameterSymbolTest ConditionMinTypMaxUnit
Luminous FluxΦIF=2000mA2000-2800LM
Forward VoltageVFIF=2000mA8.7-9.6V
Color TemperatureTCIF=2000mA550065007000K
Viewing Angle2θ1/2IF=2000mA-120-Deg
Thermal ResistanceRth-j-sIF=2000mA-3-5-°C/W
Junction TempTJIF=2000mA--145°C

💡 Design Note: The wide forward voltage range requires drivers that can accommodate variance to ensure consistent current regulation across bins.

🔒 Absolute Maximum Ratings & Process Limits

Exceeding these ratings may cause permanent damage to the device. 👇 These limits are critical for designing safety margins into power supply and thermal management systems.

ParameterSymbolAbsolute Maximum RatingUnit
Power DissipationPD30W
Forward CurrentIF2000mA
Pulse Forward CurrentIFP3000A
Operating TemperatureTopr-40 to +135°C
Storage TemperatureTstg-40 to +85°C
Soldering TempTsld260 (Reflow, 3s)°C

⚠️ Thermal Warning: The junction temperature must not exceed 145°C. Proper heatsinking is mandatory to maintain thermal performance under maximum drive conditions.

📦 Package, Dimensions & Assembly Notes

  • Package Type: Flip Chip COB (Chip on Board).
  • Dimensions: 3.5mm (L) x 7.0mm (W) x 0.7mm (H).
  • Colloid Appearance: Available in White or Yellow fog finishes.
  • Moisture Sensitivity: MSL Level 3.
  • Soldering Guidelines: Supports both Lead (235°C peak) and Lead-free (255°C peak) infrared reflow processes.
    • Ramp-up Rate: Max 3°C/sec.
    • Cooling Rate: Max 6°C/sec.
    • Tin Resistance: Withstands 260°C for 10 seconds (2 cycles).

📈 Sourcing & Supply Considerations

  • Binning & Consistency: The datasheet specifies specific codes for Brightness (S3-S6), Voltage (S13-3 to S13-5), and Color Temperature (UW7-10 to UW11-10). Procurement teams must verify bin codes to ensure lot-to-lot consistency.
  • Environmental Compliance: The XL-3570 is ROHS compliant, meeting standard environmental requirements for global distribution.
  • Storage & Handling: As an MSL 3 device, it requires a floor life of less than 168 hours after opening the vacuum seal before baking or reflow soldering.

❓ FAQ

Q: What is the maximum drive current for the XL-3570?
A: The Absolute Maximum Forward Current rating is 2000mA. While pulse currents can reach higher peaks (3000A), continuous operation should not exceed 2000mA to prevent thermal runaway.

Q: What is the thermal resistance of this LED?
A: The thermal resistance from junction to solder point (Rth-j-s) is typically between 3°C/W and 5°C/W. This low resistance is crucial for maintaining junction temperatures below the 145°C limit.

Q: Can this component be used for automotive exterior lighting?
A: Yes, the XL-3570 is specifically listed for automotive lighting applications. It supports a wide operating temperature range (-40°C to +135°C) and utilizes Flip Chip technology for robustness.

Q: What are the soldering profile requirements?
A: The LED supports standard Reflow Soldering. For lead-free processes, the peak temperature should not exceed 255°C (held for 5-10 seconds). The ramp-up speed should be limited to a maximum of 3°C/second.

Q: How is the color temperature sorted?
A: Color temperature is sorted into specific bins: UW7-10 (5500K-6000K), UW9-10 (6000K-6500K), and UW11-10 (6500K-7000K). Designers should specify the required bin when placing orders to ensure color consistency.

About Leon Zhang

Founder and Strategic Sourcing Lead, LDeepAI

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

Expertise: electronic component sourcing, China supply-chain verification, LED components, memory and storage sourcing, RFQ risk screening.

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