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XL-3570 COB LED: Thermal Management & 2000mA Drive Design

LED Technology · 2026-03-19

XL-3570 COB LED: Thermal Management & 2000mA Drive Design

📌 Product Overview

The XL-3570 from XINGLIGHT is a high-power surface-mounted LED utilizing Flip Chip technology on a compact ceramic substrate. 💡 With package dimensions of 3.5 x 7.0 x 0.7mm, it is engineered to provide dense luminous flux output while maintaining a low thermal resistance profile. This component is specifically designed for applications requiring high-intensity illumination in confined spaces, utilizing a cool beam characteristic to ensure safe contact during operation.

Targeted primarily at the automotive and industrial sectors, the XL-3570 supports a wide operating temperature range from -40°C to +135°C. 👇 The design prioritizes thermal efficiency and luminous consistency, making it suitable for rigorous environments where reliability under high current loads is critical.

🚀 Typical Applications

Based on the XL-3570's robust thermal and electrical ratings, this component is optimized for the following scenarios:

  • Automotive Lighting: Ideal for high-beam headlights, daytime running lights (DRL), and fog light assemblies requiring high lumen density.
  • Electric Motorcycle Lighting: Supports compact headlight designs for e-bikes and electric motorcycles where thermal management is constrained.
  • Industrial & Commercial Fixtures: Suitable for high-bay lights, spotlights, and downlights requiring stable color temperature (5500K–7000K) and high CRI.
  • Exterior/Interior Illumination: Used in architectural lighting and security lighting where wide viewing angles (120°) are beneficial.

⚡ Key Technical Specifications

The following electrical and optical characteristics are measured under standard test conditions (Ta=25°C).

ParameterSymbolTest ConditionMinTypMaxUnit
Luminous FluxΦIF=2000mA2000-2800LM
Forward VoltageVFIF=2000mA8.7-9.6V
Color TemperatureTCIF=2000mA550065007000K
Viewing Angle2θ1/2IF=2000mA-120-Deg
Thermal ResistanceRth-j-sIF=2000mA-3-5-°C/W
Junction TempTJIF=2000mA--145°C

💡 Design Note: The wide forward voltage range requires drivers that can accommodate variance to ensure consistent current regulation across bins.

🔒 Absolute Maximum Ratings & Process Limits

Exceeding these ratings may cause permanent damage to the device. 👇 These limits are critical for designing safety margins into power supply and thermal management systems.

ParameterSymbolAbsolute Maximum RatingUnit
Power DissipationPD30W
Forward CurrentIF2000mA
Pulse Forward CurrentIFP3000A
Operating TemperatureTopr-40 to +135°C
Storage TemperatureTstg-40 to +85°C
Soldering TempTsld260 (Reflow, 3s)°C

⚠️ Thermal Warning: The junction temperature must not exceed 145°C. Proper heatsinking is mandatory to maintain thermal performance under maximum drive conditions.

📦 Package, Dimensions & Assembly Notes

  • Package Type: Flip Chip COB (Chip on Board).
  • Dimensions: 3.5mm (L) x 7.0mm (W) x 0.7mm (H).
  • Colloid Appearance: Available in White or Yellow fog finishes.
  • Moisture Sensitivity: MSL Level 3.
  • Soldering Guidelines: Supports both Lead (235°C peak) and Lead-free (255°C peak) infrared reflow processes.
    • Ramp-up Rate: Max 3°C/sec.
    • Cooling Rate: Max 6°C/sec.
    • Tin Resistance: Withstands 260°C for 10 seconds (2 cycles).

📈 Sourcing & Supply Considerations

  • Binning & Consistency: The datasheet specifies specific codes for Brightness (S3-S6), Voltage (S13-3 to S13-5), and Color Temperature (UW7-10 to UW11-10). Procurement teams must verify bin codes to ensure lot-to-lot consistency.
  • Environmental Compliance: The XL-3570 is ROHS compliant, meeting standard environmental requirements for global distribution.
  • Storage & Handling: As an MSL 3 device, it requires a floor life of less than 168 hours after opening the vacuum seal before baking or reflow soldering.

❓ FAQ

Q: What is the maximum drive current for the XL-3570? A: The Absolute Maximum Forward Current rating is 2000mA. While pulse currents can reach higher peaks (3000A), continuous operation should not exceed 2000mA to prevent thermal runaway.

Q: What is the thermal resistance of this LED? A: The thermal resistance from junction to solder point (Rth-j-s) is typically between 3°C/W and 5°C/W. This low resistance is crucial for maintaining junction temperatures below the 145°C limit.

Q: Can this component be used for automotive exterior lighting? A: Yes, the XL-3570 is specifically listed for automotive lighting applications. It supports a wide operating temperature range (-40°C to +135°C) and utilizes Flip Chip technology for robustness.

Q: What are the soldering profile requirements? A: The LED supports standard Reflow Soldering. For lead-free processes, the peak temperature should not exceed 255°C (held for 5-10 seconds). The ramp-up speed should be limited to a maximum of 3°C/second.

Q: How is the color temperature sorted? A: Color temperature is sorted into specific bins: UW7-10 (5500K-6000K), UW9-10 (6000K-6500K), and UW11-10 (6500K-7000K). Designers should specify the required bin when placing orders to ensure color consistency.

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