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XL-5730WWC-05 SMD LED — Technical Specifications & Design Guide

The XL-5730WWC-05 from XINGLIGHT is a LED designed for indicator and backlight applications. This technical guide helps design engineers and procurement teams evaluate the component for board integration, assess consi...

XL-5730WWC-05 SMD LED — Technical Specifications & Design Guide

📌 Product Overview

The XL-5730WWC-05 is a Surface Mount Device (SMD) LED designed for general-purpose illumination. 💡 It features a warm white color temperature (2800K–3400K) and utilizes a yellow colloid encapsulation on a 5.7x3.0x0.8mm PLCC frame. 👇 This component is optimized for applications requiring high luminous flux (45-70 lm) within a compact form factor, balancing thermal performance with ease of integration.

⚙️ Typical Applications

Based on its 120° viewing angle and warm white CCT, this model is suitable for:

  • Commercial Lighting: Recessed downlights and office lighting modules.
  • Linear Lighting: LED light strips and fluorescent tube replacements.
  • Signage: Advertising light boxes and illuminated channel letters.
  • Backlighting: LCD displays requiring uniform warm white diffusion.
  • Decorative Lighting: Flexible strips for ambient accent lighting.

📊 Key Technical Specifications

ParameterSymbolMin.Typ.Max.UnitTest Conditions
Luminous FluxΦ45-70LMIF=150mA
Color TempTC280030003400KIF=150mA
Forward VoltageVF2.8-3.4VIF=150mA
Viewing Angle2θ1/2-120-DegIF=150mA
CRIRa-70--IF=150mA

⚠️ Absolute Maximum Ratings & Process Limits

To ensure reliability during mass production, engineers must strictly adhere to these limits:

  • Power Dissipation (Pd): Max 500 mW.
  • Forward Current (If): Max 150 mA (Continuous) / 300 mA (Peak).
  • Reverse Voltage (Vr): Max 5 V.
  • ESD Susceptibility: 2000 V (Human Body Model).
  • Thermal: Operating range -40°C to +85°C.
  • Soldering: Max 260°C for ≤6 seconds (Manual).
ParameterSymbolValueUnit
Max Power DissipationPD500mW
Max Forward CurrentIF150mA
Peak Forward CurrentIFP300mA
Operating TemperatureTOPR-40~+85°C

📦 Package, Dimensions & Assembly Notes

  • Dimensions: 5.7mm (L) x 3.0mm (W) x 0.8mm (H).
  • Packaging: EIA standard compliant tape and reel.
  • Process: Designed for SMT automated assembly and infrared reflow soldering.
  • Moisture Sensitivity: MSL Level 3.
  • Soldering Guide: Compatible with both lead-free (peak 255°C) and leaded (peak 235°C) reflow profiles. Ensure proper pre-baking if exposed to ambient humidity >60% RH.

🚀 Sourcing & Supply Considerations

  • Binning Consistency: Verify voltage (N13) and lumen (J6-J8) bin codes to ensure uniformity in large arrays.
  • MSL Compliance: Adhere to MSL Level 3 handling (floor life <168 hours) before reflow to prevent pop-corning.
  • Authenticity: Source through authorized channels to guarantee RoHS compliance and lumen maintenance specs.
  • Evaluation: Request samples with specific bin codes for prototyping to validate thermal management in the final housing.

❓ FAQ

Q: What is the forward voltage range for this LED?
A: The forward voltage (VF) ranges from 2.8V to 3.4V at a typical forward current of 150mA. Designers should account for this variance in driver calculations.

Q: Is this component suitable for high-density LED strips?
A: Yes, with a footprint of 5.7x3.0mm and 0.8mm height, it is ideal for standard 5730 strip layouts, provided the PCB traces handle 150mA current density.

Q: What are the storage requirements to prevent moisture damage?
A: The MSL is Level 3. If the moisture barrier bag is open, components must be used within 168 hours or baked according to J-STD-033 standards before reflow soldering.

Q: Can this LED be used in outdoor lighting fixtures?
A: While the operating temperature is rated up to 85°C, the IP rating depends on the final fixture design. The LED itself is not waterproof but is suitable for internal fixtures within an outdoor-rated housing.

Q: What is the typical Color Rendering Index (CRI)?
A: The datasheet specifies a typical CRI (Ra) of 70, making it suitable for general commercial and decorative lighting where high color fidelity is not critical.

About Leon Zhang

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

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