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XL-B324SURSYGW F3 Red/YG LED: Binning & Thermal Limits in Backlight Designs

The XL-B324SURSYGW is a compact F3 3.8mm dual-color (Red/Yellow-Green) LED designed for backlight modules, automotive interiors, and signal indication. This article provides a detailed technical evaluation of its spec...

XL-B324SURSYGW F3 Red/YG LED: Binning & Thermal Limits in Backlight Designs

📌 Product Overview

The XL-B324SURSYGW is a high-efficiency, dual-color (Red/Yellow-Green) LED with a compact F3 package (3.8x3.0x5.2mm). Designed for demanding applications, it features a high-brightness output with an aerosol colloid and long operating life. Its primary focus is on integration into space-constrained designs where reliable, low-power indication and backlighting are critical, such as in automotive interiors and consumer electronics.

📌 Typical Applications

  • Backlight modules for displays and control panels
  • Automotive interior lighting and indicator systems
  • Signal indication for industrial and consumer devices
  • Smart home application interfaces
  • General-purpose lighting in compact assemblies

📌 Key Technical Specifications

ParameterSymbolRedYellow-GreenUnitTest Condition
Luminous IntensityIv400-700100-200mcdIF=20mA
Dominant Wavelengthλd630-640565-575nmIF=20mA
Forward VoltageVF1.8-2.42.0-2.6VIF=20mA
Viewing Angle2Ø1/23030degIF=20mA

📌 Absolute Maximum Ratings & Process Limits

ParameterSymbolRedYellow-GreenUnit
Max Power DissipationPD5050mW
Max Continuous Forward CurrentIF2020mA
Peak Forward CurrentIFP8080mA
Operating TemperatureTOPR-20 to +85-20 to +85°C
Reflow SolderingTSOL240°C, ≤6s--

📌 Package, Dimensions & Assembly Notes

The XL-B324SURSYGW utilizes an F3 package with dimensions of 3.8x3.0x5.2mm. For manual soldering, the temperature must not exceed 300°C for 3s, with the soldering point kept a minimum of 2.0mm from the colloid bottom to prevent damage. The MSL rating is 2, indicating standard moisture sensitivity handling requirements are necessary for reliable SMT assembly.

📌 Sourcing & Supply Considerations

Component sourcing requires attention to brightness (A1-A6), voltage (N12-7 to N13-1), and wavelength (HR04-HYG06) binning codes to ensure batch consistency. Authenticity verification is critical due to the component's use in quality-sensitive applications. For sample requests, volume pricing, or lead-time inquiries, direct engagement with authorized distributors or the manufacturer is recommended to guarantee supply chain integrity.

📌 FAQ

Q: What are the available brightness binning grades for the red LED?
A: The red LED (Iv) is available in grades A1 (100-200 mcd), A5 (400-500 mcd), and A6 (500-700 mcd) at IF=20mA.

Q: Is this LED suitable for high-temperature automotive environments?
A: Yes, its operating temperature range is -20°C to +85°C, making it suitable for many automotive interior applications.

Q: What is the recommended soldering process for this component?
A: Reflow soldering should be at 240°C for ≤6s. Manual soldering must be at 300°C for ≤3s, with the solder joint at least 2.0mm from the colloid.

Q: How does the dual-color function work?
A: It is a single-package LED emitting both red and yellow-green light, controlled by separate electrical inputs for each color.

Q: What does the MSL 2 rating mean for production?
A: Moisture Sensitivity Level 2 means the component must be baked before assembly if exposed to ambient conditions for more than a specified time, typically 168 hours.

Q: Can this LED be used for outdoor general lighting?
A: While it can be used in general lighting, its operating temperature range (-20 to +85°C) and IP rating (not specified) may limit its suitability for harsh outdoor environments without additional protection.

About Leon Zhang

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

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