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XL-SFH7016 SMD LED: Biometric Integration & Optical Performance Analysis

The XL-SFH7016 is a multi-wavelength SMD LED integrating Red, Green, and Infrared elements, designed for high-precision biometric monitoring in compact wearable electronics. This technical analysis examines optical po...

XL-SFH7016 SMD LED: Biometric Integration & Optical Performance Analysis

📌 Product Overview

The XL-SFH7016 is a multi-die SMD LED component from XINGLIGHT, specifically engineered for optical biosensing applications. 📦 Housed in a compact 1.85 x 1.65 x 0.6 mm package, it integrates Red (655nm), Green (522nm), and Infrared (945nm) emitting elements into a single footprint. This integration is critical for wearables requiring multi-spectral analysis, such as heart rate monitoring (HRM) and blood oxygen detection (SpO2), where distinct wavelengths are necessary to isolate hemoglobin absorption characteristics. 💡 The design focus is on maximizing optical power output within a minimal physical envelope, ensuring compatibility with space-constrained PCB layouts.

🎯 Typical Applications

Based on its tri-wavelength architecture and compact form factor, the XL-SFH7016 is optimized for the following scenarios:

  • Medical-Grade Consumer Wearables: Integration into smartwatches and fitness trackers for continuous heart rate and SpO2 monitoring. 🩺
  • Pulse Oximetry: Dedicated diagnostic tools where the 655nm (Red) and 945nm (IR) pairing is essential for calculating oxygen saturation levels.
  • General Health Monitoring: Implementation in portable health devices requiring Green LED (522nm) for high-contrast pulse signal detection in various skin tones.
  • SMT Automation: Designed for high-volume surface mount production lines suitable for automatic placement machines.

⚡ Key Technical Specifications

The optical and electrical performance of the XL-SFH7016 is characterized by distinct parameters for each wavelength. The following data outlines the typical behavior under standard test conditions (Ta=25°C).

ParameterSymbolRed (655nm)Green (522nm)Infrared (945nm)Unit
Forward VoltageVf2.02.61.3V
Peak Wavelengthλp655522945nm
Optical PowerPo888mW
Half Viewing Angleθ1/2±62--deg

Note: Pulse testing conditions for Optical Power are IF=20mA. 💡 The component delivers a typical optical power of 8mW per diode under continuous current.

⚠️ Absolute Maximum Ratings & Process Limits

To ensure reliability and prevent catastrophic failure during both operation and assembly, engineers must strictly adhere to the following limits. ⚠️ Exceeding these values may cause permanent thermal or electrical damage to the LED dies.

ParameterSymbolMax. ValueUnitConditions
Forward CurrentIF50mAContinuous (DC)
Pulse Forward CurrentIFP200mAPulse width 0.5ms, Duty 1/10
Reverse VoltageVR5V-
Operating TempTOPR-40 ~ +85°CAmbient
Storage TempTSTR-40 ~ +100°C-
Soldering TempTSOL260°C≤ 6 Seconds

Note: The Moisture Sensitivity Level (MSL) is classified as Level 3. 🔒 This necessitates pre-baking before reflow if the components have been exposed to ambient humidity for extended periods.

🏗️ Package, Dimensions & Assembly Notes

The XL-SFH7016 utilizes a standard 1816 (1.8mm x 1.6mm) footprint, optimized for high-density SMT processes.

  • Dimensions: The body profile is 1.85mm (L) x 1.65mm (W) x 0.6mm (H). 📏 Designers should account for a standard tolerance of ±0.1mm on non-critical dimensions.
  • Soldering Compatibility: The component is rated for reflow soldering processes, withstanding peak temperatures of 260°C for up to 6 seconds.
  • Assembly: Designed for automatic pick-and-place machines. The EIA standard packaging ensures smooth feeder operation in high-volume EMS environments.
  • Layout: The ±62° viewing angle requires careful optical cavity design in the target device to minimize crosstalk between the LED and the photodiode.

🚚 Sourcing & Supply Considerations

When integrating the XL-SFH7016 into production BOMs, consider the following supply chain factors:

  • MSL Compliance: Verify that your supply chain partner adheres to MSL Level 3 handling (dry packing) to prevent popcorning during reflow. 🛡️
  • Consistency: For biometric applications, binning consistency regarding wavelength and forward voltage is critical for algorithm stability.
  • Sampling: Always request production samples for optical validation against your specific photodiode sensors before full-scale procurement.
  • Lead-Time: As an active component in the health-tech sector, verify current stock availability to avoid line-down situations.

❓ FAQ

Q: What are the specific wavelength tolerances for the XL-SFH7016?
A: The typical peak wavelengths are Red (655nm), Green (522nm), and IR (945nm). The datasheet specifies a dominant wavelength tolerance of approximately ±1nm, though spectral width varies (Red ~18nm, Green ~28nm, IR ~30nm). 📉 This tight tolerance is crucial for maintaining the accuracy of SpO2 algorithms.

Q: Can this component be used for high-current pulse applications?
A: Yes, the XL-SFH7016 supports a pulsed forward current (IFP) of up to 200mA. ⚡ However, this is strictly conditional on the pulse width being 0.5ms with a duty cycle of 1/10 to prevent thermal overload.

Q: What are the storage requirements to prevent moisture damage?
A: The component has a Moisture Sensitivity Level (MSL) of 3. 💧 If the vacuum-sealed bag is opened and the components are not used within 168 hours (1 week), they must be baked at 125°C for a specified duration (usually 8-24 hours depending on floor life) to drive out moisture before reflow soldering.

Q: Is the XL-SFH7016 compatible with standard lead-free soldering processes?
A: Yes, it is rated for soldering temperatures up to 260°C for a maximum of 6 seconds. 🔥 This makes it fully compatible with standard lead-free reflow profiles used in modern SMT assembly lines.

About Leon Zhang

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

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