Tech Hub

Practical insights on components & sourcing

XL-SFH7016 SMD LED: Biometric Integration & Optical Performance Analysis

The XL-SFH7016 is a multi-wavelength SMD LED integrating Red, Green, and Infrared elements, designed for high-precision biometric monitoring in compact wearable electronics. This technical analysis examines optical po...

XL-SFH7016 SMD LED: Biometric Integration & Optical Performance Analysis

📌 Product Overview

The XL-SFH7016 is a multi-die SMD LED component from XINGLIGHT, specifically engineered for optical biosensing applications. 📦 Housed in a compact 1.85 x 1.65 x 0.6 mm package, it integrates Red (655nm), Green (522nm), and Infrared (945nm) emitting elements into a single footprint. This integration is critical for wearables requiring multi-spectral analysis, such as heart rate monitoring (HRM) and blood oxygen detection (SpO2), where distinct wavelengths are necessary to isolate hemoglobin absorption characteristics. 💡 The design focus is on maximizing optical power output within a minimal physical envelope, ensuring compatibility with space-constrained PCB layouts.

🎯 Typical Applications

Based on its tri-wavelength architecture and compact form factor, the XL-SFH7016 is optimized for the following scenarios:

  • Medical-Grade Consumer Wearables: Integration into smartwatches and fitness trackers for continuous heart rate and SpO2 monitoring. 🩺
  • Pulse Oximetry: Dedicated diagnostic tools where the 655nm (Red) and 945nm (IR) pairing is essential for calculating oxygen saturation levels.
  • General Health Monitoring: Implementation in portable health devices requiring Green LED (522nm) for high-contrast pulse signal detection in various skin tones.
  • SMT Automation: Designed for high-volume surface mount production lines suitable for automatic placement machines.

⚡ Key Technical Specifications

The optical and electrical performance of the XL-SFH7016 is characterized by distinct parameters for each wavelength. The following data outlines the typical behavior under standard test conditions (Ta=25°C).

ParameterSymbolRed (655nm)Green (522nm)Infrared (945nm)Unit
Forward VoltageVf2.02.61.3V
Peak Wavelengthλp655522945nm
Optical PowerPo888mW
Half Viewing Angleθ1/2±62--deg

Note: Pulse testing conditions for Optical Power are IF=20mA. 💡 The component delivers a typical optical power of 8mW per diode under continuous current.

⚠️ Absolute Maximum Ratings & Process Limits

To ensure reliability and prevent catastrophic failure during both operation and assembly, engineers must strictly adhere to the following limits. ⚠️ Exceeding these values may cause permanent thermal or electrical damage to the LED dies.

ParameterSymbolMax. ValueUnitConditions
Forward CurrentIF50mAContinuous (DC)
Pulse Forward CurrentIFP200mAPulse width 0.5ms, Duty 1/10
Reverse VoltageVR5V-
Operating TempTOPR-40 ~ +85°CAmbient
Storage TempTSTR-40 ~ +100°C-
Soldering TempTSOL260°C≤ 6 Seconds

Note: The Moisture Sensitivity Level (MSL) is classified as Level 3. 🔒 This necessitates pre-baking before reflow if the components have been exposed to ambient humidity for extended periods.

🏗️ Package, Dimensions & Assembly Notes

The XL-SFH7016 utilizes a standard 1816 (1.8mm x 1.6mm) footprint, optimized for high-density SMT processes.

  • Dimensions: The body profile is 1.85mm (L) x 1.65mm (W) x 0.6mm (H). 📏 Designers should account for a standard tolerance of ±0.1mm on non-critical dimensions.
  • Soldering Compatibility: The component is rated for reflow soldering processes, withstanding peak temperatures of 260°C for up to 6 seconds.
  • Assembly: Designed for automatic pick-and-place machines. The EIA standard packaging ensures smooth feeder operation in high-volume EMS environments.
  • Layout: The ±62° viewing angle requires careful optical cavity design in the target device to minimize crosstalk between the LED and the photodiode.

🚚 Sourcing & Supply Considerations

When integrating the XL-SFH7016 into production BOMs, consider the following supply chain factors:

  • MSL Compliance: Verify that your supply chain partner adheres to MSL Level 3 handling (dry packing) to prevent popcorning during reflow. 🛡️
  • Consistency: For biometric applications, binning consistency regarding wavelength and forward voltage is critical for algorithm stability.
  • Sampling: Always request production samples for optical validation against your specific photodiode sensors before full-scale procurement.
  • Lead-Time: As an active component in the health-tech sector, verify current stock availability to avoid line-down situations.

❓ FAQ

Q: What are the specific wavelength tolerances for the XL-SFH7016?
A: The typical peak wavelengths are Red (655nm), Green (522nm), and IR (945nm). The datasheet specifies a dominant wavelength tolerance of approximately ±1nm, though spectral width varies (Red ~18nm, Green ~28nm, IR ~30nm). 📉 This tight tolerance is crucial for maintaining the accuracy of SpO2 algorithms.

Q: Can this component be used for high-current pulse applications?
A: Yes, the XL-SFH7016 supports a pulsed forward current (IFP) of up to 200mA. ⚡ However, this is strictly conditional on the pulse width being 0.5ms with a duty cycle of 1/10 to prevent thermal overload.

Q: What are the storage requirements to prevent moisture damage?
A: The component has a Moisture Sensitivity Level (MSL) of 3. 💧 If the vacuum-sealed bag is opened and the components are not used within 168 hours (1 week), they must be baked at 125°C for a specified duration (usually 8-24 hours depending on floor life) to drive out moisture before reflow soldering.

Q: Is the XL-SFH7016 compatible with standard lead-free soldering processes?
A: Yes, it is rated for soldering temperatures up to 260°C for a maximum of 6 seconds. 🔥 This makes it fully compatible with standard lead-free reflow profiles used in modern SMT assembly lines.

About Leon Zhang

Founder and Strategic Sourcing Lead, LDeepAI

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

Expertise: electronic component sourcing, China supply-chain verification, LED components, memory and storage sourcing, RFQ risk screening.

Connect on LinkedIn

How to Use This Insight

For procurement teams

This Tech Hub article is written for OEM, EMS, distributor and engineering teams evaluating component supply risk, allocation pressure and sourcing timing.

What LDeepAI supports

LDeepAI provides AI-assisted electronic component sourcing support, verified China channel screening and RFQ risk review for global buyers.

LED sourcing scope

For LED requirements, LDeepAI can help review RFQs and sourcing paths for SMD LEDs, through-hole LEDs, automotive LEDs, IR / UV LEDs and custom LED sourcing demand.

Business boundary

LDeepAI does not imply brand authorization for memory or IC categories unless explicitly stated. These categories are handled through verified trade channels and risk-screened workflows.

More Insights

View all →

Send Your Component RFQ

Send us your part number, BOM file, target quantity, package requirement, application and delivery country. LDeepAI will review available sourcing options and respond with next-step recommendations.

Need sourcing support? Submit RFQ