Specifications
| Type | Description |
|---|---|
| Part Number | BL-HZD39R-C-TRB |
| Manufacturer | Texas Instruments |
| Product Type | SMD LED |
| Category | LED |
| Emitted Color | Cool White |
| Lens Appearance | Yellow diffuse |
| Package Size | 3.8 x 0.6 x 1.0 mm |
| SMT Assembly Compatibility | Suitable for all SMT assembly methods |
| Reflow Compatibility | Compatible with infrared and vapor phase reflow solder process |
| Placement Compatibility | Compatible with automatic placement equipment |
| RoHS Compliance | Doesn't contain restricted substance; complies with RoHS standard |
| ESD Rating | 2000 V |
| Power Dissipation | 102 mW at Ta=25°C |
| Forward Current | 30 mA at Ta=25°C |
| Peak Forward Current | 100 mA, pulse, 1/10 duty, 30 msec width; Ta=25°C |
| Operating Temperature | -40 to 85 °C |
| Storage Temperature | -40 to 85 °C |
| Soldering Temperature | See IR reflow and iron soldering profiles |
| Forward Voltage | Min 2.8 V, Typ 3.0 V, Max 3.4 V at IF=20 mA, Ta=25°C |
| Luminous Intensity | Min 2600 mcd, Typ 2800 mcd at IF=20 mA, Ta=25°C |
| Chromaticity Coordinate x | Typ 0.28 at IF=20 mA, Ta=25°C |
| Chromaticity Coordinate y | Typ 0.25 at IF=20 mA, Ta=25°C |
| Reverse Current | Max 10 µA at VR=5 V, Ta=25°C |
| Viewing Angle | Typ 120 deg, 2θ1/2, IF=20 mA, Ta=25°C |
| Reel Quantity | 3000 pcs per reel |
| Bag Quantity | 3000 pcs per bag |
| Box Quantity | 10 bags per box |
| Carton Quantity | 6 boxes per carton |
| Intensity Bin B | 2600-2700 mcd at IF=20 mA |
| Intensity Bin C | 2700-2800 mcd at IF=20 mA |
| Intensity Bin D | 2800-2900 mcd at IF=20 mA |
| Intensity Bin E | 2900-3000 mcd at IF=20 mA |
| Intensity Bin F | 3000-3100 mcd at IF=20 mA |
| Intensity Bin G | 3100-3200 mcd at IF=20 mA |
| Intensity Bin H | 3200-3300 mcd at IF=20 mA |
| Intensity Bin J | 3300-3400 mcd at IF=20 mA |
| VF Bin G1 | 2.8-2.9 V at IF=20 mA |
| VF Bin G2 | 2.9-3.0 V at IF=20 mA |
| VF Bin H1 | 3.0-3.1 V at IF=20 mA |
| VF Bin H2 | 3.1-3.2 V at IF=20 mA |
| VF Bin J1 | 3.2-3.3 V at IF=20 mA |
| VF Bin J2 | 3.3-3.4 V at IF=20 mA |
| Color Bin CCT Range A | 7000-8000 K, bins A-0 to A-3 at 20 mA |
| Color Bin CCT Range B | 8000-10000 K, bins B-0 to B-3 at 20 mA |
| Color Bin CCT Range C | 10000-14000 K, bins C-0 to C-3 at 20 mA |
| Color Bin CCT Range D | 14000-25000 K, bins D-0 to D-3 at 20 mA |
| Color Bin CCT Range E | 25000 K and above, bins E-2 to E-3 at 20 mA |
| Intensity Bin Tolerance | ±10% |
| Color Bin Tolerance | ±0.005 |
| Operation Life Test | 1000 hours, 0/20 failures at IF=20 mA, room temperature |
| High Temperature High Humidity Endurance Storage Test | 240 hours, 0/20 failures at Ta=65°C±5°C, RH=90%-95% |
| High Temperature Storage Test | 1000 hours, 0/20 failures at Ta=85°C±5°C |
| Low Temperature Storage Test | 1000 hours, 0/20 failures at Ta=-35°C±5°C |
| Temperature Cycling Test | 5 cycles, 0/20 failures; -35°C 60 min, +25°C 20 min, +85°C 60 min, +25°C 20 min |
| Thermal Shock Test | 10 cycles, 0/20 failures; -35°C±5°C for 20 min to +85°C±5°C for 20 min |
| Solder Resistance Test | 0/20 failures; preheat 140-160°C within 2 min, heating 260°C max within 10 sec max |
| Forward Voltage Failure Criterion | Over upper limit x 1.2 at IF=20 mA after reliability test |
| Reverse Current Failure Criterion | Over upper limit x 2 at VR=5 V after reliability test |
| Luminous Intensity Failure Criterion | Below initial value x 0.7 at IF=20 mA after reliability test |
| IR Reflow Peak Temperature | 260°C max for 10 sec max |
| IR Reflow Ramp-Up Rate | 3°C/s max |
| IR Reflow Ramp-Down Rate | 6°C/s max |
| IR Reflow Temperature Hold | 60-120 sec at 150-200°C; 60-120 sec above 217°C |
| Iron Soldering | 350°C within 3 sec, one time only |
| Sealed Storage Temperature | 5-30°C before opening sealed envelope |
| Sealed Storage Humidity | RH 60% max before opening sealed envelope |
| Post-Opening Floor Life | 24 hours after bag opened for reflow or equivalent soldering |
| Post-Opening Storage Humidity | Less than 20% RH after bag opened before soldering |
| Baking Condition | 48 hours at 60°C±5°C if 24-hour use or <20% RH storage conditions are not met |
| Datasheet Status | request_only |
Product Overview
BL-HZD39R-C-TRB is a cool white SMD LED from Texas Instruments supplied in a 3.8 x 0.6 x 1.0 mm SMT package. The device has a yellow diffuse lens appearance and is specified for surface-mount assembly workflows, including automatic placement equipment and all SMT assembly methods.
Electrical ratings at Ta=25°C include 102 mW power dissipation, 30 mA forward current, and 100 mA peak forward current for pulse operation at 1/10 duty and 30 msec width. At IF=20 mA and Ta=25°C, forward voltage is specified from 2.8 V to 3.4 V, luminous intensity is 2600 mcd minimum and 2800 mcd typical, and viewing angle is typically 120°.
The part is compatible with infrared and vapor phase reflow soldering. Packaging data includes 3000 pieces per reel, 3000 pieces per bag, 10 bags per box, and 6 boxes per carton. Typical use cases include compact cool-white indicators, display lighting, panel illumination, and SMT backlighting positions where the listed package and optical ratings fit the design.
Key Features
- Cool white emitted color with yellow diffuse lens
- 3.8 x 0.6 x 1.0 mm SMT package
- Suitable for all SMT assembly methods
- Compatible with infrared and vapor phase reflow
- Compatible with automatic placement equipment
- 2000 V ESD rating
- 30 mA forward current at Ta=25°C
- Typical 120 degree viewing angle at IF=20 mA
- RoHS compliant per datasheet statement
- 3000 pieces per reel packaging
Typical Applications
- Cool white status indicators
- Compact display lighting
- Panel indicator illumination
- SMT board-level visual indicators
- Backlighting in compact assemblies
- Automatic-placement LED assemblies
- Reflow-soldered lighting modules
Procurement Notes
When requesting a quote for BL-HZD39R-C-TRB, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
XL-1608PDC Phototransistor: SMT Integration & High Sensitivity Specs
The XL-1608PDC is a compact 0603 surface-mount phototransistor designed for high-density PCBs. This technical article provides engineers with critical specifications, absolute m...
XL-504UBC LED: 5mm Blue Through-Hole for Industrial & Consumer Designs
The XL-504UBC is a 5mm blue through-hole LED with 465nm peak wavelength and 30° viewing angle. Designed for automotive, consumer, and industrial applications, it offers consiste...
XL-A324SURUGW Dual-Color LED: High-Brightness Red/Green Binning & SMT Integration
The XL-A324SURUGW is a high-brightness F3 dual-color LED from XINGLIGHT, featuring red and green emission in a single package. This article provides a detailed technical analysi...
XL-1608UBC-06 SMD LED: 0603 Blue LED for SMT Integration
The XL-1608UBC-06 is a compact 0603 SMD LED from XINGLIGHT, emitting a blue light at 465nm. This article provides an engineering-focused overview of its specifications, typical...
FAQ
What package does BL-HZD39R-C-TRB use?
BL-HZD39R-C-TRB is specified in a 3.8 x 0.6 x 1.0 mm SMT package. The datasheet also states compatibility with all SMT assembly methods and automatic placement equipment.
What are the main electrical ratings for this LED?
At Ta=25°C, the device is rated for 102 mW power dissipation and 30 mA forward current. Peak forward current is 100 mA under pulse conditions of 1/10 duty and 30 msec width.
What optical output is specified at IF=20 mA?
At IF=20 mA and Ta=25°C, luminous intensity is specified as 2600 mcd minimum and 2800 mcd typical. The typical viewing angle is 120 degrees, with chromaticity coordinates x=0.28 and y=0.25.
What soldering methods are listed for BL-HZD39R-C-TRB?
The datasheet lists compatibility with infrared and vapor phase reflow soldering. The IR reflow profile allows 260°C maximum for 10 seconds maximum, while manual iron soldering is 350°C within 3 seconds one time only.
How should opened bags be handled before soldering?
After the bag is opened, devices intended for infrared reflow, vapor-phase reflow, or equivalent soldering have a 24-hour floor life. Storage before soldering should be less than 20% RH, otherwise baking is required.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.