Specifications
| Type | Description |
|---|---|
| Part Number | EL_DIR-0000427-HIR26-21C-L423-TR8 |
| Manufacturer | EVERLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 1.6mm round subminiature reverse package chip LED, miniature SMD package with spherical top-view lens |
| Datasheet Part Number | HIR26-21C/L423/TR8 |
| Chip Material | GaAlAs |
| Resin Color | Water clear |
| Optical Function | Infrared emitting diode |
| Spectral Matching | Matched with silicon photodiode and phototransistor |
| Continuous Forward Current | 65 mA |
| Reverse Voltage | 5 V |
| Operating Temperature | -40 to +85 °C |
| Storage Temperature | -40 to +85 °C |
| Soldering Temperature | 260 °C |
| Power Dissipation | 110 mW |
| Radiant Intensity | 14.0 min, 16.0 typ mW/sr |
| Radiant Intensity Condition | IF=20 mA, Ta=25°C |
| Peak Wavelength | 850 typ nm |
| Peak Wavelength Condition | IF=20 mA, Ta=25°C |
| Spectral Bandwidth | 42 typ nm |
| Spectral Bandwidth Condition | IF=20 mA, Ta=25°C |
| Forward Voltage | 1.45 typ, 1.70 max V |
| Forward Voltage Condition | IF=20 mA, Ta=25°C |
| Reverse Current | 10 max µA |
| Reverse Current Condition | VR=5 V, Ta=25°C |
| Optical Rise/Fall Time | 25/15 typ ns, 35/35 max ns |
| Optical Rise/Fall Time Condition | IF=50 mA, Ta=25°C |
| View Angle | 20 typ deg |
| View Angle Condition | 2θ1/2, IF=20 mA, Ta=25°C |
| Tape/Reel Packaging | 8 mm tape on 7 inch diameter reel |
| Loaded Quantity | 1500 pcs per reel |
| Moisture Bag Storage Before Opening | 30°C or less, 90% RH or less |
| Floor Life After Opening | 1 year |
| Floor Life Condition | 30°C or less, 60% RH or less |
| Baking Treatment | 60±5°C for 24 hours |
| Baking Treatment Condition | If silica gel faded or storage time exceeded |
| Hand Soldering Condition | Less than 350°C for 3 seconds, once per terminal, soldering iron capacity less than 25 W |
| Reflow Soldering Limit | Not more than two times |
| Reliability Confidence Level | 90% |
| Reliability LTPD | 10% |
| Datasheet Status | request_only |
Product Overview
EL_DIR-0000427-HIR26-21C-L423-TR8 is an EVERLIGHT infrared emitting diode in the LED category. The datasheet identifies the device as HIR26-21C/L423/TR8, built with a GaAlAs chip and water clear resin. Its package is described as a 1.6mm round subminiature reverse package chip LED, implemented as a miniature SMD package with a spherical top-view lens.
At IF=20 mA and Ta=25°C, the device provides 14.0 mW/sr minimum and 16.0 mW/sr typical radiant intensity, with an 850 nm typical peak wavelength and 42 nm typical spectral bandwidth. Forward voltage is specified as 1.45 V typical and 1.70 V maximum, while reverse current is 10 µA maximum at VR=5 V. The typical view angle is 20 degrees.
Assembly and handling data include 8 mm tape on a 7 inch reel with 1500 pieces per reel, a reflow soldering limit of not more than two times, and hand soldering below 350°C for 3 seconds once per terminal using a soldering iron under 25 W. The optical function and spectral matching support use with silicon photodiodes and phototransistors.
Key Features
- GaAlAs infrared emitting diode chip
- Water clear resin package construction
- 850 nm typical peak wavelength at IF=20 mA
- 14.0 mW/sr minimum radiant intensity at IF=20 mA
- 20 degree typical view angle at IF=20 mA
- 1.45 V typical forward voltage at IF=20 mA
- 25/15 ns typical optical rise/fall time at IF=50 mA
- Matched with silicon photodiode and phototransistor
- 8 mm tape on 7 inch reel packaging
- 1500 pieces loaded per reel
Typical Applications
- Silicon photodiode matched infrared emission
- Silicon phototransistor matched infrared emission
- Top-view infrared optical pairing
- 850 nm infrared emitter circuits
- SMD infrared emitter assemblies
- Tape-and-reel LED production builds
Procurement Notes
When requesting a quote for EL_DIR-0000427-HIR26-21C-L423-TR8, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of LED is EL_DIR-0000427-HIR26-21C-L423-TR8?
EL_DIR-0000427-HIR26-21C-L423-TR8 is an EVERLIGHT infrared emitting diode. The datasheet identifies the related device part number as HIR26-21C/L423/TR8 and describes it as a GaAlAs infrared emitter with water clear resin.
What are the main optical specifications at IF=20 mA?
At IF=20 mA and Ta=25°C, the device has 14.0 mW/sr minimum and 16.0 mW/sr typical radiant intensity, an 850 nm typical peak wavelength, 42 nm typical spectral bandwidth, and a 20 degree typical view angle.
What package and reel format does this part use?
The package is a 1.6mm round subminiature reverse package chip LED in a miniature SMD package with a spherical top-view lens. Packaging is 8 mm tape on a 7 inch diameter reel, with 1500 pieces per reel.
What soldering limits are specified in the datasheet?
The datasheet lists a 260°C soldering temperature rating and states that reflow soldering should be performed not more than two times. Hand soldering is specified below 350°C for 3 seconds, once per terminal, using an iron under 25 W.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.