Specifications
| Type | Description |
|---|---|
| Part Number | 9400_NVMe_Enterprise_SSD |
| Manufacturer | Micron |
| Product Type | Enterprise SSD |
| Category | Memory & Storage |
| Package / Case | U.3/U.2 2.5-inch, 15 mm, SFF-8639; 100.45 x 70.10 x 15.00 mm; mass <235 g |
| NAND type | Micron 3D TLC NAND Flash; condition: 9400 SSD Series |
| Host interface | PCI Express Gen4; condition: U.3/U.2 single port x4 |
| NVMe specification | NVM Express 1.4; condition: 9400 SSD Series |
| Namespaces supported | 128; condition: NVMe operation |
| Formatted sector sizes | 512 bytes and 4096 bytes; condition: Enterprise sector size support, configurable |
| PRO capacities | 7680 GB, 15360 GB, 30720 GB; condition: Unformatted capacity |
| MAX capacities | 6400 GB, 12800 GB, 25600 GB; condition: Unformatted capacity |
| PRO sequential read throughput | 7000 MB/s; condition: 128 KB transfer, Power State 0, PRO 7680/15360/30720 GB |
| PRO sequential write throughput | 7000 MB/s; condition: 128 KB transfer, Power State 0, PRO 7680/15360/30720 GB |
| PRO random read performance | 1600, 1600, 1500 KIOPS; condition: 4 KB transfer, Power State 0, PRO 7680/15360/30720 GB |
| PRO random write performance | 300 KIOPS; condition: 4 KB transfer, Power State 0, PRO 7680/15360/30720 GB |
| PRO 70/30 random read/write performance | 770, 780, 770 KIOPS; condition: 4 KB transfer, Power State 0, PRO 7680/15360/30720 GB |
| PRO read latency typical | 69 us; condition: 4 KB random workload, QD1, median, PRO all capacities |
| PRO write latency typical | 10 us; condition: 4 KB random workload, QD1, median, PRO all capacities |
| PRO read latency 99th percentile | 85 us; condition: PRO all capacities |
| PRO write latency 99th percentile | 30 us; condition: PRO all capacities |
| MAX sequential read throughput | 7000 MB/s; condition: 128 KB transfer, Power State 0, MAX 6400/12800/25600 GB |
| MAX sequential write throughput | 7000 MB/s; condition: 128 KB transfer, Power State 0, MAX 6400/12800/25600 GB |
| MAX random read performance | 1600, 1600, 1500 KIOPS; condition: 4 KB transfer, Power State 0, MAX 6400/12800/25600 GB |
| MAX random write performance | 600, 600, 550 KIOPS; condition: 4 KB transfer, Power State 0, MAX 6400/12800/25600 GB |
| MAX 70/30 random read/write performance | 930, 940, 900 KIOPS; condition: 4 KB transfer, Power State 0, MAX 6400/12800/25600 GB |
| MAX read latency typical | 69 us; condition: 4 KB random workload, QD1, median, MAX all capacities |
| MAX write latency typical | 10 us; condition: 4 KB random workload, QD1, median, MAX all capacities |
| MAX read latency 99th percentile | 85 us; condition: MAX all capacities |
| MAX write latency 99th percentile | 30 us; condition: MAX all capacities |
| PRO random endurance TBW | 14016 TB, 28032 TB, 56064 TB; condition: 4 KB random, PRO 7680/15360/30720 GB |
| PRO sequential endurance TBW | 58300 TB, 104500 TB, 201200 TB; condition: 128 KB sequential, PRO 7680/15360/30720 GB |
| MAX random endurance TBW | 35040 TB, 70080 TB, 140160 TB; condition: 4 KB random, MAX 6400/12800/25600 GB |
| MAX sequential endurance TBW | 74200 TB, 143100 TB, 282600 TB; condition: 128 KB sequential, MAX 6400/12800/25600 GB |
| MTTF | 2 million device hours; condition: Population statistics |
| Uncorrectable bit error rate | <1 sector per 10^17 bits read; condition: Reliability specification |
| Operating temperature | 0°C to +70°C; condition: Commercial, temperature measured by SMART |
| 12 V supply voltage | 12 Vdc ±8%; condition: U.3/U.2 operating voltage |
| 12 V rise time | 0.1 ms min, 100 ms max; condition: U.3/U.2 12 V rail |
| 12 V fall time | <5 s; condition: U.3/U.2 12 V rail |
| Minimum power-off time | 50 ms; condition: U.3/U.2 12 V rail |
| Inrush current | 2.0 A typical peak; condition: U.3/U.2 12 V rail |
| 3.3 V AUX supply voltage | 3.3 Vdc ±5%; condition: U.3/U.2 AUX rail |
| 3.3 V AUX rise time | 1 ms min, 50 ms max; condition: U.3/U.2 AUX rail |
| 3.3 V AUX fall time | 1 ms min, 5 s max; condition: U.3/U.2 AUX rail |
| 3.3 V AUX average current | 20 mA max; condition: U.3/U.2 AUX rail |
| Idle power | 5 W; condition: Average RMS, PRO and MAX all listed capacities |
| PRO active read power | 17, 18, 21 W; condition: Maximum RMS, PRO 7680/15360/30720 GB |
| PRO active write power | 22, 25, 25 W; condition: Maximum RMS, PRO 7680/15360/30720 GB |
| MAX active read power | 16, 18, 21 W; condition: Maximum RMS, MAX 6400/12800/25600 GB |
| MAX active write power | 22, 25, 25 W; condition: Maximum RMS, MAX 6400/12800/25600 GB |
| Security | Digitally signed firmware; condition: 9400 SSD Series |
| Power-loss protection | Full power-loss protection; condition: Reliability feature |
| Hot plug support | Surprise insertion/surprise removal and hot-plug capable; condition: U.3/U.2 SSD |
| Datasheet Status | request_only |
Product Overview
Micron 9400_NVMe_Enterprise_SSD is an Enterprise NVMe PCIe Gen4 SSD built with Micron 3D TLC NAND Flash. The host interface is PCI Express Gen4 through a U.3/U.2 single-port x4 connection, with operation based on the NVM Express 1.4 specification. The device supports 128 namespaces and configurable enterprise sector sizes of 512 bytes and 4096 bytes.
The mechanical format is U.3/U.2 2.5-inch, 15 mm, SFF-8639, with dimensions of 100.45 x 70.10 x 15.00 mm and mass below 235 g. Capacity groups include PRO versions at 7680 GB, 15360 GB, and 30720 GB, and MAX versions at 6400 GB, 12800 GB, and 25600 GB.
Performance data includes 7000 MB/s sequential read and 7000 MB/s sequential write throughput for both PRO and MAX listed capacities at 128 KB transfer size in Power State 0. The drive also specifies 4 KB random performance, latency, endurance, power, rail timing, hot-plug capability, full power-loss protection, and digitally signed firmware for enterprise storage deployments.
Key Features
- Micron 3D TLC NAND Flash storage media
- PCI Express Gen4 U.3/U.2 single-port x4 host interface
- NVM Express 1.4 command-set support
- 128 namespaces supported for NVMe operation
- Configurable 512-byte and 4096-byte sector sizes
- PRO capacities up to 30720 GB unformatted
- MAX capacities up to 25600 GB unformatted
- 7000 MB/s sequential read and write throughput
- Full power-loss protection for stored data handling
- Digitally signed firmware for firmware authentication
- Surprise insertion, surprise removal, and hot-plug capable
Typical Applications
- Enterprise NVMe server storage
- U.3/U.2 storage bays
- PCIe Gen4 storage platforms
- Hot-plug SSD service designs
- High-capacity data storage nodes
- Random 4 KB workload storage
- Sequential 128 KB workload storage
Procurement Notes
When requesting a quote for Micron 9400 Series, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For memory and storage sourcing, density, organization, speed grade, voltage, package, temperature grade, date code, lifecycle status and original packing condition should be verified before approval.
FAQ
What host interface does the 9400_NVMe_Enterprise_SSD use?
The Micron 9400_NVMe_Enterprise_SSD uses a PCI Express Gen4 host interface in a U.3/U.2 single-port x4 configuration and operates according to the NVM Express 1.4 specification.
What capacities are listed for PRO and MAX versions?
The extracted datasheet facts list PRO unformatted capacities of 7680 GB, 15360 GB, and 30720 GB. MAX unformatted capacities are listed as 6400 GB, 12800 GB, and 25600 GB.
What package format is specified for this SSD?
The SSD uses a U.3/U.2 2.5-inch, 15 mm SFF-8639 form factor. The listed dimensions are 100.45 x 70.10 x 15.00 mm, with device mass below 235 g.
What power rails are specified for U.3/U.2 operation?
The U.3/U.2 operating voltage includes a 12 Vdc rail with ±8% tolerance and a 3.3 Vdc AUX rail with ±5% tolerance. The AUX rail average current is specified as 20 mA maximum.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.