H5AG36EXNDX017N 8Gb DDR4 SDRAM

Specifications

Product Overview

H5AG36EXNDX017N_SKhynix is an 8Gb DDR4 SDRAM memory component. The extracted datasheet facts identify the base part as H5AG36EXNDX017N from the H5AG36EXNDXxxx family, with SK hynix branding in the manufacturer technical datasheet. The device is described as CMOS Double Data Rate IV SDRAM with 8-bit prefetch and 16 internal banks.

The memory organization is 512M x 16, supplied in a 96ball FBGA package. Package dimensions were not provided in the supplied pages. Operating supplies include VDD = 1.2 V +/- 0.06 V, VDDQ = 1.2 V +/- 0.06 V, and VPP = 2.5 V with a 2.375 V minimum and 2.75 V maximum.

The XN speed grade corresponds to DDR4-3200 at 3200 MT/s with tCK = 0.625 ns, CL = 22, and CL-tRCD-tRP = 22-22-22. Functional details include programmable burst length 4/8, differential DQS_t/DQS_c data strobe only, dynamic on-die termination support, and active-low asynchronous RESET_n.

Key Features

• 8Gb CMOS Double Data Rate IV SDRAM memory
• 512M x 16 organization in 96ball FBGA package
• XN speed grade supports DDR4-3200 operation
• 3200 MT/s maximum data rate
• CL-tRCD-tRP timing is 22-22-22
• VDD and VDDQ supplies are 1.2 V +/- 0.06 V
• VPP activation supply is 2.5 V nominal
• 16 banks with 8-bit prefetch architecture
• Programmable burst length 4 or 8
• Differential DQS_t/DQS_c data strobe only
• Dynamic on-die termination is supported
• Active-low asynchronous RESET_n input

Typical Applications

• DDR4 SDRAM memory designs
• 512M x 16 memory channels
• 3200 MT/s DDR4 interfaces
• Commercial temperature electronics
• Systems requiring 96ball FBGA memory
• Designs using differential DQS strobes
• Boards requiring RoHS compliant memory

Procurement Notes

When requesting a quote for H5AG36EXNDX017N_SKhynix, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For memory and storage sourcing, density, organization, speed grade, voltage, package, temperature grade, date code, lifecycle status and original packing condition should be verified before approval.