Specifications
| Type | Description |
|---|---|
| Part Number | K4F6E3S4HM-TF(H)CL |
| Manufacturer | Samsung |
| Product Type | DRAM |
| Category | Memory & Storage |
| Memory Density | 16 Gb |
| Memory Type | LPDDR4 SDRAM |
| Device Organization | 64Mb x16DQ x8 banks x2 channels |
| DQ Width | x16 DQ |
| Bank Count | 8 banks |
| Channel Count | 2 channels |
| Package Type | 200FBGA |
| Package Dimensions | 10 x 15 |
| Automotive Designation | For Automotive |
| Base Part Number | K4F6E3S4HM |
| Ordering Part Number | K4F6E3S4HM-TFCL |
| Alternate Listed Part Number | K4F6E3S4HM-THCL |
| Datasheet Revision | Rev. 1.3 |
| Datasheet Revision Date | May 2020 |
| Storage Temperature Range | -55 to 125 °C |
| Previous Storage Temperature Range | -55 to 150 °C |
| Operating Temperature Basis | Samsung Automotive Mission Profile |
| Clock Input Type | Differential CK input |
| High-Speed Input Standard | 1.1V High speed LVCMOS (HS_LLVCMOS) |
| Control Inputs Referenced | CKE, Reset_n, ODT_CA |
| Datasheet Status | request_only |
Product Overview
K4F6E3S4HM-TF(H)CL is listed by Samsung as a Memory & Storage component and identified in the datasheet facts as a 16Gb LPDDR4 SDRAM device. The top-level organization is 64Mb x16DQ x8 banks x2 channels, giving a documented x16 DQ width, 8-bank structure, and 2-channel arrangement.
The package case is 200FBGA, 10 x 15, with the package dimensions noted without an explicitly shown unit in the extracted text. The base part number is K4F6E3S4HM, while K4F6E3S4HM-TFCL is the ordering part number and K4F6E3S4HM-THCL is an alternate listed part number.
The datasheet header designates the device for automotive use. The operating temperature basis is the Samsung Automotive Mission Profile, and the Rev. 1.3 datasheet changed the storage temperature range to -55 to 125 °C from the previous -55 to 150 °C. Interface-related facts include differential CK input, 1.1V High speed LVCMOS measurement levels, and referenced control inputs CKE, Reset_n, and ODT_CA.
Key Features
- 16 Gb LPDDR4 SDRAM memory density
- 64Mb x16DQ x8 banks x2 channels organization
- x16 DQ width per listed device organization
- 8 banks per listed LPDDR4 SDRAM organization
- 2 channels per top-level organization
- 200FBGA package with 10 x 15 dimensions
- Automotive designation stated in datasheet header
- Differential CK input referenced for AC/DC measurement
- 1.1V HS_LLVCMOS high-speed input standard
- Control inputs include CKE, Reset_n, ODT_CA
Typical Applications
- Automotive memory subsystems
- LPDDR4 SDRAM designs
- Dual-channel memory architectures
- x16 DQ memory interfaces
- 200FBGA board assemblies
- Automotive mission profile designs
Procurement Notes
When requesting a quote for K4F6E3S4HM-TF(H)CL, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For memory and storage sourcing, density, organization, speed grade, voltage, package, temperature grade, date code, lifecycle status and original packing condition should be verified before approval.
FAQ
What memory type is K4F6E3S4HM-TF(H)CL?
K4F6E3S4HM-TF(H)CL is identified in the extracted datasheet facts as a 16Gb LPDDR4 SDRAM device in the Memory & Storage category.
What is the device organization for this LPDDR4 SDRAM?
The listed top-level organization is 64Mb x16DQ x8 banks x2 channels. The extracted facts also specify x16 DQ width, 8 banks, and 2 channels.
What package is listed for K4F6E3S4HM-TF(H)CL?
The package type is listed as 200FBGA, and the package summary gives dimensions of 10 x 15. The extracted text does not explicitly show the unit for those dimensions.
What datasheet revision information is available?
The provided datasheet revision is Rev. 1.3 dated May 2020. In that revision, the storage temperature range is listed as -55 to 125 °C, changed from -55 to 150 °C.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.