Specifications
| Type | Description |
|---|---|
| Part Number | M321R8GA0BB0_DDR5-LRDIMM |
| Manufacturer | Samsung |
| Product Type | DRAM |
| Category | Memory & Storage |
| Package / Case | 288-pin Registered DIMM; DDR5 SDRAM components in 82FBGA; module height 31.25 mm ±0.15 mm |
| Ordering Part Number | M321R8GA0BB0-CQK |
| Memory Technology | DDR5 SDRAM |
| Module Type | Registered DIMM |
| Pin Count | 288 pins |
| DRAM Die Density | 16 Gb |
| DRAM Die Revision | B-die |
| DRAM Component Package | 82FBGA |
| Module Capacity | 64 GB |
| Module Organization | 8G x 80 |
| Data Width | x80 |
| Rank Configuration | 2 ranks |
| DRAM Device Width | x4 |
| Component Composition | 4G x 4 |
| Module Height | 31.25 mm ±0.15 mm |
| Speed Grade / Bin | 40-39-39 |
| Programmable CAS Latency | 22, 26, 28, 30, 32, 36, 40, 42 |
| CAS Write Latency | RL-2 |
| VPP Maximum | 1.908 V |
| Compliance | RoHS compliant |
| Datasheet Revision | Rev. 1.1 |
| Datasheet Status | request_only |
Product Overview
M321R8GA0BB0_DDR5-LRDIMM is listed for Samsung Memory applications as a DDR5 SDRAM Registered DIMM. The extracted ordering data identifies the datasheet part entry as M321R8GA0BB0-CQK, with 64 GB capacity, 8G x 80 module organization, and 4G x 4 component composition.
The module uses a 288-pin Registered DIMM format and is built with DDR5 SDRAM devices. The function block description specifies an x80 data width, 2 ranks, and x4 DDR5 SDRAM devices. The DRAM is based on 16 Gb Samsung B-die, with DRAM components supplied in lead-free and halogen-free 82FBGA packages.
Mechanical and timing parameters include a 31.25 mm ±0.15 mm module height, 40-39-39 speed grade/bin, programmable CAS latency values of 22, 26, 28, 30, 32, 36, 40, and 42, and CAS write latency defined as RL-2. The datasheet also lists a VPP maximum of 1.908 V and RoHS compliance.
Key Features
- DDR5 SDRAM Registered DIMM module format
- 288-pin module interface
- 64 GB module capacity
- 8G x 80 module organization
- x80 data width
- 2-rank module configuration
- x4 DDR5 SDRAM device width
- 16 Gb Samsung B-die DRAM
- 82FBGA DRAM component package
- 31.25 mm ±0.15 mm module height
- 40-39-39 speed grade/bin
- Programmable CAS latency values from 22 to 42
Typical Applications
- 288-pin DDR5 RDIMM slots
- Registered DIMM memory assemblies
- 64 GB DDR5 module configurations
- x80 data-width memory designs
- Two-rank x4 DDR5 SDRAM systems
- Samsung DDR5 RDIMM sourcing requests
Procurement Notes
When requesting a quote for M321R8GA0BB0_DDR5-LRDIMM, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For memory and storage sourcing, density, organization, speed grade, voltage, package, temperature grade, date code, lifecycle status and original packing condition should be verified before approval.
FAQ
What is the memory technology for this Samsung module?
The extracted datasheet facts identify the module as DDR5 SDRAM. It is described as a Samsung DDR5 SDRAM Registered DIMM with a 288-pin module format.
What capacity and organization are listed for this part?
The ordering information lists a 64 GB module capacity. The same extracted data gives the module organization as 8G x 80 and the component composition as 4G x 4.
What package and mechanical height are specified?
The module uses DDR5 SDRAM components in 82FBGA packages and a 288-pin Registered DIMM format. The module height is specified as 31.25 mm ±0.15 mm.
Which timing values are included in the extracted facts?
The extracted facts list a 40-39-39 speed grade/bin, programmable CAS latency values of 22, 26, 28, 30, 32, 36, 40, and 42, and CAS write latency as RL-2.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.