Specifications
| Type | Description |
|---|---|
| Part Number | K4F6E3S4HB-KHCL02V |
| Manufacturer | SAMSUNG |
| Product Type | LPDDR4 |
| Category | Memory & Storage |
| Package/Case | 200FBGA, 10 x 15 |
| Manufacturer Full Name | Samsung Electronics |
| Memory Type | LPDDR4 SDRAM |
| Product Density | 16Gb |
| Die/Package Architecture | DDP |
| Package Type | 200FBGA |
| Package Dimensions | 10 x 15 |
| Application Grade | Automotive |
| Temperature Grade 2 Range | -40 to 105 °C |
| Temperature Grade 3 Range | -40 to 95 °C |
| Organization | 64Mb x16DQ x8 banks x2 channels |
| DQ Width | x16 DQ |
| Banks | 8 banks |
| Channels | 2 channels |
| Related Ordering Variant | K4F6E3S4HB-KFCL |
| Related Ordering Variant | K4F6E3S4HB-KHCL |
| Datasheet Revision | Rev. 1.0 |
| Datasheet Date | Sep. 2022 |
| Final Datasheet Release Date | Sep 6th, 2022 |
| Interface Signaling Mentioned | 1.1V High speed LVCMOS |
| Datasheet Source | Manufacturer technical datasheet |
| Datasheet Status | request_only |
Product Overview
K4F6E3S4HB-KHCL02V is identified from the Samsung Electronics automotive datasheet family as a 16Gb DDP LPDDR4 SDRAM memory device. The source material lists the memory type as LPDDR4 SDRAM, the product density as 16Gb, and the die/package architecture as DDP.
The package information in the extracted facts specifies a 200FBGA package with 10 x 15 dimensions listed in the excerpt. The source does not make the units visible, so the package dimensions should be treated exactly as documented in the provided facts. The memory organization is 64Mb x16DQ x8 banks x2 channels, with x16 DQ width, 8 banks, and 2 channels.
The datasheet is marked for automotive use and includes Grade 2 and Grade 3 operating temperature ranges. Grade 2 is listed as -40 to 105 °C, while Grade 3 is listed as -40 to 95 °C. Related ordering variants shown in the datasheet header include K4F6E3S4HB-KFCL and K4F6E3S4HB-KHCL.
Key Features
- 16Gb DDP LPDDR4 SDRAM memory device
- Automotive application grade identified in datasheet
- 200FBGA package listed on cover page
- 10 x 15 package dimensions from source excerpt
- 64Mb x16DQ x8 banks x2 channels organization
- x16 DQ width derived from memory organization
- Two-channel architecture documented in extracted facts
- Grade 2 temperature range of -40 to 105 °C
- Grade 3 temperature range of -40 to 95 °C
- 1.1V high speed LVCMOS signaling mentioned
Typical Applications
- Automotive memory subsystems
- LPDDR4 SDRAM designs
- Two-channel memory architectures
- x16 DQ memory interfaces
- Grade 2 automotive electronics
- Grade 3 automotive electronics
- 200FBGA board assemblies
Procurement Notes
When requesting a quote for K4F6E3S4HB-KHCL02V, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For memory and storage sourcing, density, organization, speed grade, voltage, package, temperature grade, date code, lifecycle status and original packing condition should be verified before approval.
FAQ
What type of memory is K4F6E3S4HB-KHCL02V?
K4F6E3S4HB-KHCL02V is identified in the extracted Samsung Electronics datasheet facts as a 16Gb DDP LPDDR4 SDRAM memory device for automotive applications.
What package is listed for this Samsung memory component?
The extracted facts list the package type as 200FBGA with 10 x 15 dimensions. The units for the dimensions are not visible in the provided datasheet excerpt.
What operating temperature grades are documented?
The datasheet facts list Grade 2 operation from -40 to 105 °C and Grade 3 operation from -40 to 95 °C for this automotive LPDDR4 SDRAM family.
What is the documented memory organization?
The memory organization is listed as 64Mb x16DQ x8 banks x2 channels. The extracted facts also identify x16 DQ width, 8 banks, and 2 channels.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.