Specifications
| Type | Description |
|---|---|
| Part Number | TPS5450 |
| Manufacturer | Texas Instruments |
| Product Type | LDO Regulator |
| Category | Power Management |
| Package / Case | HSOP/DDA 8-pin SOIC PowerPAD, 4.89 mm x 3.90 mm body |
| Component Type | Power_IC |
| Input Voltage Range | 5.5 to 36 V; recommended operating condition |
| Continuous Output Current | Up to 5 A; operating capability |
| Peak Output Current | 6 A; operating capability |
| Integrated MOSFET On Resistance | 110 mOhm; high-side N-channel MOSFET, typical feature value |
| Output Voltage Range | Adjustable down to 1.22 V; feedback reference based regulation |
| Initial Reference Accuracy | 1.5%; output voltage reference initial accuracy |
| Switching Frequency | 500 kHz; fixed internal switching frequency, typical |
| Shutdown Supply Current | 18 uA typ; ENA used for shutdown |
| Operating Junction Temperature Range | -40 to 125 °C; recommended operating range |
| VIN Absolute Maximum Voltage | -0.3 to 40 V; over operating free-air temperature |
| PH Absolute Maximum Voltage | -0.6 to 40 V; steady-state absolute maximum rating |
| PH Transient Absolute Maximum Voltage | -1.2 V min; transient less than 10 ns |
| ENA Absolute Maximum Voltage | -0.3 to 7 V; absolute maximum rating |
| BOOT-PH Absolute Maximum Voltage | -0.3 to 10 V; absolute maximum rating |
| VSENSE Absolute Maximum Voltage | -0.3 to 3 V; absolute maximum rating |
| PH Source Current | Internally limited; absolute maximum rating |
| PH Leakage Current | 10 uA max; absolute maximum rating |
| Operating Virtual Junction Temperature | -40 to 150 °C; absolute maximum rating |
| Storage Temperature | -65 to 150 °C; absolute maximum rating |
| ESD Rating HBM | ±2000 V; human-body model per ANSI/ESDA/JEDEC JS-001 |
| ESD Rating CDM | ±1500 V; charged-device model per JEDEC JESD22-C101 |
| Junction-to-Ambient Thermal Resistance Custom Board | 30 °C/W; DDA 8-pin package, custom board |
| Junction-to-Ambient Thermal Resistance Standard Board | 42.3 °C/W; DDA 8-pin package, standard board |
| Junction-to-Top Characterization Parameter | 4.9 °C/W; DDA 8-pin package |
| Junction-to-Board Characterization Parameter | 20.7 °C/W; DDA 8-pin package |
| Junction-to-Case Top Thermal Resistance | 46.4 °C/W; DDA 8-pin package |
| Junction-to-Case Bottom Thermal Resistance | 0.8 °C/W; DDA 8-pin package |
| Junction-to-Board Thermal Resistance | 20.8 °C/W; DDA 8-pin package |
| Quiescent Current | 3 mA typ, 4.4 mA max; VSENSE=2 V, not switching, PH open, VIN=5.5 V to 36 V, TJ=-40°C to 125°C |
| Shutdown Current | 18 uA typ, 50 uA max; ENA=0 V, VIN=5.5 V to 36 V, TJ=-40°C to 125°C |
| UVLO Start Threshold Voltage | 5.3 V typ, 5.5 V max; undervoltage lockout |
| UVLO Hysteresis Voltage | 330 mV typ; undervoltage lockout |
| Voltage Reference Accuracy at 25°C | 1.202 V min, 1.221 V typ, 1.239 V max; TJ=25°C |
| Voltage Reference Accuracy Over Load | 1.196 V min, 1.221 V typ, 1.245 V max; IO=0 A to 5 A, VIN=5.5 V to 36 V, TJ=-40°C to 125°C |
| Oscillator Frequency | 400 kHz min, 500 kHz typ, 600 kHz max; internally set free-running frequency |
| Minimum Controllable On Time | 150 ns min, 200 ns typ; oscillator/PWM operation |
| Maximum Duty Cycle | 87% min, 89% typ; oscillator/PWM operation |
| ENA Start Threshold Voltage | 1.3 V typ; enable pin rising threshold |
| ENA Stop Threshold Voltage | 0.5 V typ; enable pin falling threshold; below 0.5 V device stops switching |
| ENA Hysteresis Voltage | 450 mV typ; enable pin |
| Internal Slow-Start Time | 6.6 ms min, 8 ms typ, 10 ms max; 0% to 100% slow-start |
| Current Limit | 6.0 A min, 7.5 A typ, 9.0 A max; current-limit protection |
| Current Limit Hiccup Time | 13 ms min, 16 ms typ, 20 ms max; current-limit protection |
| Thermal Shutdown Trip Point | 135 °C min, 162 °C typ; thermal shutdown |
| Thermal Shutdown Hysteresis | 14 °C typ; thermal shutdown recovery hysteresis |
| High-Side MOSFET On Resistance at VIN=5.5V | 150 mOhm typ; VIN=5.5 V |
| High-Side MOSFET On Resistance | 110 mOhm typ, 230 mOhm max; output MOSFET electrical characteristic |
| BOOT Pin Function | Connect 0.01 uF low-ESR capacitor from BOOT to PH; boost capacitor for high-side FET gate driver |
| VSENSE Pin Function | Feedback voltage input; connect to output voltage divider |
| VIN Pin Function | Input supply voltage; bypass VIN to GND close to package with low-ESR ceramic capacitor |
| PH Pin Function | High-side MOSFET source output; connected to external inductor and diode |
| PowerPAD Function | GND connection required; GND pin must be connected to exposed pad for proper operation |
| Datasheet Status | request_only |
Product Overview
The TPS5450 is a Texas Instruments Power_Management IC for step-down buck conversion. It accepts a recommended 5.5 to 36 V input range and provides up to 5 A continuous output current, with 6 A peak output current capability. Output regulation is adjustable down to 1.22 V through the VSENSE feedback input connected to an output voltage divider.
The device uses an integrated high-side N-channel MOSFET with 110 mOhm typical on resistance as a feature value, and 110 mOhm typical, 230 mOhm maximum in the electrical characteristics. The internal oscillator runs at 500 kHz typical, with a 400 kHz minimum and 600 kHz maximum range. PWM operation includes 150 ns minimum, 200 ns typical controllable on time and an 87% minimum, 89% typical maximum duty cycle.
The HSOP/DDA 8-pin SOIC PowerPAD package has a 4.89 mm x 3.90 mm body. Layout and assembly requirements include VIN bypassing to GND close to the package with a low-ESR ceramic capacitor, a 0.01 uF low-ESR capacitor from BOOT to PH, PH connection to the external inductor and diode, and GND connection to the exposed PowerPAD for proper operation.
Key Features
- 5.5 to 36 V recommended input voltage range
- Up to 5 A continuous output current
- 6 A peak output current operating capability
- Adjustable output voltage down to 1.22 V
- 500 kHz typical fixed internal switching frequency
- Integrated high-side N-channel MOSFET
- ENA-controlled shutdown current of 18 uA typical
- Internal slow-start time of 8 ms typical
- Current limit with 16 ms typical hiccup time
- Thermal shutdown with 14 °C typical hysteresis
- PowerPAD must connect to GND for operation
Typical Applications
- 5.5 to 36 V input buck rails
- Adjustable low-voltage DC outputs
- 5 A step-down power stages
- Enable-controlled shutdown power designs
- PowerPAD thermal PCB assemblies
- External inductor and diode buck circuits
Procurement Notes
When requesting a quote for TPS5450, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.
FAQ
What input voltage range does TPS5450 support?
TPS5450 supports a recommended operating input voltage range of 5.5 to 36 V. The VIN absolute maximum voltage rating is -0.3 to 40 V over the operating free-air temperature condition.
How much output current can TPS5450 provide?
The device supports up to 5 A continuous output current and has a 6 A peak output current operating capability. Its current-limit protection is specified at 6.0 A minimum, 7.5 A typical, and 9.0 A maximum.
What package is used for TPS5450?
TPS5450 is specified in an HSOP/DDA 8-pin SOIC PowerPAD package with a 4.89 mm x 3.90 mm body. The GND pin must be connected to the exposed PowerPAD for proper operation.
What external connections are required around BOOT, VIN, PH, and VSENSE?
The BOOT pin uses a 0.01 uF low-ESR capacitor from BOOT to PH. VIN should be bypassed to GND close to the package with a low-ESR ceramic capacitor. PH connects to the external inductor and diode, and VSENSE connects to the output voltage divider.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.