Specifications
| Type | Description |
|---|---|
| Part Number | XL-1608SYGC-06 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 1608 SMD, 1.6 x 0.8 x 0.6 mm |
| Outline Dimensions | 1.6 x 0.8 x 0.6 mm; L/W/H |
| Luminous Color | Yellow-green; water clear colloid |
| Encapsulant / Colloid | Water clear colloid; yellow-green LED |
| Moisture Sensitivity Level | MSL 3; manufacturer stated |
| RoHS Compliance | Complied with RoHS Directive; environmental protection products |
| Maximum Power Dissipation | 50 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; Ta=25°C, pulse width ≤0.1 ms, duty ≤1/10 |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Withstand Voltage | 2000 V; Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature / Time | 260°C, ≤6 s; Ta=25°C absolute maximum rating table |
| Luminous Intensity | 50 to 120 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 565 to 575 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 570 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 1.8 to 2.4 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; IF=20 mA, Ta=25°C, 2θ1/2 |
| Half Wave Width | 28 nm typ; IF=20 mA, Ta=25°C |
| Reverse Current | ≤1 µA; VR=5 V, Ta=25°C |
| Brightness Bin D1 | 50 to 80 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D2 | 80 to 120 mcd; IF=20 mA, brightness error ±10% |
| Voltage Bin M17-9 | 1.8 to 1.9 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-1 | 1.9 to 2.0 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-2 | 2.0 to 2.1 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-3 | 2.1 to 2.2 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-4 | 2.2 to 2.3 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-5 | 2.3 to 2.4 V; IF=20 mA, voltage error ±0.1 V |
| Wavelength Bin HYG03 | 565 to 567.5 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HYG04 | 567.5 to 570 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HYG05 | 570 to 572.5 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HYG06 | 572.5 to 575 nm; IF=20 mA, wavelength error ±1 nm |
| Default Test Ambient Temperature | 25 ±5 °C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours; IR reflow in-board 2 times, Ta=85±5°C, RH=90-95% |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each |
| Anti-Tin Test | 260±5°C, 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; time at peak 10-15 s; ramp max 3°C/s; cooling max 6°C/s |
| Lead-Free Process Reflow Peak Temperature | 255°C +0/-5°C; time at peak 5-10 s; ramp max 3°C/s; cooling max 6°C/s |
| Weldability Test | 235±5°C, immersion time 2±0.5 s; immersion speed 25±2.5 mm/s; tin loading rate ≥95% pad area |
| Outline Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Tape/Reel Dimensional Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering Iron Power | <30 W; recommended for repair/rework only |
| Hand Soldering Temperature | <300°C; each terminal less than 3 s, one time only |
| Maximum Reflow Soldering Cycles | 2 times; reflow soldering should not be done more than twice |
| Cleaning With Alcohol | ≤30°C for 3 minutes or ≤50°C for 30 seconds; after soldering |
| Ultrasonic Cleaning Power | ≤300 W; pretest recommended to confirm no LED damage |
| Unopened Storage Conditions | ≤30°C, <60% RH, use within 1 year; before opening moisture-proof anti-electrostatic package |
| Opened Storage Conditions | ≤30°C, <40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Conditions | ≤30°C, <60% RH; after opening package |
| Baking Conditions | 60±5°C for 24 hours; if moisture absorbent faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-1608SYGC-06 is a XINGLIGHT yellow-green SMD LED supplied in a 1608 case with 1.6 x 0.8 x 0.6 mm outline dimensions. The LED uses a water clear colloid and is specified as RoHS compliant. Its compact package and 120° typical viewing angle support surface-mounted visual indication where yellow-green emission is required.
Electrical and optical ratings are defined at IF=20 mA and Ta=25°C unless otherwise indicated. The device has 50 to 120 mcd luminous intensity, 565 to 575 nm dominant wavelength, 570 nm typical peak wavelength, 28 nm typical half wave width, 1.8 to 2.4 V forward voltage, and reverse current of ≤1 µA at VR=5 V.
Assembly data includes MSL 3 classification, maximum two reflow soldering cycles, lead-free reflow peak temperature of 255°C +0/-5°C, and hand soldering guidance below 300°C for less than 3 seconds per terminal. Storage guidance specifies unopened storage within one year at ≤30°C and <60% RH, and opened-package soldering within 168 hours at ≤30°C and <40% RH.
Key Features
- 1608 SMD package measures 1.6 x 0.8 x 0.6 mm
- Yellow-green emission with water clear colloid encapsulant
- 50 to 120 mcd luminous intensity at 20 mA
- 565 to 575 nm dominant wavelength at 20 mA
- 1.8 to 2.4 V forward voltage at 20 mA
- 120° typical viewing angle at 20 mA
- 20 mA maximum continuous forward current rating
- MSL 3 moisture sensitivity classification
- -40 to +85°C operating temperature range
- RoHS Directive compliance stated by manufacturer
Typical Applications
- Yellow-green status indicators
- Compact SMD indicator lights
- Panel indication assemblies
- Signal and state indication
- Surface-mount display indicators
- Low-profile electronic assemblies
Procurement Notes
When requesting a quote for XL-1608SYGC-06, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
XL-1608PDC Phototransistor: SMT Integration & High Sensitivity Specs
The XL-1608PDC is a compact 0603 surface-mount phototransistor designed for high-density PCBs. This technical article provides engineers with critical specifications, absolute m...
XL-1608YWC-06 SMD LED: 120° Viewing Angle for Compact Backlighting
The XL-1608YWC-06 is a miniature 1.6x0.8x0.6mm yellow SMD LED designed for compact applications like medical endoscopes and automotive indicators. This article provides critical...
XL-1608VRC-06 SMD LED — Technical Specifications & Design Guide
The XL-1608VRC-06 from XINGLIGHT is a LED designed for indicator and backlight applications. This technical guide helps design engineers and procurement teams evaluate the compo...
XL-1608UYC-06FJ SMD LED — Technical Specifications & Design Guide
The XL-1608UYC-06FJ from XINGLIGHT is a LED designed for indicator and backlight applications. This technical guide helps design engineers and procurement teams evaluate the com...
FAQ
What package size does XL-1608SYGC-06 use?
XL-1608SYGC-06 uses a 1608 SMD package with outline dimensions of 1.6 x 0.8 x 0.6 mm. The datasheet lists an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What optical output is specified at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 50 to 120 mcd luminous intensity, 565 to 575 nm dominant wavelength, 570 nm typical peak wavelength, and 28 nm typical half wave width.
What are the main current and voltage ratings?
The device is rated for 20 mA maximum continuous forward current, 80 mA peak forward current under pulse width ≤0.1 ms and duty ≤1/10, 5 V maximum reverse voltage, and 1.8 to 2.4 V forward voltage at 20 mA.
What handling limits apply after opening the package?
After opening the package, storage should be ≤30°C and <40% RH, and soldering should occur within 168 hours or 7 days. Recommended workshop conditions are ≤30°C and <60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 5, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.