XL-1608UBC-06A Blue SMD Chip LED

Specifications

Product Overview

XL-1608UBC-06A is a XINGLIGHT blue SMD chip LED supplied in a compact 1608 surface-mount package. The package outline is 1.6 x 0.8 x 0.6 mm, with blue luminous color through a water-white transparent colloid. The datasheet specifies the part as RoHS compliant and identifies its moisture sensitivity level as MSL 3.

At Ta=25°C, the device is rated for 100 mW maximum power dissipation, 30 mA maximum continuous forward current, 80 mA peak forward current under pulsed conditions, and 5 V maximum reverse voltage. At IF=20 mA, key optical and electrical parameters include 80 to 300 mcd luminous intensity, 450 to 475 nm dominant wavelength, 465 nm typical peak wavelength, 2.6 to 3.4 V forward voltage, 130° typical viewing angle, and 25 nm typical half wave width.

Assembly guidance includes a 260°C lead soldering limit for no more than 6 seconds, recommended reflow maximum of 240±5°C for 6 seconds, and a maximum of two reflow soldering cycles. Opened packages should be soldered within 168 hours at ≤30°C and <40% RH, with 60±5°C baking for 24 hours if storage controls are exceeded.

Key Features

• 1608 SMD package measures 1.6 x 0.8 x 0.6 mm
• Blue emission with water-white transparent colloid
• 80 to 300 mcd luminous intensity at 20 mA
• 450 to 475 nm dominant wavelength at 20 mA
• 2.6 to 3.4 V forward voltage at 20 mA
• 130° typical viewing angle at 20 mA
• 30 mA maximum continuous forward current at Ta=25°C
• MSL 3 moisture sensitivity level specified
• RoHS Directive compliant process stated
• Reflow soldering limited to maximum two cycles

Typical Applications

• Blue status indication
• Compact surface-mount indicators
• PCB-mounted signal lamps
• Blue display backlighting points
• Panel indicator lighting
• Repairable hand-soldered LED assemblies

Procurement Notes

When requesting a quote for XL-1608UBC-06A, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.