Specifications
| Type | Description |
|---|---|
| Part Number | XL-1608UGC-06A |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Outline Dimensions | 1.6 x 0.8 x 0.6 mm, L/W/H |
| Luminous Color | Green, water-white transparent colloid/lens |
| Colloid / Lens Appearance | Water-white transparent, green light LED |
| Moisture Sensitivity Level | MSL 3 |
| Maximum Power Dissipation | 100 mW at Ta=25°C |
| Maximum Continuous Forward Current | 30 mA at Ta=25°C |
| Peak Forward Current | 80 mA, pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V at Ta=25°C |
| ESD Withstand Voltage | 2000 V antistatic ability at Ta=25°C |
| Operating Temperature Range | -40 to +85 °C |
| Storage Temperature Range | -40 to +85 °C |
| Lead Soldering Temperature / Time | 260°C for <=6 s |
| Luminous Intensity | 550 min, 1450 max mcd at IF=20 mA, Ta=25°C |
| Dominant Wavelength | 515 min, 530 max nm at IF=20 mA, Ta=25°C |
| Peak Wavelength | 525 typ nm at IF=20 mA, Ta=25°C |
| Forward Voltage | 2.4 min, 3.0 max V at IF=20 mA, Ta=25°C |
| Viewing Angle | 130° typ, 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 30 typ nm at IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA at VR=5 V, Ta=25°C |
| Brightness Grade E5 | 550 to 600 mcd at IF=20 mA, brightness error ±10% |
| Brightness Grade E6 | 600 to 700 mcd at IF=20 mA, brightness error ±10% |
| Brightness Grade E7 | 700 to 800 mcd at IF=20 mA, brightness error ±10% |
| Brightness Grade E8 | 800 to 900 mcd at IF=20 mA, brightness error ±10% |
| Brightness Grade E9 | 900 to 1000 mcd at IF=20 mA, brightness error ±10% |
| Brightness Grade F1 | 1000 to 1150 mcd at IF=20 mA, brightness error ±10% |
| Brightness Grade F2 | 1150 to 1300 mcd at IF=20 mA, brightness error ±10% |
| Brightness Grade F3 | 1300 to 1450 mcd at IF=20 mA, brightness error ±10% |
| Voltage Grade M18-6 | 2.4 to 2.5 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M18-7 | 2.5 to 2.6 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M18-8 | 2.6 to 2.7 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M18-9 | 2.7 to 2.8 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M19-1 | 2.8 to 2.9 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Grade M19-2 | 2.9 to 3.0 V at IF=20 mA, voltage error ±0.1 V |
| Wavelength Grade HG02 | 515 to 520 nm at IF=20 mA, wavelength error ±1 nm |
| Wavelength Grade HG03 | 520 to 525 nm at IF=20 mA, wavelength error ±1 nm |
| Wavelength Grade HG04 | 525 to 530 nm at IF=20 mA, wavelength error ±1 nm |
| Default Test Environment Temperature | 25 ±5 °C unless otherwise indicated |
| Working Life Test | 1000 hours, continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature and High Humidity Storage Test | 240 hours ±2 hours, Ta=85 ±5°C, RH=90 to 95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours at Ta=85 ±5°C |
| Low Temperature Storage Test | 1000 hours at Ta=-40 ±5°C |
| Cold and Hot Cycle Test | 50 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 50 cycles; IR reflow in-board 2 times; 100 ±5°C to -40 ±5°C; 20 min each |
| Anti-tin Test | 260 ±5°C, 10 ±1 s, 2 times |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C, keep at peak for 10 to 15 s; cooling rate max 6°C/s |
| Lead-free Process Reflow Peak Temperature | 255°C +0/-5°C, keep at peak for 5 to 10 s; cooling rate max 6°C/s |
| Lead-free Reflow Time Above 217°C | 60 to 120 s; heat-up rate from 217°C to peak max 3°C/s |
| Lead Process Reflow Time Above 183°C | 60 to 150 s; heat-up rate from 183°C to peak max 3°C/s |
| Weldability Test | Tin loading rate >=95% pad area; 235 ±5°C, 25 ±2.5 mm/s, 2 ±0.5 s |
| Outline Dimension Tolerance | ±0.25 mm unless otherwise noted |
| Belt and Disk Dimension Tolerance | ±0.1 mm for packaging dimensions, units in mm |
| Hand Soldering Iron Power | <30 W, recommended for repair/rework only |
| Hand Soldering Temperature | <300°C, each terminal once only, less than 3 seconds |
| Maximum Number of Reflow Soldering Cycles | 2 times |
| Recommended Maximum Welding Temperature | 240 ±5°C for 6 s |
| Cleaning with Alcohol | Under 30°C for 3 min or under 50°C for 30 s after soldering |
| Ultrasonic Cleaning Power | <=300 W, pretest required to confirm no LED damage |
| Unopened Storage Condition | <=30°C, <60% RH, within 1 year before opening package |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours / 7 days after opening package |
| Recommended Workshop Condition | <=30°C, <60% RH |
| Baking Condition | 60 ±5°C for 24 hours if moisture absorbent fades or LEDs exceed storage time |
| Datasheet Status | request_only |
Product Overview
The XL-1608UGC-06A is a XINGLIGHT green SMD chip LED supplied in a compact 1608 case. The outline dimensions are 1.6 x 0.8 x 0.6 mm, with a stated outline dimension tolerance of ±0.25 mm unless otherwise noted. The LED has a water-white transparent colloid/lens appearance for green light output.
Key Features
- 1608 SMD package, 1.6 x 0.8 x 0.6 mm
- Green luminous color with water-white transparent lens
- 550 to 1450 mcd luminous intensity at 20 mA
- 515 to 530 nm dominant wavelength range
- 2.4 to 3.0 V forward voltage at 20 mA
- 130° typical viewing angle, 2θ1/2
- 30 mA maximum continuous forward current
- 80 mA peak pulse forward current rating
- MSL 3 moisture sensitivity classification
- Reflow soldering limited to two cycles
Typical Applications
- Green status indication
- Compact PCB signal indicators
- SMD visual indication
- Reflow-soldered LED assemblies
- Moisture-controlled SMT production
- Small-package green light output
Procurement Notes
When requesting a quote for XL-1608UGC-06A, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package size does XL-1608UGC-06A use?
XL-1608UGC-06A uses a 1608 SMD package with outline dimensions of 1.6 x 0.8 x 0.6 mm. The datasheet states an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 550 to 1450 mcd luminous intensity, 515 to 530 nm dominant wavelength, 525 nm typical peak wavelength, 30 nm typical half wave width, and 130° typical viewing angle.
What current and voltage limits apply to this LED?
The maximum continuous forward current is 30 mA at Ta=25°C. Peak forward current is 80 mA when pulse width is <=0.1 ms and duty is <=1/10. Maximum reverse voltage is 5 V.
How should opened packages be stored before soldering?
After opening the package, storage should be <=30°C and <40% RH, with soldering completed within 168 hours or 7 days. The recommended workshop condition is <=30°C and <60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 5, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.