XL-1608UGC-06A Green SMD LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-1608UGC-06A Green SMD LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-1608UGC-06A
Manufacturer
XINGLIGHT
Package
1608 SMD, 1.6 x 0.8 x 0.6 mm
Category
LED
Product Type
Green SMD LED

Quick Sourcing Note

XL-1608UGC-06A from XINGLIGHT is a green SMD LED in a 1608 package measuring 1.6 x 0.8 x 0.6 mm. It uses a water-white transparent lens/colloid and is specified with MSL 3 moisture sensitivity. At IF=20 mA and Ta=25°C, the device provides 550 to 1450 mcd luminous intensity, 515 to 530 nm dominant wavelength, 525 nm typical peak wavelength, and 2.4 to 3.0 V forward voltage. The LED supports compact visual indication, status lighting, panel indicators, and small equipment displays where a 130° typical viewing angle and green emission are required.

Specifications

TypeDescription
Part NumberXL-1608UGC-06A
ManufacturerXINGLIGHT
Product TypeGreen SMD LED
CategoryLED
Package / Case1608 SMD, 1.6 x 0.8 x 0.6 mm
Outline Dimensions1.6 x 0.8 x 0.6 mm; L/W/H
Luminous ColorGreen; water-white transparent lens/colloid
Moisture Sensitivity LevelMSL 3; stated moisture sensitivity level
Maximum Power Dissipation100 mW at Ta=25°C
Maximum Continuous Forward Current30 mA at Ta=25°C
Peak Forward Current80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C
Maximum Reverse Voltage5 V at Ta=25°C
ESD Rating2000 V; antistatic ability, Ta=25°C
Operating Temperature Range-40 to +85°C; TOPR
Storage Temperature Range-40 to +85°C; TSTR
Lead Soldering Temperature/Time260°C, <=6 s; TSOL
Luminous Intensity550 to 1450 mcd; IF=20 mA, Ta=25°C
Dominant Wavelength515 to 530 nm; IF=20 mA, Ta=25°C
Peak Wavelength525 nm typ; IF=20 mA, Ta=25°C
Forward Voltage2.4 to 3.0 V; IF=20 mA, Ta=25°C
Viewing Angle130° typ; 2θ1/2, IF=20 mA, Ta=25°C
Half Wave Width30 nm typ; IF=20 mA, Ta=25°C
Reverse Current<=1 µA; VR=5 V, Ta=25°C
Brightness BinningE5: 550-600, E6: 600-700, E7: 700-800, E8: 800-900, E9: 900-1000, F1: 1000-1150, F2: 1150-1300, F3: 1300-1450 mcd; IF=20 mA, brightness error ±10%
Voltage BinningM18-6: 2.4-2.5, M18-7: 2.5-2.6, M18-8: 2.6-2.7, M18-9: 2.7-2.8, M19-1: 2.8-2.9, M19-2: 2.9-3.0 V; IF=20 mA, voltage error ±0.1 V
Wavelength BinningHG02: 515-520, HG03: 520-525, HG04: 525-530 nm; IF=20 mA, wavelength error ±1 nm
General Test Environment Temperature25±5°C; unless otherwise indicated
Working Life Test1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA
High Temperature High Humidity Storage Test240 hours ±2 hours; IR reflow in-board 2 times; Ta=85±5°C, RH=90-95%
High Temperature Storage Test1000 hours; Ta=85±5°C
Low Temperature Storage Test1000 hours; Ta=-40±5°C
Cold and Hot Cycle Test50 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min
Hot and Cold Impact Test50 cycles; IR reflow in-board 2 times; 100±5°C for 20 min, -40±5°C for 20 min
Anti-tin Test260±5°C, 10±1 s, 2 times; soldering temperature T.sol
Lead Process Reflow ProfilePeak 235°C +5/-0°C for 10-15 s; ramp max 3°C/s from 183°C to peak; 125±25°C <=120 s; above 183°C for 60-150 s; cooling max 6°C/s
Lead-free Reflow ProfilePeak 255°C +0/-5°C for 5-10 s; ramp max 3°C/s from 217°C to peak; 175±25°C <=180 s; above 217°C for 60-120 s; cooling max 6°C/s
Solderability Test235±5°C, immersion time 2±0.5 s; immersion speed 25±2.5 mm/s; tin loading rate >=95% pad area
Outline Dimension Tolerance±0.25 mm; unless otherwise noted
Tape/Reel Dimension Tolerance±0.1 mm; belt and disk dimensions
Hand Soldering Limit<300°C, <3 s per terminal, one time only; soldering iron power recommended below 30 W
Recommended Maximum Welding Temperature240±5°C for 6 s; product recommendation
Reflow Soldering CyclesMaximum 2 times; reflow soldering
Cleaning ConditionAlcohol cleaning under 30°C for 3 min or under 50°C for 30 s; after soldering
Ultrasonic Cleaning Power<=300 W; pretest required to confirm no LED damage
Unopened Storage Condition<=30°C, <60% RH, use within 1 year; before opening moisture-proof anti-static package
Opened Storage Condition<=30°C, <40% RH, solder within 168 hours; after opening package
Recommended Workshop Condition<=30°C, <60% RH; operation/workshop environment
Baking Condition60±5°C for 24 hours; if moisture absorbent material faded or storage time exceeded
Datasheet Statusrequest_only

Product Overview

XL-1608UGC-06A is a XINGLIGHT green SMD LED supplied in a 1608 surface-mount package with 1.6 x 0.8 x 0.6 mm outline dimensions. The emitted luminous color is green, with a water-white transparent lens/colloid construction. Optical performance at IF=20 mA and Ta=25°C includes 550 to 1450 mcd luminous intensity, 515 to 530 nm dominant wavelength, 525 nm typical peak wavelength, 30 nm typical half-wave width, and 130° typical viewing angle.

Electrical ratings at Ta=25°C include 100 mW maximum power dissipation, 30 mA maximum continuous forward current, 80 mA peak forward current under the stated pulse condition, 5 V maximum reverse voltage, and 2000 V ESD rating. Forward voltage is specified from 2.4 to 3.0 V at IF=20 mA, while reverse current is limited to <=1 µA at VR=5 V.

Assembly data includes MSL 3 handling, reflow limits, hand-soldering limits, cleaning conditions, and storage controls. The part is suited to compact green indication tasks such as status indicators, small display lighting, and panel indication.

Key Features

  • Green SMD LED in 1608 package
  • 1.6 x 0.8 x 0.6 mm outline
  • Water-white transparent lens and colloid
  • 550 to 1450 mcd at 20 mA
  • 515 to 530 nm dominant wavelength
  • 2.4 to 3.0 V forward voltage
  • 130° typical viewing angle at 20 mA
  • 30 mA maximum continuous forward current
  • MSL 3 moisture sensitivity classification
  • -40 to +85°C operating temperature range
  • 2000 V ESD antistatic rating
  • Maximum two reflow soldering cycles

Typical Applications

  • PCB status indicators
  • Compact green signal lights
  • Small equipment display indicators
  • Panel indication circuits
  • Backlit symbol indicators
  • Portable device indicator LEDs
  • Control board visual feedback

Procurement Notes

When requesting a quote for XL-1608UGC-06A, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package size does XL-1608UGC-06A use?

XL-1608UGC-06A uses a 1608 SMD package with outline dimensions of 1.6 x 0.8 x 0.6 mm. The listed outline dimension tolerance is ±0.25 mm unless otherwise noted.

What optical output is specified at 20 mA?

At IF=20 mA and Ta=25°C, the LED is specified for 550 to 1450 mcd luminous intensity, 515 to 530 nm dominant wavelength, 525 nm typical peak wavelength, and 130° typical viewing angle.

What are the main electrical ratings?

At Ta=25°C, the device is rated for 100 mW maximum power dissipation, 30 mA maximum continuous forward current, 80 mA peak forward current under the stated pulse condition, and 5 V maximum reverse voltage.

What storage conditions apply after opening the package?

After opening the package, the datasheet specifies storage at <=30°C and <40% RH, with soldering within 168 hours. If storage time is exceeded or the moisture absorbent material has faded, baking is specified at 60±5°C for 24 hours.

How many reflow soldering cycles are allowed?

The datasheet specifies a maximum of two reflow soldering cycles. Lead and lead-free reflow profiles are both provided, including peak temperature, ramp, preheat, time-above-liquidus, and cooling limits.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 6, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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