XL-1608WWC-06 Warm White SMD LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-1608WWC-06 Warm White SMD LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-1608WWC-06
Manufacturer
XINGLIGHT
Package
1608 SMD, 1.6 mm x 0.8 mm x 0.6 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-1608WWC-06 from XINGLIGHT is a warm white SMD LED in a 1608 package measuring 1.6 x 0.8 x 0.6 mm. The device uses yellow colloid and is specified for 500 to 1000 mcd luminous intensity at IF=20 mA and Ta=25°C. Key electrical ratings include 2.7 to 3.3 V forward voltage, 20 mA maximum continuous forward current, 70 mW maximum power dissipation, 5 V maximum reverse voltage, and 1 µA maximum reverse current at VR=5 V. It supports compact warm-white indication and illumination designs requiring a 130° typical viewing angle, MSL 3 handling, and RoHS-compliant LED sourcing.

Specifications

TypeDescription
Part NumberXL-1608WWC-06
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Package / Case1608 SMD, 1.6 mm x 0.8 mm x 0.6 mm
Outline Dimensions1.6 x 0.8 x 0.6 mm; L/W/H
Luminous ColorWarm white; yellow colloid
Colloid ColorYellow; warm white LED
Moisture Sensitivity LevelMSL 3; moisture sensitivity level
RoHS ComplianceComplies with RoHS directive; environmental protection products
Maximum Power Dissipation70 mW; Ta=25°C
Maximum Continuous Forward Current20 mA; Ta=25°C
Peak Forward Current80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C
Maximum Reverse Voltage5 V; Ta=25°C
ESD Withstand Voltage2000 V; Ta=25°C
Operating Temperature Range-40 to +85°C; Ta=25°C absolute maximum rating table
Storage Temperature Range-40 to +85°C; Ta=25°C absolute maximum rating table
Lead Soldering Temperature/Time260°C, <=6 s; absolute maximum rating
Luminous Intensity500 to 1000 mcd; IF=20 mA, Ta=25°C
Color Temperature2500 to 3000 K; IF=20 mA, Ta=25°C
Chromaticity Coordinate X0.4628 typ; IF=20 mA, Ta=25°C
Chromaticity Coordinate Y0.4252 typ; IF=20 mA, Ta=25°C
Forward Voltage2.7 to 3.3 V; IF=20 mA, Ta=25°C
Viewing Angle130° typ; 2θ1/2, IF=20 mA, Ta=25°C
Reverse Current1 µA max; VR=5 V, Ta=25°C
Brightness Bin E4500 to 550 mcd; IF=20 mA
Brightness Bin E5550 to 600 mcd; IF=20 mA
Brightness Bin E6600 to 700 mcd; IF=20 mA
Brightness Bin E7700 to 800 mcd; IF=20 mA
Brightness Bin E8800 to 900 mcd; IF=20 mA
Brightness Bin E9900 to 1000 mcd; IF=20 mA
Brightness Measurement Tolerance±10%; brightness grading
Voltage Bin M18-92.7 to 2.8 V; IF=20 mA
Voltage Bin M19-12.8 to 2.9 V; IF=20 mA
Voltage Bin M19-22.9 to 3.0 V; IF=20 mA
Voltage Bin M19-33.0 to 3.1 V; IF=20 mA
Voltage Bin M19-43.1 to 3.2 V; IF=20 mA
Voltage Bin M19-53.2 to 3.3 V; IF=20 mA
Voltage Measurement Tolerance±0.1 V; voltage grading
Chromaticity Coordinate Tolerance±0.01; color grading
Default Test Ambient Temperature25±5°C; unless otherwise indicated
Working Life Test1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA
High Temperature High Humidity Storage Test240 hours; Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times
High Temperature Storage Test1000 hours; Ta=85±5°C
Low Temperature Storage Test1000 hours; Ta=-40±5°C
Cold and Hot Cycle Test100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min
Hot and Cold Impact Test100 cycles; IR reflow in-board 2 times; 100±5°C for 20 min and -40±5°C for 20 min
Anti-Tin Test260±5°C for 10±1 s, 2 times; soldering temperature T.sol
Reflow Soldering LimitMaximum 2 times; reflow soldering
Recommended Maximum Reflow Temperature240±5°C for 6 s; product recommended maximum welding temperature
Hand Soldering Iron Power<30 W; hand soldering recommended only for repair/rework
Hand Soldering Temperature<300°C; each terminal one time only
Hand Soldering Time<3 s per terminal; each terminal one time only
Cleaning ConditionAlcohol cleaning under 30°C for 3 minutes or under 50°C for 30 seconds; after soldering
Ultrasonic Cleaning Power<=300 W; pretest cleaning conditions before use
Unopened Storage Condition<=30°C, <60% RH, within 1 year; before opening moisture-proof anti-static package
Opened Storage Condition<=30°C, <40% RH, solder within 168 hours / 7 days; after opening package
Recommended Workshop Condition<=30°C, <60% RH; product operation/workshop condition
Baking Condition60±5°C for 24 hours; if moisture absorbent material faded or storage time exceeded
Dimension Tolerance±0.25 mm; unless otherwise noted
Tape/Reel Dimensional Tolerance±0.1 mm; belt and disk dimensions
Datasheet Statusrequest_only

Product Overview

The XL-1608WWC-06 is a XINGLIGHT warm white SMD LED supplied in a compact 1608 surface-mount package. Its outline dimensions are 1.6 x 0.8 x 0.6 mm, with a yellow colloid construction used for the warm white luminous color. The datasheet identifies the component as an LED with RoHS compliance and moisture sensitivity level MSL 3.

At IF=20 mA and Ta=25°C, the LED is specified for 500 to 1000 mcd luminous intensity, 2500 to 3000 K color temperature, and 2.7 to 3.3 V forward voltage. Typical chromaticity coordinates are X=0.4628 and Y=0.4252, with a 130° typical viewing angle. Absolute maximum ratings include 20 mA continuous forward current, 80 mA peak forward current under the stated pulse condition, 70 mW power dissipation, and 5 V reverse voltage.

Assembly guidance includes a maximum of two reflow soldering cycles, a recommended maximum reflow temperature of 240±5°C for 6 seconds, and repair hand soldering below 300°C for less than 3 seconds per terminal. Storage and handling requirements include unopened storage within one year at ≤30°C and <60% RH, opened-package soldering within 168 hours at ≤30°C and <40% RH, and baking at 60±5°C for 24 hours when required.

Key Features

  • Warm white LED with yellow colloid construction
  • 1608 SMD package measuring 1.6 x 0.8 x 0.6 mm
  • 500 to 1000 mcd luminous intensity at 20 mA
  • 2500 to 3000 K warm white color temperature
  • 2.7 to 3.3 V forward voltage range
  • 130° typical viewing angle at 20 mA
  • 20 mA maximum continuous forward current
  • MSL 3 moisture sensitivity classification
  • RoHS directive compliance stated in datasheet
  • Reflow soldering limited to maximum two cycles

Typical Applications

  • Warm-white status indicators
  • Compact SMD illumination points
  • Low-profile panel indicators
  • Backlighting for compact assemblies
  • RoHS-compliant LED designs
  • MSL 3 controlled assembly flows
  • Wide-angle indication layouts

Procurement Notes

When requesting a quote for XL-1608WWC-06, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package is used for XL-1608WWC-06?

XL-1608WWC-06 uses a 1608 SMD package with outline dimensions of 1.6 x 0.8 x 0.6 mm. The datasheet also lists a general dimension tolerance of ±0.25 mm unless otherwise noted.

What are the main optical specifications at 20 mA?

At IF=20 mA and Ta=25°C, the LED is specified for 500 to 1000 mcd luminous intensity, 2500 to 3000 K color temperature, X=0.4628 typical, Y=0.4252 typical, and a 130° typical viewing angle.

What current and voltage limits apply to this LED?

The maximum continuous forward current is 20 mA at Ta=25°C. The peak forward current is 80 mA for pulse width <=0.1 ms and duty <=1/10. Forward voltage is 2.7 to 3.3 V at IF=20 mA.

What soldering guidance is listed in the datasheet?

The datasheet limits reflow soldering to a maximum of two times and recommends a maximum reflow temperature of 240±5°C for 6 seconds. Hand soldering is for repair or rework, below 30 W, below 300°C, and under 3 seconds per terminal.

How should opened packages be stored before soldering?

After opening the package, storage should be at <=30°C and <40% RH, with soldering completed within 168 hours or 7 days. If moisture indicator material faded or storage time is exceeded, baking is specified at 60±5°C for 24 hours.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 5, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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