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XL-2012UBC Blue SMD LED

Q: What package size does XL-2012UBC use?

XL-2012UBC uses a 2012 SMD package with outline dimensions of 2.0 x 1.2 x 0.8 mm. The dimensional tolerance is specified as ±0.25 mm unless otherwise noted.

Q: What are the main optical specifications at 20 mA?

At IF=20 mA and Ta=25°C, the LED has 80 to 210 mcd luminous intensity, 460 to 475 nm dominant wavelength, 465 nm typical peak wavelength, 25 nm typical half wave width, and 120° typical viewing angle.

Q: What forward voltage range is specified for this LED?

The forward voltage range is 2.6 to 3.4 V at IF=20 mA and Ta=25°C. The datasheet also lists voltage bins from M18-8 through M19-6 in 0.1 V ranges.

Q: How should opened packages be handled before soldering?

After opening the package, storage should be <=30°C and <=40% RH, and the LEDs should be soldered within 168 hours, or 7 days. Recommended workshop conditions are <=30°C and <=60% RH.

Q: How many reflow cycles are allowed for XL-2012UBC?

The datasheet states that reflow soldering should not be done more than twice. Lead-free reflow peak temperature is specified as 255°C +0/-5°C, with peak time of 5 to 10 seconds.

RFQ Available Sourcing Support Alternative Matching RoHS

Part Number: XL-2012UBC
Manufacturer: XINGLIGHT
Package: 2012 SMD, 2.0 x 1.2 x 0.8 mm
Category: LED
Product Type: Blue SMD LED

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Quick Sourcing Note

XL-2012UBC is a XINGLIGHT blue SMD LED in the LED category, supplied in a 2012 SMD package measuring 2.0 x 1.2 x 0.8 mm. It uses a transparent/water clear colloid and provides 80 to 210 mcd luminous intensity at IF=20 mA and Ta=25°C. Optical parameters include a 460 to 475 nm dominant wavelength, 465 nm typical peak wavelength, 25 nm typical half wave width, and 120° typical viewing angle. Electrical limits include 20 mA continuous forward current, 80 mA peak forward current, 5 V maximum reverse voltage, and 70 mW maximum power dissipation. Applications include compact blue indication and board-mounted visual signaling.

Specifications

Type	Description
Part Number	XL-2012UBC
Manufacturer	XINGLIGHT
Product Type	Blue SMD LED
Category	LED
Package Case	2012 SMD, 2.0 x 1.2 x 0.8 mm
Outline Dimensions	2.0 x 1.2 x 0.8 mm
Luminous Color	Blue
Moisture Sensitivity Level	MSL 3
RoHS Compliance	Complies with RoHS Directive
Maximum Power Dissipation	70 mW
Maximum Continuous Forward Current	20 mA
Peak Forward Current	80 mA
Maximum Reverse Voltage	5 V
ESD Antistatic Ability	2000 V
Operating Temperature Range	-40 to +85 °C
Storage Temperature Range	-40 to +85 °C
Lead Soldering Temperature/Time	260°C <=6 s
Luminous Intensity	80 to 210 mcd
Dominant Wavelength	460 to 475 nm
Peak Wavelength	465 nm typ
Forward Voltage	2.6 to 3.4 V
Viewing Angle	120° typ
Half Wave Width	25 nm typ
Reverse Current	<=1 µA
Brightness Bin D2	80 to 120 mcd
Brightness Bin D3	120 to 150 mcd
Brightness Bin D4	150 to 180 mcd
Brightness Bin D5	180 to 210 mcd
Voltage Bin M18-8	2.6 to 2.7 V
Voltage Bin M18-9	2.7 to 2.8 V
Voltage Bin M19-1	2.8 to 2.9 V
Voltage Bin M19-2	2.9 to 3.0 V
Voltage Bin M19-3	3.0 to 3.1 V
Voltage Bin M19-4	3.1 to 3.2 V
Voltage Bin M19-5	3.2 to 3.3 V
Voltage Bin M19-6	3.3 to 3.4 V
Wavelength Bin HB04	460 to 465 nm
Wavelength Bin HB05	465 to 470 nm
Wavelength Bin HB06	470 to 475 nm
General Test Environment Temperature	25±5°C
Working Life Test	1000 hours
High Temperature High Humidity Storage Test	240 hours ±2 hours
High Temperature Storage Test	1000 hours
Low Temperature Storage Test	1000 hours
Cold and Hot Cycle Test	100 cycles
Hot and Cold Impact Test	100 cycles
Anti-Tin Test	260±5°C, 10±1 s, 2 times
Lead Process Reflow Peak Temperature	235°C +5/-0°C
Lead-Free Reflow Peak Temperature	255°C +0/-5°C
Weldability Test	Tin loading rate >=95% pad area
Dimensional Tolerance	±0.25 mm
Tape/Reel Dimensional Tolerance	±0.1 mm
Hand Soldering Iron Power	<30 W
Hand Soldering Temperature	<300°C
Maximum Reflow Cycles	2 times
Recommended Maximum Welding Temperature	240±5°C for 6 s
Cleaning With Alcohol	30°C for 3 min or 50°C for 30 s
Ultrasonic Cleaning Power	<=300 W
Unopened Storage Condition	<=30°C, <=60% RH, use within 1 year
Opened Storage Condition	<=30°C, <=40% RH, solder within 168 hours / 7 days
Recommended Workshop Condition	<=30°C, <=60% RH
Baking Condition	60±5°C for 24 hours
Datasheet Status	request_only

Product Overview

The XL-2012UBC from XINGLIGHT is a blue SMD LED built in a 2012 package with 2.0 x 1.2 x 0.8 mm outline dimensions. The device is specified with a transparent/water clear colloid and is categorized as an LED component for compact surface-mount assemblies.

At IF=20 mA and Ta=25°C, the LED provides 80 to 210 mcd luminous intensity, 460 to 475 nm dominant wavelength, 465 nm typical peak wavelength, and 120° typical viewing angle. Forward voltage is specified from 2.6 to 3.4 V, with reverse current limited to <=1 µA at VR=5 V.

Absolute maximum ratings include 70 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current under pulsed conditions, 5 V maximum reverse voltage, and 2000 V ESD antistatic ability. The operating and storage temperature ranges are both -40 to +85°C.

Assembly guidance includes MSL 3 handling, maximum two reflow cycles, lead-free reflow peak temperature of 255°C +0/-5°C, and opened-package soldering within 168 hours at <=30°C and <=40% RH.

Key Features

Blue emission with transparent/water clear colloid
2012 SMD package, 2.0 x 1.2 x 0.8 mm
80 to 210 mcd luminous intensity at 20 mA
460 to 475 nm dominant wavelength range
2.6 to 3.4 V forward voltage at 20 mA
120° typical viewing angle at 20 mA
20 mA maximum continuous forward current
MSL 3 moisture sensitivity level
RoHS Directive compliance stated in datasheet
Lead-free reflow peak: 255°C +0/-5°C

Typical Applications

Compact blue status indication
Surface-mount visual signaling
Board-level indicator lighting
Blue wavelength display indicators
Low-profile electronic assemblies
Panel and keypad indicators

Procurement Notes

When requesting a quote for XL-2012UBC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package size does XL-2012UBC use?

XL-2012UBC uses a 2012 SMD package with outline dimensions of 2.0 x 1.2 x 0.8 mm. The dimensional tolerance is specified as ±0.25 mm unless otherwise noted.

What are the main optical specifications at 20 mA?

At IF=20 mA and Ta=25°C, the LED has 80 to 210 mcd luminous intensity, 460 to 475 nm dominant wavelength, 465 nm typical peak wavelength, 25 nm typical half wave width, and 120° typical viewing angle.

What forward voltage range is specified for this LED?

The forward voltage range is 2.6 to 3.4 V at IF=20 mA and Ta=25°C. The datasheet also lists voltage bins from M18-8 through M19-6 in 0.1 V ranges.

How should opened packages be handled before soldering?

After opening the package, storage should be <=30°C and <=40% RH, and the LEDs should be soldered within 168 hours, or 7 days. Recommended workshop conditions are <=30°C and <=60% RH.

How many reflow cycles are allowed for XL-2012UBC?

The datasheet states that reflow soldering should not be done more than twice. Lead-free reflow peak temperature is specified as 255°C +0/-5°C, with peak time of 5 to 10 seconds.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 5, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.