XL-2012UWC White SMD Chip LED

Specifications

Product Overview

XINGLIGHT XL-2012UWC is a white SMD chip LED supplied in a 2012 surface-mount package. The device outline is 2.0 x 1.2 x 0.8 mm, making it appropriate where a compact white LED package is required. The luminous color is white with yellow colloid, and the datasheet identifies the moisture sensitivity level as MSL 3.

At Ta=25°C, absolute maximum ratings include 70 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current for pulse width <=0.1 ms and duty <=1/10, and 5 V maximum reverse voltage. The operating and storage temperature ranges are both -40 to +85°C, with ESD rating of 2000 V.

Electrical and optical characteristics at IF=20 mA and Ta=25°C include 2.6-3.4 V forward voltage, 400-900 mcd luminous intensity, 7500-15000 K color temperature, x=0.29 typical and y=0.30 typical chromaticity coordinates, 120° typical viewing angle, and 1 µA maximum reverse current at VR=5 V. Assembly guidance includes 260°C <=6 s lead soldering and 240±5°C for 6 s recommended maximum reflow soldering.

Key Features

• White SMD chip LED with yellow colloid construction
• 2012 package with 2.0 x 1.2 x 0.8 mm outline
• 400-900 mcd luminous intensity at IF=20 mA
• 7500-15000 K color temperature at IF=20 mA
• 2.6-3.4 V forward voltage at IF=20 mA
• 120° typical viewing angle at IF=20 mA
• 20 mA maximum continuous forward current at Ta=25°C
• 80 mA peak forward current under specified pulse conditions
• -40 to +85°C operating temperature range
• 1 µA maximum reverse current at VR=5 V
• MSL 3 moisture sensitivity level
• 240±5°C for 6 s recommended maximum reflow soldering

Typical Applications

• White status indicators
• Compact display illumination
• Panel indicator lighting
• Small backlighting areas
• PCB-mounted white light points
• Wide-angle visual indication

Procurement Notes

When requesting a quote for XL-2012UWC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.