XL-2835BGWC-05 Ice Blue SMD LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-2835BGWC-05 Ice Blue SMD LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-2835BGWC-05
Manufacturer
XINGLIGHT
Package
2835 SMD LED, 2.8 x 3.5 x 0.8 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-2835BGWC-05 from XINGLIGHT is an ice blue SMD LED in a 2835 package measuring 2.8 x 3.5 x 0.8 mm. It emits ice blue light through a light yellow colloid and is suitable for SMT automatic production. Key electrical ratings include 2.8-3.4 V forward voltage at IF=150 mA, 33-52 lm luminous flux, 150 mA maximum continuous forward current, 300 mA peak forward current, 500 mW maximum power dissipation, 5 V maximum reverse voltage, and 2000 V ESD rating. The LED is RoHS compliant, MSL 3 rated, supplied in EIA standard packaging, and supports -40 to +85°C operation.

Specifications

TypeDescription
Part NumberXL-2835BGWC-05
ManufacturerXINGLIGHT
Product TypeIce blue SMD LED
CategoryLED
Package/Case2835 SMD LED, 2.8 x 3.5 x 0.8 mm
Component TypeLED
Outline Dimensions2.8 x 3.5 x 0.8 mm, L/W/H
Emitted ColorIce blue light
Colloid / Lens ColorLight yellow colloid
RoHS ComplianceComplied with RoHS Directive; environmental protection products
Moisture Sensitivity LevelMSL 3
Packaging StandardEIA standard packaging
Maximum Power Dissipation500 mW at Ta=25°C
Maximum Continuous Forward Current150 mA at Ta=25°C
Peak Forward Current300 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C
Maximum Reverse Voltage5 V at Ta=25°C
ESD Rating2000 V antistatic ability at Ta=25°C
Operating Temperature Range-40 to +85°C
Storage Temperature Range-40 to +85°C
Lead Soldering Temperature / Time260°C <=6 s, absolute maximum rating
Luminous Flux33-52 lm at IF=150 mA, Ta=25°C; datasheet labels parameter as Luminous Intensity with unit LM
Color TemperatureNot specified at IF=150 mA
Chromaticity Coordinate Xtyp. 0.18 at IF=150 mA
Chromaticity Coordinate Ytyp. 0.16 at IF=150 mA
Forward Voltage2.8-3.4 V at IF=150 mA
Viewing Angletyp. 120 deg, 2θ1/2, IF=150 mA
Reverse Currentmax. 5 µA at VR=5 V
Brightness Bin J433-39 lm at IF=150 mA
Brightness Bin J539-45 lm at IF=150 mA
Brightness Bin J645-52 lm at IF=150 mA
Voltage Bin N13-32.8-3.0 V at IF=150 mA
Voltage Bin N13-43.0-3.2 V at IF=150 mA
Voltage Bin N13-53.2-3.4 V at IF=150 mA
Test Environment Temperature25±5°C unless otherwise indicated
Working Life Test1000 hours; continuous lighting at maximum rated current at room temperature; table also states test at 20 mA
High Temperature High Humidity Storage Test240 hours at Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times
High Temperature Storage Test1000 hours at Ta=85±5°C
Low Temperature Storage Test1000 hours at Ta=-40±5°C
Cold and Hot Cycle Test100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min
Hot and Cold Impact Test100 cycles; IR reflow in-board 2 times; 100±5°C to -40±5°C, 20 min each
Anti-Tin Test260±5°C for 10±1 s, 2 times; T.sol soldering temperature
Lead Reflow ProfilePeak 235°C +5/-0°C for 10-15 s; ramp max 3°C/s from 183°C to peak; 125±25°C max 120 s; above 183°C for 60-150 s; cooling max 6°C/s
Lead-Free Reflow ProfilePeak 255°C +0/-5°C for 5-10 s; ramp max 3°C/s from 217°C to peak; 175±25°C max 180 s; above 217°C for 60-120 s; cooling max 6°C/s
Solderability Test235±5°C, immersion time 2±0.5 s; immersion speed 25±2.5 mm/s; tin loading rate >=95% pad area
Mechanical Dimension Tolerance±0.25 mm unless otherwise noted
Tape/Reel Dimension Tolerance±0.1 mm for belt and disk dimensions
Hand Soldering Limit<300°C, <3 s per terminal, one time only; soldering iron power recommended below 30 W; repair/rework only
Maximum Reflow Count2 times for reflow soldering
Recommended Maximum Welding Temperature240±5°C for 6 s
Cleaning ConditionAlcohol cleaning under 30°C for 3 min or under 50°C for 30 s after soldering
Ultrasonic Cleaning Powermax. 300 W; pretest recommended
Unopened Storage Condition<=30°C, <60% RH, use within 1 year before opening moisture-proof anti-electrostatic package
Opened Storage Condition<=30°C, <40% RH, solder within 168 hours / 7 days after opening package
Recommended Workshop Condition<=30°C, <60% RH
Baking Condition60±5°C for 24 hours if moisture absorbent material faded or LEDs exceeded storage time
Datasheet SourceManufacturer technical datasheet
Datasheet Statusrequest_only

Product Overview

XL-2835BGWC-05 is an XINGLIGHT ice blue SMD LED designed in a 2835 surface-mount package. The package outline is 2.8 x 3.5 x 0.8 mm, with light yellow colloid and ice blue emitted light. The device is described as suitable for SMT automatic production and uses EIA standard packaging.

At IF=150 mA, the datasheet specifies 2.8-3.4 V forward voltage, 33-52 lm luminous flux, chromaticity coordinates of typ. x=0.18 and y=0.16, and a typ. 120 degree viewing angle. Absolute maximum ratings at Ta=25°C include 500 mW power dissipation, 150 mA continuous forward current, 300 mA peak forward current under pulse conditions, 5 V reverse voltage, and 2000 V antistatic capability.

Assembly and handling data include MSL 3 classification, RoHS compliance, a maximum of two reflow cycles, lead-free reflow peak of 255°C +0/-5°C for 5-10 s, and opened-package storage at <=30°C and <40% RH with soldering within 168 hours.

Key Features

  • 2835 SMD LED package, 2.8 x 3.5 x 0.8 mm
  • Ice blue emitted light with light yellow colloid
  • Forward voltage range of 2.8-3.4 V at 150 mA
  • 33-52 lm luminous flux at IF=150 mA
  • Typical 120 degree viewing angle at IF=150 mA
  • 150 mA maximum continuous forward current at Ta=25°C
  • 300 mA peak forward current under specified pulse conditions
  • 2000 V ESD rating at Ta=25°C
  • RoHS compliant and MSL 3 classified
  • Supports -40 to +85°C operating temperature
  • EIA standard packaging for SMT automatic production
  • Lead-free reflow peak 255°C +0/-5°C for 5-10 s

Typical Applications

  • Ice blue LED indication
  • SMT lighting assemblies
  • Surface-mount indicator boards
  • Color lighting modules
  • Electronic panel illumination
  • Low-profile LED assemblies
  • RoHS-compliant LED designs
  • Reflow-soldered PCB products

Procurement Notes

When requesting a quote for XL-2835BGWC-05, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package is used for XL-2835BGWC-05?

XL-2835BGWC-05 uses a 2835 SMD LED package with outline dimensions of 2.8 x 3.5 x 0.8 mm. The mechanical dimension tolerance is ±0.25 mm unless otherwise noted.

What are the main electrical ratings of this LED?

At Ta=25°C, maximum ratings include 500 mW power dissipation, 150 mA continuous forward current, 300 mA peak forward current under specified pulse conditions, 5 V reverse voltage, and 2000 V ESD rating.

What optical output is specified at 150 mA?

At IF=150 mA, the datasheet specifies 33-52 lm luminous flux, typical chromaticity coordinates of x=0.18 and y=0.16, and a typical 120 degree viewing angle.

What storage rules apply after opening the package?

After opening the package, the LED should be stored at <=30°C and <40% RH, then soldered within 168 hours or 7 days. Baking is specified at 60±5°C for 24 hours if storage time is exceeded.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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