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XL-3210RGBC-YG RGB SMD LED

Q: What package is used for XL-3210RGBC-YG?

XL-3210RGBC-YG uses an SMD 3210 package with outline dimensions of 3.2 x 1.0 x 1.5 mm. The listed outline dimension tolerance is ±0.25 mm unless otherwise noted.

Q: What are the RGB luminous intensity ratings?

At IF=20 mA and Ta=25°C, the typical luminous intensity values are 200 mcd for red, 800 mcd for green, and 180 mcd for blue.

Q: What operating temperature range is specified?

The operating ambient temperature range is -40°C to +85°C. The storage ambient temperature range is also specified as -40°C to +85°C.

Q: What soldering limits apply to this LED?

The absolute maximum reflow soldering condition is 260°C for 6 s, while manual soldering is listed at 300°C for 3 s. The product recommendation is 240±5°C for 6 s and a maximum of two reflow cycles.

Q: What storage conditions are specified after opening?

After opening the package, storage should be <=30°C and <40% RH, with soldering within 168 hours or 7 days. Baking is specified at 60±5°C for 24 hours if storage limits are exceeded or package conditions fail.

RFQ Available Sourcing Support Alternative Matching RoHS

Part Number: XL-3210RGBC-YG
Manufacturer: XINGLIGHT
Package: SMD 3210, 3.2 x 1.0 x 1.5 mm
Category: LED
Product Type: SMD LED

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Quick Sourcing Note

XL-3210RGBC-YG from XINGLIGHT is an RGB SMD LED in an SMD 3210 package measuring 3.2 x 1.0 x 1.5 mm. It provides red, green, and blue emission through transparent/water colloid construction. At IF=20 mA and Ta=25°C, typical luminous intensity is 200 mcd red, 800 mcd green, and 180 mcd blue, with a typical 120° viewing angle. Forward voltage ranges are 1.9-2.3 V for red and 2.7-3.3 V for green and blue. The device supports -40°C to +85°C operation, MSL 3 handling, RoHS-compliant processing, and controlled reflow or hand-soldering assembly.

Specifications

Type	Description
Part Number	XL-3210RGBC-YG
Manufacturer	XINGLIGHT
Product Type	SMD LED
Category	LED
Package / Case	SMD 3210, 3.2 x 1.0 x 1.5 mm
Outline Dimensions	3.2 x 1.0 x 1.5 mm; L/W/H
Luminous Color	Red, Green, Blue; transparent/water colloid
Moisture Sensitivity Level	MSL 3
RoHS Compliance	Complied with RoHS directive
Power Dissipation Red	50 mW; Ta=25°C
Power Dissipation Green	70 mW; Ta=25°C
Power Dissipation Blue	70 mW; Ta=25°C
Peak Forward Current Red	80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C
Peak Forward Current Green	80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C
Peak Forward Current Blue	80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C
Forward Working Current Red	20 mA; Ta=25°C
Forward Working Current Green	20 mA; Ta=25°C
Forward Working Current Blue	20 mA; Ta=25°C
Reverse Voltage Red	5 V; Ta=25°C
Reverse Voltage Green	5 V; Ta=25°C
Reverse Voltage Blue	5 V; Ta=25°C
ESD Rating	2000 V; antistatic ability
Operating Ambient Temperature	-40°C to +85°C; Topr
Storage Ambient Temperature	-40°C to +85°C; Tstg
Reflow Soldering Condition	260°C, 6 s; Tsol absolute maximum rating
Manual Soldering Condition	300°C, 3 s; Tsol
Luminous Intensity Red	typ 200 mcd; IF=20 mA, Ta=25°C
Luminous Intensity Green	typ 800 mcd; IF=20 mA, Ta=25°C
Luminous Intensity Blue	typ 180 mcd; IF=20 mA, Ta=25°C
Dominant Wavelength Red	620-630 nm; IF=20 mA, Ta=25°C
Dominant Wavelength Green	515-530 nm; IF=20 mA, Ta=25°C
Dominant Wavelength Blue	460-475 nm; IF=20 mA, Ta=25°C
Peak Wavelength Red	typ 620 nm; IF=20 mA, Ta=25°C
Peak Wavelength Green	typ 525 nm; IF=20 mA, Ta=25°C
Peak Wavelength Blue	typ 465 nm; IF=20 mA, Ta=25°C
Half Wave Width Red	typ 20 nm; IF=20 mA, Ta=25°C
Half Wave Width Green	typ 30 nm; IF=20 mA, Ta=25°C
Half Wave Width Blue	typ 25 nm; IF=20 mA, Ta=25°C
Forward Voltage Red	1.9-2.3 V; IF=20 mA, Ta=25°C
Forward Voltage Green	2.7-3.3 V; IF=20 mA, Ta=25°C
Forward Voltage Blue	2.7-3.3 V; IF=20 mA, Ta=25°C
Viewing Angle	typ 120°; 2θ1/2, R/G/B, IF=20 mA, Ta=25°C
Reverse Current Red	max 1 uA; VR=5 V, Ta=25°C
Reverse Current Green	max 1 uA; VR=5 V, Ta=25°C
Reverse Current Blue	max 1 uA; VR=5 V, Ta=25°C
Brightness Bin D3	120-150 mcd; IF=20 mA
Brightness Bin D4	150-180 mcd; IF=20 mA
Brightness Bin D5	180-210 mcd; IF=20 mA
Brightness Bin D6	210-240 mcd; IF=20 mA
Brightness Bin D7	240-270 mcd; IF=20 mA
Brightness Bin E7	700-800 mcd; IF=20 mA
Brightness Bin E8	800-900 mcd; IF=20 mA
Brightness Bin E9	900-1000 mcd; IF=20 mA
Brightness Bin F1	1000-1150 mcd; IF=20 mA
Brightness Bin F2	1150-1300 mcd; IF=20 mA
Voltage Bin N11-4	1.9-2.1 V; IF=20 mA
Voltage Bin N11-5	2.1-2.3 V; IF=20 mA
Voltage Bin N11-8	2.7-2.9 V; IF=20 mA
Voltage Bin N11-9	2.9-3.1 V; IF=20 mA
Voltage Bin N12-1	3.1-3.3 V; IF=20 mA
Wavelength Bin HR02	620-625 nm; IF=20 mA
Wavelength Bin HG02	515-520 nm; IF=20 mA
Wavelength Bin HG03	520-525 nm; IF=20 mA
Wavelength Bin HG04	525-530 nm; IF=20 mA
Wavelength Bin HB04	460-465 nm; IF=20 mA
Wavelength Bin HB05	465-470 nm; IF=20 mA
Wavelength Bin HB06	470-475 nm; IF=20 mA
Default Test Environment Temperature	25±5°C; unless otherwise indicated
Moisture Proof Grade Test	260°C max reflow, 10 s, two reflows; precondition 30°C, 70% RH, 168 h; 0/22 failures; JEITA ED-4701 300/301
Lead-Free Reflow Reliability Test	245±5°C max reflow, 5 s; 0/22 failures; JEITA ED-4701 303/303A
Thermal Cycling Test	100 cycles, -40°C 30 min to 25°C 5 min to 100°C 30 min to 25°C 5 min; 0/22 failures; JESD22-A104
Thermal Shock Test	100 cycles, -35°C 15 min, 3 min conversion, 85°C 15 min; 0/22 failures; JESD22-A106
High Temperature Storage Test	1000 h at Ta=100°C; 0/22 failures; JESD22-A103
Low Temperature Storage Test	1000 h at Ta=-40°C; 0/22 failures; JESD22-A119
Normal Temperature Aging Test	1000 h at Ta=25°C, IF=20 mA; 0/22 failures; JESD22-A108
Failure Criterion Forward Voltage	> U.S.L x 1.1; IF=20 mA
Failure Criterion Light Intensity	< L.S.L x 0.7; IF=20 mA
Failure Criterion Reverse Current	> U.S.L x 2.0; VR=5 V
Outline Dimension Tolerance	±0.25 mm; unless otherwise noted
Tape/Reel Dimension Tolerance	±0.1 mm; belt and disk dimensions
Hand Soldering Iron Power	<30 W; recommended for repair/rework
Hand Soldering Temperature	<300°C; each terminal once, less than 3 s
Maximum Reflow Count	2 times; reflow soldering
Recommended Maximum Welding Temperature	240±5°C for 6 s; product recommendation
Cleaning Condition Alcohol	Under 30°C for 3 min or under 50°C for 30 s; after soldering
Ultrasonic Cleaning Power	max 300 W; pretest required
Unopened Storage Condition	<=30°C, <60% RH, use within 1 year; before opening package
Opened Storage Condition	<=30°C, <40% RH, solder within 168 h / 7 days; after opening package
Recommended Workshop Condition	<=30°C, <60% RH; operation/workshop environment
Baking Condition	60±5°C for 24 h; if desiccant/package failed or storage time exceeded
Datasheet Status	request_only

Product Overview

XL-3210RGBC-YG is a XINGLIGHT RGB SMD LED supplied in an SMD 3210 package with 3.2 x 1.0 x 1.5 mm outline dimensions. The device emits red, green, and blue light and uses a transparent/water colloid configuration.

Electrical and optical ratings are specified at IF=20 mA and Ta=25°C for the main characteristics. Typical luminous intensity is 200 mcd for red, 800 mcd for green, and 180 mcd for blue. Dominant wavelength ranges are 620-630 nm red, 515-530 nm green, and 460-475 nm blue, with a typical 120° viewing angle.

The LED is rated for -40°C to +85°C operating and storage ambient temperature. Assembly guidance includes MSL 3 handling, a maximum of two reflow cycles, recommended maximum welding temperature of 240±5°C for 6 s, and hand soldering below 300°C for less than 3 s per terminal.

Key Features

RGB emission: red, green, and blue channels
SMD 3210 package, 3.2 x 1.0 x 1.5 mm
Typical 120° viewing angle at IF=20 mA
Red luminous intensity typ 200 mcd at 20 mA
Green luminous intensity typ 800 mcd at 20 mA
Blue luminous intensity typ 180 mcd at 20 mA
Operating ambient temperature from -40°C to +85°C
MSL 3 moisture sensitivity classification
RoHS directive compliant process
2000 V antistatic ability rating

Typical Applications

RGB indicator lighting
Compact surface-mount displays
Color status indicators
Backlighting assemblies
Signal and panel indicators
Multicolor electronic equipment indicators

Procurement Notes

When requesting a quote for XL-3210RGBC-YG, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package is used for XL-3210RGBC-YG?

XL-3210RGBC-YG uses an SMD 3210 package with outline dimensions of 3.2 x 1.0 x 1.5 mm. The listed outline dimension tolerance is ±0.25 mm unless otherwise noted.

What are the RGB luminous intensity ratings?

At IF=20 mA and Ta=25°C, the typical luminous intensity values are 200 mcd for red, 800 mcd for green, and 180 mcd for blue.

What operating temperature range is specified?

The operating ambient temperature range is -40°C to +85°C. The storage ambient temperature range is also specified as -40°C to +85°C.

What soldering limits apply to this LED?

The absolute maximum reflow soldering condition is 260°C for 6 s, while manual soldering is listed at 300°C for 3 s. The product recommendation is 240±5°C for 6 s and a maximum of two reflow cycles.

What storage conditions are specified after opening?

After opening the package, storage should be <=30°C and <40% RH, with soldering within 168 hours or 7 days. Baking is specified at 60±5°C for 24 hours if storage limits are exceeded or package conditions fail.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.