Specifications
| Type | Description |
|---|---|
| Part Number | XL-5730UGC-05 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 5730 SMD LED, 5.7 x 3.0 x 0.8 mm |
| Outline Dimensions | 5.7 x 3.0 x 0.8 mm; L/W/H |
| Luminous Color | High brightness green; transparent/water colloid |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Complies with RoHS directive |
| Maximum Power Dissipation | 500 mW; Ta=25°C |
| Maximum Continuous Forward Current | 150 mA; Ta=25°C |
| Peak Forward Current | 300 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Rating | 2000 V; antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature/Time | 260°C, <=6 s; Ta=25°C absolute maximum rating table |
| Luminous Flux | 33-52 lm; IF=150 mA, Ta=25°C |
| Dominant Wavelength | 515-530 nm; IF=150 mA, Ta=25°C |
| Peak Wavelength | 525 nm typ; IF=150 mA, Ta=25°C |
| Forward Voltage | 2.8-3.4 V; IF=150 mA, Ta=25°C |
| Viewing Angle | 120° typ; IF=150 mA, 2θ1/2, Ta=25°C |
| Half Wave Width | 30 nm typ; IF=150 mA, Ta=25°C |
| Reverse Current | <=5 µA; VR=5 V, Ta=25°C |
| Brightness Bin J4 | 33-39 lm; IF=150 mA |
| Brightness Bin J5 | 39-45 lm; IF=150 mA |
| Brightness Bin J6 | 45-52 lm; IF=150 mA |
| Voltage Bin N13-3 | 2.8-3.0 V; IF=150 mA |
| Voltage Bin N13-4 | 3.0-3.2 V; IF=150 mA |
| Voltage Bin N13-5 | 3.2-3.4 V; IF=150 mA |
| Dominant Wavelength Bin HG02 | 515-520 nm; IF=150 mA |
| Dominant Wavelength Bin HG03 | 520-525 nm; IF=150 mA |
| Dominant Wavelength Bin HG04 | 525-530 nm; IF=150 mA |
| Default Test Environment Temperature | 25 ±5 °C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; test current text states 150 mA and also 20 mA |
| High Temperature High Humidity Storage | 240 hours ±2 hours; Ta=85 ±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage | 1000 hours; Ta=85 ±5°C |
| Low Temperature Storage | 1000 hours; Ta=-40 ±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100 ±5°C for 20 min, -40 ±5°C for 20 min |
| Anti-Tin Test | 260 ±5°C, 10 ±1 s, 2 times; soldering temperature T.sol |
| Lead Reflow Peak Temperature | 235°C +5/-0°C; lead process, time at peak 10-15 s |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C; lead-free process, time at peak 5-10 s |
| Solderability Test | 235 ±5°C, immersion time 2 ±0.5 s; immersion speed 25 ±2.5 mm/s, tin loading rate >=95% pad area |
| Outline Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Tape/Reel Dimensional Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering Iron Power | <30 W; recommended only for repair/rework |
| Hand Soldering Temperature | <300°C; each terminal once, less than 3 s |
| Maximum Reflow Count | 2 times; reflow soldering |
| Recommended Maximum Welding Temperature | 240 ±5°C for 6 s; product recommended maximum welding temperature |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or under 50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest recommended before cleaning |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year; before opening moisture-proof anti-static package |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 hours; after opening package |
| Recommended Workshop Condition | <=30°C, <=60% RH; operation after opening package |
| Baking Condition | 60 ±5°C for 24 hours; if moisture absorbent material faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-5730UGC-05 is a XINGLIGHT 0.5W high brightness green LED supplied in a 5730 SMD LED package. The outline size is 5.7 x 3.0 x 0.8 mm, with a transparent/water colloid luminous appearance and RoHS compliance stated in the manufacturer technical datasheet.
At IF=150 mA and Ta=25°C, the LED is specified for 33-52 lm luminous flux, 515-530 nm dominant wavelength, 525 nm typical peak wavelength, and 30 nm typical half wave width. Forward voltage is 2.8-3.4 V, reverse current is <=5 µA at VR=5 V, and the viewing angle is 120° typical.
Assembly and handling data include MSL 3 moisture sensitivity, a maximum of 2 reflow cycles, recommended maximum welding temperature of 240 ±5°C for 6 s, and opened-package storage of <=30°C, <=40% RH with soldering within 168 hours. These parameters support use in surface-mount green indication, display, signage, and lighting designs where a compact 5730 LED footprint is required.
Key Features
- 5730 SMD LED package, 5.7 x 3.0 x 0.8 mm
- High brightness green output with transparent/water colloid construction
- 33-52 lm luminous flux at IF=150 mA
- 515-530 nm dominant wavelength green emission range
- 2.8-3.4 V forward voltage at IF=150 mA
- 120° typical viewing angle for broad optical coverage
- 150 mA maximum continuous forward current rating
- 500 mW maximum power dissipation at Ta=25°C
- MSL 3 moisture sensitivity level for handling control
- RoHS directive compliance stated in datasheet
Typical Applications
- Green status indication
- Surface-mount display backlighting
- Signage LED modules
- Compact panel indicators
- Green signal lighting assemblies
- PCB-mounted visual alerts
Procurement Notes
When requesting a quote for XL-5730UGC-05, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Alternatives
TOGIALED
TJ-S5730UG5W9TLC2G-A5
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
Application Verification Recommended
Related Technical Articles
FAQ
What package does XL-5730UGC-05 use?
XL-5730UGC-05 uses a 5730 SMD LED package with outline dimensions of 5.7 x 3.0 x 0.8 mm. The datasheet lists an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical specifications at 150 mA?
At IF=150 mA and Ta=25°C, the LED is specified for 33-52 lm luminous flux, 515-530 nm dominant wavelength, 525 nm typical peak wavelength, 30 nm typical half wave width, and 120° typical viewing angle.
What current and voltage ratings apply to this LED?
The maximum continuous forward current is 150 mA at Ta=25°C. The peak forward current is 300 mA for pulse width <=0.1 ms and duty <=1/10. Forward voltage is 2.8-3.4 V at IF=150 mA.
How should opened packages be stored before soldering?
After opening the moisture-proof anti-static package, storage should be <=30°C and <=40% RH, and the LEDs should be soldered within 168 hours. The recommended workshop condition is <=30°C and <=60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.