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XL-5730UGC-05 SMD LED: Thermal & Optical Bin Analysis

The XINGLIGHT XL-5730UGC-05 is a 0.5W emerald SMD LED designed for high-density commercial lighting and LCD backlights. This technical brief analyzes luminous flux bins, forward voltage tolerances, and moisture sensit...

XL-5730UGC-05 SMD LED: Thermal & Optical Bin Analysis

📌 Product Overview

💡 The XL-5730UGC-05 is a surface-mount device (SMD) LED from XINGLIGHT, utilizing InGaN technology to deliver high-brightness emerald green light within a standard 5730 footprint (5.7mm x 3.0mm). It features a water-clear colloid optimized for luminous intensity, making it suitable for compact light engines.

👇 Target applications include general commercial illumination, such as fluorescent tube replacements and downlights, as well as backlighting for LCD displays and flexible decorative strips. This component is engineered to support automated SMT processes while adhering to ROHS environmental directives.

⚙️ Typical Applications

Based on the optical characteristics and 120-degree viewing angle, the XL-5730UGC-05 is best utilized in the following scenarios:

  • Commercial Lighting: High-efficiency downlights and office lighting panels.
  • Linear Lighting: Rigid and flexible light strips requiring consistent color temperature.
  • Signage: Advertising light boxes and channel letters (advertising words).
  • Backlighting: LCD indicator lights and display panel illumination.

📊 Key Technical Specifications

💡 Performance consistency relies on strict adherence to bin codes. The following table outlines the typical optical and electrical characteristics at Ta=25℃.

ParameterSymbolMin.Typ.Max.UnitConditions
Luminous FluxΦ33-52LMIF = 150mA
Dominant Wavelengthλd515520530nmIF = 150mA
Forward VoltageVF2.8-3.4VIF = 150mA
Viewing Angle2Ø1/2-120-degIF = 150mA
Reverse CurrentIR--≤5μAVR = 5V

⚠️ Absolute Maximum Ratings & Process Limits

🔒 Exceeding these parameters may result in catastrophic failure or significant degradation of the LED junction. Design margins must account for these limits under varying ambient temperatures.

ParameterSymbolMax. ValueUnitNotes
Max Power DissipationPD500mWDependent on PCB thermal management
Max Continuous Forward CurrentIF150mA
Peak Forward CurrentIFP300mAPulse width ≤0.1ms, Duty ≤1/10
Max Reverse VoltageVR5V
ESD AbilityESD2000VHuman Body Model (HBM)
Operating TemperatureTOPR-40 ~ +85°C

📦 Package, Dimensions & Assembly Notes

The device utilizes a 5.7 x 3.0 x 0.8 mm PLCC style package with 2 pins.

  • Soldering Process: Compatible with Infrared Reflow.
  • Moisture Sensitivity: Classified as MSL 3.
    • 🚨 Floor Life: Components must be mounted within 168 hours (1 week) of opening the vacuum-sealed bag.
    • Baking is required if the floor life is exceeded.
  • Reflow Profile:
    • Lead-Free: Max peak temp 255°C (Time above 217°C: 60-120s).
    • Lead Process: Max peak temp 235°C (Time above 183°C: 60-150s).

🚀 Sourcing & Supply Considerations

When sourcing the XL-5730UGC-05, focus on the specific binning codes rather than just the base model number.

  • Binning Codes: Verify Brightness (J4-J6), Voltage (N13-3 to N13-5), and Wavelength (HG02-HG04) codes on the packaging label to ensure lot-to-lot consistency.
  • Authenticity: XINGLIGHT products typically feature EIA standard compliant packaging.
  • Procurement: Contact authorized distributors to validate current lead times for specific wavelength bins.

❓ FAQ

Q: What does the "J5" code signify on the packaging label?
A: The "J5" code represents a specific Brightness (Luminous Flux) Bin. For this model, J5 indicates a flux range between 39 and 45 Lumens at 150mA. Selecting a specific bin code ensures uniform brightness across your light fixture.

Q: Can this LED be used with a lead-based soldering process?
A: Yes. While designed for lead-free compliance (ROHS), the datasheet provides a specific profile for "Lead Process" (max 235°C), making it compatible with legacy manufacturing lines if thermal profiles are strictly controlled.

Q: What is the maximum current I can drive this LED with continuously?
A: The absolute maximum Continuous Forward Current (IF) is 150 mA. Exceeding this, even with excellent heatsinking, risks permanent thermal damage to the LED chip.

Q: Why is the Moisture Sensitivity Level (MSL) important for SMT assembly?
A: This LED is rated MSL 3. If the components are exposed to ambient air for more than 168 hours (1 week) after opening the vacuum seal before reflow, internal moisture can expand during soldering, causing "popcorning" or delamination. Pre-baking is required if this limit is exceeded.

About Leon Zhang

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

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