Specifications
| Type | Description |
|---|---|
| Part Number | XL-5730WWC-05 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 5730 SMD, 5.7 x 3.0 x 0.8 mm |
| Outline Dimensions | 5.7 x 3.0 x 0.8 mm |
| Luminous Color | High brightness warm white |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Complies with RoHS Directive |
| Maximum Power Dissipation | 500 mW |
| Maximum Continuous Forward Current | 150 mA |
| Peak Forward Current | 300 mA |
| Maximum Reverse Voltage | 5 V |
| ESD Antistatic Ability | 2000 V |
| Operating Temperature Range | -40 to +85 °C |
| Storage Temperature Range | -40 to +85 °C |
| Lead Soldering Temperature/Time | 260°C <=6 s |
| Luminous Flux | 45-70 lm |
| Color Temperature | 2800-3400 K, typ 3000 K |
| Chromaticity Coordinate X | Not specified |
| Chromaticity Coordinate Y | Not specified |
| Forward Voltage | 2.8-3.4 V |
| Color Rendering Index | Ra typ 70 |
| Viewing Angle | 120 deg typ |
| Reverse Current | 5 µA max |
| Brightness Bin J6 | 45-52 lm |
| Brightness Bin J7 | 52-60 lm |
| Brightness Bin J8 | 60-70 lm |
| Voltage Bin N13-3 | 2.8-3.0 V |
| Voltage Bin N13-4 | 3.0-3.2 V |
| Voltage Bin N13-5 | 3.2-3.4 V |
| Color Temperature Bin WW2-4 | 2800-3000 K |
| Color Temperature Bin WW4-4 | 3000-3200 K |
| Color Temperature Bin WW6-4 | 3200-3400 K |
| Test Environment Temperature | 25±5°C |
| Outline Dimension Tolerance | ±0.25 mm |
| Tape/Reel Dimension Tolerance | ±0.1 mm |
| Hand Soldering Iron Power | <30 W recommended |
| Hand Soldering Temperature | <300°C |
| Maximum Reflow Count | 2 times max |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 hours / 7 days |
| Baking Condition | 60±5°C for 24 hours |
| Datasheet Status | request_only |
Product Overview
XL-5730WWC-05 is a XINGLIGHT warm white SMD LED supplied in a 5730 package with 5.7 x 3.0 x 0.8 mm outline dimensions. The device is specified as a high brightness warm white LED with yellow colloid and complies with the RoHS Directive. Its moisture sensitivity level is MSL 3.
At IF=150 mA and Ta=25°C, the LED is specified for 45-70 lm luminous flux, 2800-3400 K color temperature with 3000 K typical, 2.8-3.4 V forward voltage, Ra 70 typical color rendering index, and 120 degree typical viewing angle. Absolute maximum ratings include 500 mW power dissipation, 150 mA continuous forward current, 300 mA peak forward current under the stated pulse condition, 5 V reverse voltage, and 2000 V ESD antistatic ability.
Assembly data includes 260°C lead soldering for up to 6 seconds, a recommended maximum welding temperature of 240±5°C for 6 seconds, and a maximum of two reflow soldering cycles. Storage guidance specifies unopened storage at <=30°C and <=60% RH for use within one year, and opened storage at <=30°C and <=40% RH with soldering within 168 hours.
Key Features
- 5730 SMD package, 5.7 x 3.0 x 0.8 mm
- High brightness warm white output with yellow colloid
- 45-70 lm luminous flux at IF=150 mA
- 2800-3400 K color temperature, 3000 K typical
- 2.8-3.4 V forward voltage at IF=150 mA
- Ra 70 typical color rendering index
- 120 degree typical viewing angle
- 150 mA maximum continuous forward current
- 300 mA peak forward current under pulse condition
- MSL 3 moisture sensitivity level
- RoHS Directive compliant
- -40 to +85°C operating temperature range
Typical Applications
- Warm white LED lighting
- SMD lighting assemblies
- 5730 LED module designs
- Low-profile illumination layouts
- Warm white indicator lighting
- Reflow-assembled LED boards
- Brightness-binned LED products
Procurement Notes
When requesting a quote for XL-5730WWC-05, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Alternatives
HARVATEK
HL-A-5730D1W-S1-08-HR5(LY)
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
Application Verification Recommended
FAQ
What package does XL-5730WWC-05 use?
XL-5730WWC-05 uses a 5730 SMD package with outline dimensions of 5.7 x 3.0 x 0.8 mm. The extracted outline dimension tolerance is ±0.25 mm unless otherwise noted.
What are the optical ratings at 150 mA?
At IF=150 mA and Ta=25°C, the LED is specified for 45-70 lm luminous flux, 2800-3400 K color temperature with 3000 K typical, Ra 70 typical color rendering index, and 120 degree typical viewing angle.
What are the main electrical limits?
At Ta=25°C, the maximum continuous forward current is 150 mA, maximum power dissipation is 500 mW, maximum reverse voltage is 5 V, and peak forward current is 300 mA under the stated pulse condition.
How should opened packages be stored before soldering?
After opening, the storage condition is <=30°C and <=40% RH, with soldering within 168 hours or 7 days. If the moisture absorbent has faded or storage time is exceeded, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.
