Specifications
| Type | Description |
|---|---|
| Part Number | XL-6048PDC-2P |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Component Type | Sensor |
| Package / Case | SMD, 6.0 x 4.8 x 1.1 mm |
| Outline Dimensions | 6.0 x 4.8 x 1.1 mm; L/W/H |
| Optical/Colloid Description | Infrared reception / black colloid; device appearance/material description |
| Power Consumption | 130 mW; Ta=25°C, absolute maximum rating |
| Reverse Voltage | 15 V; Ta=25°C, absolute maximum rating |
| Operating Ambient Temperature | -30 to +85 °C; absolute maximum rating |
| Storage Ambient Temperature | -40 to +90 °C; absolute maximum rating |
| Reflow Soldering Condition | 260 °C, 10 s; absolute maximum soldering condition |
| Manual Welding Condition | 300 °C, 3 s; absolute maximum soldering condition |
| Pulse Width Limit | ≤0.1 ms; pulse operation note |
| Duty Cycle Limit | ≤1/10; pulse operation note |
| Spectral Bandwidth Range | 400 to 1100 nm; Ta=25°C |
| Peak Sensitive Wavelength | 940 nm; Ta=25°C |
| Open Circuit Voltage | 0.45 V typ; Ee=5 mW/cm², λp=940 nm, Ta=25°C |
| Sensitive Half Angle Value | 60° typ; Ee=1 mW/cm², λp=940 nm, Ta=25°C |
| Photocurrent at 940 nm | 35 min, 40 typ, 45 max µA; Ee=1 mW/cm², λp=940 nm, VR=5 V, Ta=25°C |
| Photocurrent at 660 nm | 60 min, 65 typ, 70 max µA; Ee=1 mW/cm², λp=660 nm, VR=5 V, Ta=25°C |
| Photocurrent at 890 nm | 25 min, 30 typ, 35 max µA; Ee=1 mW/cm², λp=890 nm, VR=5 V, Ta=25°C |
| Reverse Dark Current | 30 nA max; Ee=0 mW/cm², VR=10 V, Ta=25°C |
| Reverse Breakdown Voltage | 32 min, 170 typ V; Ee=0 mW/cm², IR=100 µA, Ta=25°C |
| Rise and Fall Time | 2.5 µs typ; Ta=25°C |
| Junction Capacitance | 27 pF typ; Ee=0 mW/cm², VR=5 V, F=1 MHz, Ta=25°C |
| Brightness Grading Code L05 | 12 to 14 mcd; IF=20 mA |
| Voltage Grading Code F03 | 0.6 to 0.8 V; IF=20 mA |
| Moisture Proof Grade Test | 0/22 failures; 260°C max reflow for 10 s, two reflows; pre-reflow storage 30°C, 70% RH, 168 h; JEITA ED-4701 300301 |
| Welding Reliability Test | 0/22 failures; lead-free reflow, 245±5°C max for 5 s; JEITA ED-4701 303303A |
| Thermal Cycling Test | 0/22 failures; 300 cycles, -40°C 30 min to 25°C 5 min to 100°C 30 min to 25°C 5 min; JESD22-A104 |
| Thermal Shock Test | 0/22 failures; 300 cycles, -35°C 15 min, 3 min conversion, 85°C 15 min; JESD22-A106 |
| High Temperature Storage Test | 0/22 failures; Ta=100°C, 1000 h; JESD22-A103 |
| Low Temperature Storage Test | 0/22 failures; Ta=-40°C, 1000 h; JESD22-A119 |
| Normal Temperature Aging Test | 0/22 failures; Ta=25°C, IF=20 mA, 1000 h; JESD22-A108 |
| Failure Criterion Forward Voltage | > U.S.L x 1.1; IF=20 mA |
| Failure Criterion Radiation Intensity | < L.S.L x 0.7; IF=20 mA |
| Failure Criterion Reverse Current | > U.S.L x 2.0; VR=5 V |
| Failure Criterion Welding Reliability | solder paste covering pads <95%; welding reliability inspection |
| Outline Dimension Tolerance | ±0.20 mm; unless otherwise noted |
| Reel Dimension Tolerance | ±0.10 mm; unless otherwise noted |
| Hand Soldering Iron Power | <20 W recommended; hand soldering |
| Hand Soldering Temperature | <300°C; one time per terminal, <3 s |
| Reflow Count Limit | maximum 2 times; reflow soldering |
| Cleaning with Alcohol | ≤30°C for 3 min or ≤50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | ≤300 W recommended maximum; pretest required before cleaning |
| Unopened Storage Condition | ≤30°C, ≤60% RH, use within 1 year; before opening package |
| Opened Storage Condition | ≤30°C, ≤10% RH, solder within 168 h / 7 days; after opening package |
| Recommended Workshop Condition | ≤30°C, ≤60% RH; operation/workshop environment |
| Baking Condition | 60±5°C for 24 h; if moisture absorbent failed or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
Optical and electrical data are specified at Ta=25°C. The receiver covers a 400 to 1100 nm spectral bandwidth with 940 nm peak sensitive wavelength. Photocurrent is specified at 35 min, 40 typ, 45 max µA at 940 nm, 60 min, 65 typ, 70 max µA at 660 nm, and 25 min, 30 typ, 35 max µA at 890 nm under the listed irradiance and reverse-voltage conditions.
Key Features
- SMD package measures 6.0 x 4.8 x 1.1 mm
- Infrared reception with black colloid construction
- 400 to 1100 nm spectral bandwidth
- 940 nm peak sensitive wavelength at Ta=25°C
- 60° typical sensitive half angle
- 2.5 µs typical rise and fall time
- 30 nA maximum reverse dark current
- 27 pF typical junction capacitance
- Reflow soldering condition: 260°C for 10 s
- Operating ambient range: -30 to +85°C
Typical Applications
- Infrared reception circuits
- 940 nm optical sensing
- Visible-to-near-infrared detection
- SMD sensor board assemblies
- Pulse-limited receiver circuits
- Reflow-soldered optical modules
- Photodiode receiver evaluation
Procurement Notes
When requesting a quote for XL-6048PDC-2P, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package does XL-6048PDC-2P use?
XL-6048PDC-2P uses an SMD package with outline dimensions of 6.0 x 4.8 x 1.1 mm. The datasheet states an outline dimension tolerance of ±0.20 mm unless otherwise noted.
What wavelength range is specified for this receiver?
The specified spectral bandwidth range is 400 to 1100 nm at Ta=25°C. The peak sensitive wavelength is 940 nm under the same ambient temperature condition.
What soldering limits apply to XL-6048PDC-2P?
The absolute maximum reflow soldering condition is 260°C for 10 s, and manual welding is 300°C for 3 s. The handling guidance also limits reflow to a maximum of two times.
How should opened packages be stored before soldering?
After opening the package, storage is specified at ≤30°C and ≤10% RH, with soldering within 168 hours or 7 days. If storage time is exceeded, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.