XL-PD70-01C-TR Infrared Receiver Photodiode

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-PD70-01C-TR Infrared Receiver Photodiode

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-PD70-01C-TR
Manufacturer
XINGLIGHT
Package
SMD infrared receiver diode, 6.4 x 3.9 x 1.2 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-PD70-01C-TR from XINGLIGHT is an LED-category infrared receiver photodiode in a surface-mount infrared receiver diode package measuring 6.4 x 3.9 x 1.2 mm. It uses an infrared receiver tube with transparent colloid and is specified for 940 nm peak sensitivity. Key electrical limits include 150 mW maximum power consumption, 32 V maximum reverse voltage, 25 pF typical total capacitance, and 50 µs typical rise and fall times. The device is suited to infrared receiving applications that require operation from -20°C to +85°C, controlled reflow handling, and MSL 3 moisture precautions.

Specifications

TypeDescription
Part NumberXL-PD70-01C-TR
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Inferred CategoryLED
Component TypeSensor
Package / CaseSMD infrared receiver diode, 6.4 x 3.9 x 1.2 mm
Outline Dimensions6.4 x 3.9 x 1.2 mm; condition: L/W/H
Emission/Receiving Color and ColloidInfrared receiver tube / transparent colloid
Moisture Sensitivity LevelMSL 3
RoHS ComplianceComplies with RoHS directive
Power Consumption150 mW max
Reverse Voltage32 V max
Operating Ambient Temperature-20°C to +85°C
Storage Ambient Temperature-40°C to +85°C
Welding Conditions260°C max for 6 s max
Open-Circuit Voltage0.35 V typ; condition: λP=940 nm, Ee=5 mW/cm², Ta=25°C
Short-Circuit Current35 µA typ; condition: λP=940 nm, Ee=1 mW/cm², Ta=25°C
Reverse Light Current17 µA min, 25 µA typ; condition: λP=940 nm, VR=5 V, Ee=1 mW/cm², Ta=25°C
Reverse Dark Current5 nA typ, 30 nA max; condition: VR=10 V, Ee=0 mW/cm², Ta=25°C
Rise Time50 µs typ; condition: VR=10 V, RL=1000 Ω, Ta=25°C
Fall Time50 µs typ; condition: VR=10 V, RL=1000 Ω, Ta=25°C
Reverse Breakdown Voltage32 V min, 170 V typ; condition: Ee=0 mW/cm², IR=100 µA, Ta=25°C
Total Capacitance25 pF typ; condition: Ee=0 mW/cm², VR=5 V, f=1 MHz, Ta=25°C
Spectral Bandwidth Range400 nm min, 1100 nm max; condition: Ta=25°C
Peak Sensitivity Wavelength940 nm typ; condition: Ta=25°C
Outline Dimension Tolerance±0.30 mm; condition: Unless otherwise specified
Tape/Reel Dimensional Tolerance±0.1 mm; condition: Packaging belt and disk dimensions
Recommended Maximum Reflow Soldering Temperature240°C for 10 s; condition: Recommended product maximum welding temperature
Recommended Reflow Soldering CountOnce
Soldering Iron TemperatureLess than 300°C for less than 3 s; condition: Per terminal, soldering iron capacity less than 25 W
Unopened Storage Condition≤30°C, ≤60% RH, use within 1 year; condition: Before opening package
Opened Storage Condition≤30°C, ≤40% RH, solder within 168 hours / 7 days; condition: After opening package
Baking Condition60±5°C for 24 hours; condition: If moisture absorbent has faded or storage time exceeded
Static Field Voltage LimitLess than 100 V; condition: Within 1 foot of LED element
Datasheet SourceManufacturer technical datasheet
Datasheet Statusrequest_only

Product Overview

XL-PD70-01C-TR is a XINGLIGHT infrared receiver photodiode classified in the LED category. The device is built as an SMD infrared receiver diode with outline dimensions of 6.4 x 3.9 x 1.2 mm, using an infrared receiver tube and transparent colloid construction. Unless otherwise specified, outline dimensional tolerance is ±0.30 mm.

Electrical characteristics are centered on infrared detection, with 940 nm typical peak sensitivity and a 400 nm to 1100 nm spectral bandwidth range at Ta=25°C. The datasheet specifies 0.35 V typical open-circuit voltage, 35 µA typical short-circuit current, and 17 µA minimum to 25 µA typical reverse light current under stated 940 nm irradiance conditions. Reverse dark current is 5 nA typical and 30 nA maximum.

Assembly and storage controls are part of the device handling requirements. The part is MSL 3, supports recommended reflow at 240°C for 10 s once, and has a soldering iron limit below 300°C for less than 3 s per terminal. Storage after opening is limited to 168 hours / 7 days at ≤30°C and ≤40% RH.

Key Features

  • 6.4 x 3.9 x 1.2 mm SMD infrared receiver diode
  • Infrared receiver tube with transparent colloid construction
  • MSL 3 moisture sensitivity classification
  • Complies with RoHS directive
  • 940 nm typical peak sensitivity wavelength
  • 400 nm to 1100 nm spectral bandwidth range
  • 150 mW maximum power consumption
  • 32 V maximum reverse voltage rating
  • 50 µs typical rise and fall times
  • 25 pF typical total capacitance

Typical Applications

  • Infrared receiving circuits
  • 940 nm optical detection
  • Remote-control receiver inputs
  • SMD sensor assemblies
  • Infrared light monitoring
  • Temperature-controlled LED modules

Procurement Notes

When requesting a quote for XL-PD70-01C-TR, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What type of device is XL-PD70-01C-TR?

XL-PD70-01C-TR is an XINGLIGHT infrared receiver photodiode in the LED category. The package is an SMD infrared receiver diode measuring 6.4 x 3.9 x 1.2 mm with an infrared receiver tube and transparent colloid.

What wavelength is XL-PD70-01C-TR optimized for?

The datasheet specifies a typical peak sensitivity wavelength of 940 nm at Ta=25°C. Its spectral bandwidth range is listed from 400 nm minimum to 1100 nm maximum under the same ambient temperature condition.

What are the main soldering limits for this part?

Recommended reflow soldering is 240°C for 10 s and one reflow cycle. The datasheet also lists welding conditions of 260°C maximum for 6 s maximum and soldering iron use below 300°C for less than 3 s per terminal.

How should opened packages be stored before soldering?

After opening, the storage condition is ≤30°C and ≤40% RH, and the parts should be soldered within 168 hours or 7 days. If the moisture absorbent has faded or storage time is exceeded, baking is specified at 60±5°C for 24 hours.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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