XL-C1860P5S11-62C3C1 White High-Power SMD LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-C1860P5S11-62C3C1 White High-Power SMD LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-C1860P5S11-62C3C1
Manufacturer
XINGLIGHT
Package
XL-1860, 1.8 x 6.0 x 0.7 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-C1860P5S11-62C3C1 from XINGLIGHT is a white high-power SMD LED in an XL-1860 package measuring 1.8 x 6.0 x 0.7 mm. It uses flip chip technology with white/yellow fog colloid and is specified for 1000 to 1500 lm luminous flux at IF=1000 mA and Ta=25°C. Key electrical and optical limits include 8.7 to 9.6 V forward voltage, 5500 to 7000 K color temperature, Ra 70 minimum CRI, and a 120 degree viewing angle. It is suited for constant-current white LED lighting assemblies requiring defined thermal, soldering, storage, and binning controls.

Specifications

TypeDescription
Part NumberXL-C1860P5S11-62C3C1
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Package / CaseXL-1860, 1.8 x 6.0 x 0.7 mm
Appearance Dimension1.8 x 6.0 x 0.7 mm, L/W/H
Luminous Color and ColloidWhite / yellow fog
Chip TechnologyFlip chip technology
Moisture Sensitivity LevelMSL 3
Power Dissipation15 W max, Ta=25°C
Forward Current1500 mA max, Ta=25°C
Pulse Forward Current2000 mA max, Ta=25°C, 1/10 duty cycle, 0.1 ms pulse width
Operating Temperature-40 to +135°C
Storage Temperature-40 to +85°C
Soldering Temperature260°C for 3 sec, reflow soldering
Forward Voltage8.7 V min, 9.6 V max, IF=1000 mA, Ta=25°C
Luminous Flux1000 lm min, 1500 lm max, IF=1000 mA, Ta=25°C
Color Temperature5500 K min, 7000 K max, IF=1000 mA, Ta=25°C
Color Rendering IndexRa 70 min, IF=1000 mA, Ta=25°C
Viewing Angle120 deg, 2θ1/2, IF=1000 mA, Ta=25°C
Junction Temperature145°C max, IF=1000 mA
Thermal Resistance3-5°C/W, Rthj-s, IF=1000 mA
ESD Sensitivity2000 V, HBM
Radiant Flux Measurement Tolerance±10%
Forward Voltage Measurement Tolerance±3%
Peak Wavelength Measurement Tolerance±3 nm
Brightness Grade N51000-1100 lm, IF=1000 mA
Brightness Grade N61100-1200 lm, IF=1000 mA
Brightness Grade N71200-1350 lm, IF=1000 mA
Brightness Grade N81350-1500 lm, IF=1000 mA
Voltage Grade S13-38.7-9.0 V, IF=1000 mA
Voltage Grade S13-49.0-9.3 V, IF=1000 mA
Voltage Grade S13-59.3-9.6 V, IF=1000 mA
Color Temperature Bin UW7-105500-6000 K, IF=1000 mA
Color Temperature Bin UW9-106000-6500 K, IF=1000 mA
Color Temperature Bin UW11-106500-7000 K, IF=1000 mA
Default Test Environment Temperature25±5°C, unless otherwise indicated
Outline Dimension Tolerance±0.1 mm, if unmarked
Recommended Stencil Thickness0.6-1 mm for solder paste stencil
Hand Soldering Iron Power<30 W, recommended for repair/rework only
Hand Soldering Temperature<300°C, each terminal once, less than 3 sec
Maximum Reflow Cycles2 times max, reflow soldering
Recommended Maximum Welding Temperature240±5°C for 6 s, product recommendation
Shelf Life Before Opening1 year in sealed moisture-proof anti-static package with desiccant
Storage Before Opening≤30°C, ≤60% RH before opening package
Storage After Opening≤30°C, ≤40% RH, solder within 168 hours / 7 days
Baking Condition60±5°C for 24 hours if desiccant/package fails or storage time exceeded
Drive MethodConstant current drive required; output current should follow datasheet operating range
Cooling Medium Dielectric WithstandAt least 500 V for thermal pad / heat sink assembly
Datasheet Statusrequest_only

Product Overview

XL-C1860P5S11-62C3C1 is a XINGLIGHT white high-power SMD LED built in the XL-1860 package. The package outline is 1.8 x 6.0 x 0.7 mm, with unmarked outline dimensions controlled to ±0.1 mm. The device uses flip chip technology and has a white luminous color with yellow fog colloid.

At IF=1000 mA and Ta=25°C, the LED is specified for 8.7 to 9.6 V forward voltage, 1000 to 1500 lm luminous flux, 5500 to 7000 K color temperature, Ra 70 minimum color rendering index, and a 120 degree viewing angle. Absolute and thermal limits include 15 W maximum power dissipation, 1500 mA maximum forward current, 145°C maximum junction temperature, and 3-5°C/W junction-to-solder thermal resistance.

Assembly controls include MSL 3 handling, reflow soldering at 260°C for 3 seconds, two maximum reflow cycles, and a recommended 240±5°C for 6 seconds welding condition. The datasheet also requires constant current drive and a cooling medium dielectric withstand of at least 500 V for thermal pad or heat sink assemblies.

Key Features

  • XL-1860 SMD package, 1.8 x 6.0 x 0.7 mm
  • White output with yellow fog colloid
  • Flip chip LED structure
  • 1000 to 1500 lm at IF=1000 mA
  • 8.7 to 9.6 V forward voltage range
  • 5500 to 7000 K color temperature range
  • Ra 70 minimum color rendering index
  • 120 degree viewing angle at IF=1000 mA
  • 15 W maximum power dissipation at Ta=25°C
  • Constant current drive required by datasheet
  • MSL 3 moisture sensitivity classification
  • 2000 V HBM ESD sensitivity

Typical Applications

  • High-power white SMD lighting
  • Cool-white LED light engines
  • Constant-current LED modules
  • Compact surface-mount luminaires
  • Thermally managed LED assemblies
  • Reflow-soldered LED boards
  • White illumination with 120 degree emission

Procurement Notes

When requesting a quote for XL-C1860P5S11-62C3C1, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

Alternatives

LITEON

LTPA-H3S4238

Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.

Application Verification Recommended

FAQ

What package is used for XL-C1860P5S11-62C3C1?

XL-C1860P5S11-62C3C1 uses the XL-1860 SMD package. The datasheet lists the appearance dimensions as 1.8 x 6.0 x 0.7 mm, with an unmarked outline dimension tolerance of ±0.1 mm.

What are the main optical ratings at 1000 mA?

At IF=1000 mA and Ta=25°C, the LED is specified for 1000 to 1500 lm luminous flux, 5500 to 7000 K color temperature, Ra 70 minimum color rendering index, and a 120 degree viewing angle.

What drive method does the datasheet require?

The datasheet specifies that XL-C1860P5S11-62C3C1 requires constant current drive. The output current should follow the datasheet operating range, with 1500 mA listed as the maximum forward current at Ta=25°C.

What handling and soldering limits apply to this LED?

The device is rated MSL 3. Reflow soldering is specified at 260°C for 3 seconds with two maximum reflow cycles, and the product recommendation lists 240±5°C for 6 seconds as the recommended maximum welding temperature.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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