Specifications
| Type | Description |
|---|---|
| Part Number | XL-C1860P4S10-62C3C1 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD LED, 1.8 x 6.0 x 0.7 mm |
| Appearance Dimensions | 1.8 x 6.0 x 0.7 mm; L/W/H |
| Luminous Color and Colloid | White / yellow fog |
| Technology | Flip chip |
| Moisture Sensitivity Level | MSL 3 |
| Power Dissipation | 10 W max; Ta=25°C |
| Forward Current | 1000 mA max; Ta=25°C |
| Pulse Forward Current | 1500 mA max; 1/10 duty cycle, 0.1 ms pulse width, Ta=25°C |
| Operating Temperature | -40 to +135°C; Ta=25°C absolute maximum rating table |
| Storage Temperature | -40 to +85°C; Ta=25°C absolute maximum rating table |
| Soldering Temperature | 260°C for 6 s; reflow soldering |
| Forward Voltage | 8.7 V min, 9.6 V max; IF=700 mA, Ta=25°C |
| Luminous Flux | 800 lm min, 1200 lm max; IF=700 mA, Ta=25°C |
| Color Temperature | 5500 K min, 7000 K typ; IF=700 mA, Ta=25°C |
| Color Rendering Index | 70 min; IF=700 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=700 mA, Ta=25°C |
| Junction Temperature | 145°C max; IF=700 mA, Ta=25°C |
| Thermal Resistance | 3-5 °C/W max; Rthj-s, IF=700 mA, Ta=25°C |
| ESD Sensitivity | 2000 V; HBM, IF=700 mA |
| Brightness Bin N3 | 800-900 lm; IF=700 mA |
| Brightness Bin N4 | 900-1000 lm; IF=700 mA |
| Brightness Bin N5 | 1000-1100 lm; IF=700 mA |
| Brightness Bin N6 | 1100-1200 lm; IF=700 mA |
| Voltage Bin S13-3 | 8.7-9.0 V; IF=700 mA |
| Voltage Bin S13-4 | 9.0-9.3 V; IF=700 mA |
| Voltage Bin S13-5 | 9.3-9.6 V; IF=700 mA |
| Color Temperature Bin UW7-10 | 5500-6000 K; IF=700 mA |
| Color Temperature Bin UW9-10 | 6000-6500 K; IF=700 mA |
| Color Temperature Bin UW11-10 | 6500-7000 K; IF=700 mA |
| Test Environment Temperature | 25 ± 5°C; unless otherwise indicated |
| Recommended Hand Soldering Iron Power | <30 W; hand soldering for repair/rework |
| Hand Soldering Temperature | <300°C; each terminal once, less than 3 s |
| Recommended Maximum Welding Temperature | 240 ± 5°C for 6 s; reflow soldering |
| Reflow Soldering Cycles | 2 times max; reflow soldering |
| Cleaning Condition | Under 30°C for 3 min or under 50°C for 30 s; alcohol cleaning after soldering |
| Ultrasonic Cleaning Power | 300 W max; pretest recommended |
| Unopened Storage Condition | ≤30°C, ≤60% RH, use within 1 year; before opening package |
| Opened Storage Condition | ≤30°C, ≤40% RH, solder within 168 hours / 7 days; after opening package |
| Baking Condition | 60 ± 5°C for 24 hours; if desiccant/package fails or storage time exceeded |
| Drive Method | Constant current; recommended drive control |
| Cooling Medium Dielectric Withstand | At least 500 V; thermal pad / heat sink assembly |
| Datasheet Status | request_only |
Product Overview
XL-C1860P4S10-62C3C1 is a XINGLIGHT white high power LED built in a 1.8 x 6.0 x 0.7 mm SMD LED package. The datasheet identifies white/yellow fog luminous color and colloid, flip chip technology, and MSL 3 moisture sensitivity. Electrical testing is specified at IF=700 mA and Ta=25°C unless otherwise indicated, with a broader test environment temperature of 25 ± 5°C.
At IF=700 mA and Ta=25°C, the LED is specified for 8.7 to 9.6 V forward voltage, 800 to 1200 lm luminous flux, 5500 K minimum and 7000 K typical color temperature, CRI 70 minimum, and 120° typical viewing angle. Absolute and thermal limits include 10 W maximum power dissipation, 1000 mA maximum forward current, 1500 mA pulse forward current under the stated duty and pulse conditions, 145°C maximum junction temperature, and 3-5°C/W maximum Rthj-s.
Assembly guidance covers reflow soldering, hand soldering for repair or rework, cleaning, storage, and baking. The recommended drive method is constant current, and thermal pad or heat sink assemblies require a cooling medium dielectric withstand of at least 500 V.
Key Features
- White high power LED in SMD package
- 1.8 x 6.0 x 0.7 mm dimensions
- White/yellow fog colloid with flip chip technology
- 10 W maximum power dissipation at Ta=25°C
- 1000 mA maximum forward current rating
- 800 to 1200 lm luminous flux at 700 mA
- 8.7 to 9.6 V forward voltage range
- 5500 to 7000 K color temperature coverage
- 120° typical viewing angle at 700 mA
- Constant-current drive method recommended
Typical Applications
- White LED lighting assemblies
- Constant-current LED modules
- High-flux SMD light engines
- Cool-white illumination designs
- Thermally managed LED boards
- Reflow-assembled lighting products
Procurement Notes
When requesting a quote for XL-C1860P4S10-62C3C1, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Alternatives
LITEON
LTPA-H2S3138
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
Application Verification Recommended
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FAQ
What package is used for XL-C1860P4S10-62C3C1?
XL-C1860P4S10-62C3C1 is specified as an SMD LED with 1.8 x 6.0 x 0.7 mm appearance dimensions. The datasheet also identifies it as a white high power LED using flip chip technology.
What are the main optical ratings at 700 mA?
At IF=700 mA and Ta=25°C, the LED is specified for 800 to 1200 lm luminous flux, 5500 K minimum and 7000 K typical color temperature, CRI 70 minimum, and a 120° typical viewing angle.
What drive method does the datasheet recommend?
The datasheet recommends constant-current drive control. Electrical ratings include 1000 mA maximum forward current and 1500 mA maximum pulse forward current under 1/10 duty cycle and 0.1 ms pulse width conditions.
What storage controls apply after opening the package?
After opening the package, storage is specified at ≤30°C and ≤40% RH, with soldering within 168 hours or 7 days. If storage time is exceeded or the desiccant/package fails, baking is specified at 60 ± 5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.