Specifications
| Type | Description |
|---|---|
| Part Number | XL-IRM0038C-38X |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Component Type | Sensor |
| Package Case | SMD epoxy resin semi-circular spherical package, 5.0 x 4.2 x 4.5 mm |
| Supply Voltage Absolute Maximum | 7.0 V |
| Output Current Absolute Maximum | 2.5 mA |
| Operating Ambient Temperature | -40°C to +85°C |
| Storage Ambient Temperature | -40°C to +125°C |
| Lead Soldering Temperature Time | 260°C, <=6 s |
| Working Current | Min 0.15 mA, Typ 0.2 mA, Max 0.3 mA |
| Receive Distance On Axis | Min 12 m |
| Receive Distance Wide Angle | Min 5 m |
| Peak Wavelength | Typ 940 nm |
| Frequency Bandwidth | Typ 6 kHz |
| Low Level Output Voltage | Typ 0.2 V, Max 0.5 V |
| High Level Output Voltage | Min VCC-0.5 V, Typ VCC-0.3 V, Max 5.0 V |
| High Level Output Pulse Width | Min 500 us, Typ 600 us, Max 800 us |
| Low Level Output Pulse Width | Min 500 us, Typ 600 us, Max 800 us |
| Output Form | Active low output |
| Recommended Supply Voltage | Min 2.7 V, Max 5.5 V |
| Recommended Input Frequency | Typ 37.9 kHz |
| Recommended Operating Temperature | 25°C |
| Moisture Sensitivity Level | MSL 3 |
| Package Type | Small-volume SMD epoxy resin plastic sealed package |
| Package Dimensions | 5.0 x 4.2 x 4.5 mm |
| Operating Voltage Range | 2.7 V to 5.5 V |
| Receiver Construction | High-speed high-sensitivity PIN photodiode with low-power high-gain preamplifier IC |
| Shielding | Internal and external dual shielding anti-interference design |
| Minimum Burst Length | 10 pulses |
| Minimum Burst Gap Time | 12 pulses |
| Minimum Data Pause Time | 25 ms |
| Minimum Transmitter Distance | At least 20 cm |
| Hand Soldering Iron Power | <30 W |
| Hand Soldering Temperature | <300°C |
| Reflow Soldering Limit | Maximum 2 times |
| Recommended Maximum Reflow Temperature | 240°C for 6 s |
| Cleaning Condition Alcohol | <=30°C for 3 min or <=50°C for 30 s |
| Ultrasonic Cleaning Power | <=300 W |
| Unopened Storage Condition | <=30°C, <=40% RH, use within 1 year |
| Opened Storage Condition | <=30°C, <=10% RH, solder within 24 h |
| Recommended Workshop Condition | <=30°C, <=40% RH |
| Baking Condition | 60±5°C for 24 h |
| Static Field Voltage Limit | <100 V |
| Datasheet Status | request_only |
Product Overview
The XL-IRM0038C-38X is a XINGLIGHT infrared remote receiver module classified in the LED category. It integrates a high-speed, high-sensitivity PIN photodiode with a low-power, high-gain preamplifier IC, using internal and external dual shielding for anti-interference design. The output form is active low and TTL/CMOS level compatible.
Electrical operation is specified for a recommended 2.7 V to 5.5 V supply range with a typical 37.9 kHz input frequency. At VDD=5 V with no signal and Ta=25°C, working current is 0.15 mA minimum, 0.2 mA typical, and 0.3 mA maximum. Receive distance is specified as at least 12 m on axis and at least 5 m at ±75° under 200 lux at Ta=25°C.
The module uses a 5.0 x 4.2 x 4.5 mm small-volume SMD epoxy resin plastic sealed package with MSL 3 handling. Assembly limits include a maximum of two Pb-free reflow cycles, 240°C for 6 s recommended maximum reflow temperature, and controlled storage after opening.
Key Features
- Infrared remote receiver module with active-low output
- TTL/CMOS level compatible output signaling
- 2.7 V to 5.5 V operating voltage range
- 37.9 kHz typical recommended input frequency
- 940 nm typical peak wavelength at Ta=25°C
- Minimum 12 m receive distance on axis
- Minimum 5 m receive distance at ±75°
- High-sensitivity PIN photodiode and preamplifier IC
- Internal and external dual shielding anti-interference design
- MSL 3 small-volume SMD epoxy resin package
Typical Applications
- Infrared remote control receivers
- Consumer electronics remote input
- 37.9 kHz IR control links
- TTL/CMOS logic receiver interfaces
- SMD infrared receiver assemblies
- Wide-angle remote signal reception
Procurement Notes
When requesting a quote for XL-IRM0038C-38X, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
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The XINGLIGHT XL-IRM0038C-38X is a miniature, epoxy-encapsulated infrared receiver designed for SMT assembly. Integrating a high-sensitivity PIN diode and a preamplifier IC, thi...
XINGLIGHT XL-IRM0038C-38X IR Receiver: SMT Integration Guide
The XL-IRM0038C-38X from XINGLIGHT is a LED designed for indicator and backlight applications. This technical guide helps design engineers and procurement teams evaluate the com...
FAQ
What supply voltage range is recommended for XL-IRM0038C-38X?
The recommended supply voltage range is 2.7 V minimum to 5.5 V maximum. The absolute maximum supply voltage is listed as 7.0 V at Ta=25°C.
What output format does the XL-IRM0038C-38X use?
The module provides an active-low output that is TTL/CMOS level compatible. Low-level output voltage is specified as 0.2 V typical and 0.5 V maximum under the stated 30 cm ray-axis condition.
What receive distance is specified for this receiver module?
At Ta=25°C and 200 lux, receive distance is specified as at least 12 m on axis at 0°. At ±75°, the specified minimum receive distance is 5 m.
What soldering limits apply to XL-IRM0038C-38X?
The datasheet lists a lead soldering limit of 260°C for no more than 6 s. For Pb-free reflow, the limit is a maximum of two cycles, with a recommended maximum reflow temperature of 240°C for 6 s.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.