XL-ITR20403 Through-Beam Photoelectric Switch

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-ITR20403 Through-Beam Photoelectric Switch

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-ITR20403
Manufacturer
XINGLIGHT
Package
Black thermoplastic housing; outline dimensions in mm, default tolerance ±0.3 mm; numeric dimensions not available in provided text
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-ITR20403 from XINGLIGHT is an LED-category through-beam photoelectric switch built with an infrared emitting diode and an NPN silicon phototransistor in a side-by-side package on a converging optical axis. The device uses a black thermoplastic housing, with outline dimensions specified in millimeters and a default tolerance of ±0.3 mm where dimensions are provided. Key parameters include 940 nm peak wavelength, 50 mA continuous forward current, 1 A peak forward current under pulsed conditions, 30 V collector-emitter voltage, and -20 to +85 °C operating temperature. It is suited to through-beam sensing, optical interruption detection, and emitter-detector switching assemblies.

Specifications

TypeDescription
Part NumberXL-ITR20403
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Component TypeSensor
Package / CaseBlack thermoplastic housing; outline dimensions in mm, default tolerance ±0.3 mm; numeric dimensions not available in provided text
Device CompositionInfrared emitting diode and NPN silicon phototransistor; side-by-side package on converging optical axis
Peak / Cut-off Wavelength940 nm, λp
Input Emitter Power Dissipation75 mW at Ta=25°C
Continuous Forward Current50 mA at Ta=25°C
Peak Forward Current1 A; pulse width ≤100 µs, duty cycle=1%, Ta=25°C
Input Reverse Voltage5 V at Ta=25°C
Output Detector Power Dissipation75 mW at Ta=25°C
Collector-Emitter Voltage30 V, VCEO, Ta=25°C
Emitter-Collector Voltage5 V, VECO, Ta=25°C
Collector Current Rating20 mA, IC(on), Ta=25°C
Operating Temperature-20 to +85 °C, Topr
Storage Temperature-40 to +85 °C, Tstg
Lead Soldering Temperature260 °C; soldering at least 2 mm from body for 5 seconds
Forward VoltageTyp 1.2 V, Max 1.5 V at IF=20 mA, Ta=25°C
Input Peak WavelengthTyp 940 nm at IF=20 mA, Ta=25°C
Reverse CurrentMax 10 µA at VR=5 V, Ta=25°C
Dark CurrentTyp 1 nA, Max 100 nA at Ee=0 mW/cm², VCE=20 V, Ta=25°C
Collector-Emitter Saturation VoltageMax 0.4 V at IC=2 mA, Ee=1 mW/cm², Ta=25°C
Rise TimeTyp 15 µs at VCE=5 V, IC=1 mA, RL=1000 Ω, Ta=25°C
Fall TimeTyp 15 µs at VCE=5 V, IC=1 mA, RL=1000 Ω, Ta=25°C
Collector CurrentMin 0.2 mA, Max 5 mA at IF=20 mA, VCE=5 V, Ta=25°C
Forward Voltage Grading CodeR2-4: Min 1.2 V, Max 1.6 V at IF=20 mA
Collector Current Grading CodeIC9-24: Min 0.4 mA, Max 4.8 mA at IF=20 mA, VCE=5 V
Moisture Sensitivity LevelMSL 2
CompliancePb-free, RoHS compliant
Recommended Wave Soldering Peak240±5 °C for 6 s
Wave Soldering LimitNot more than once for peak welding
Soldering Iron Temperature<300 °C for ≤3 s each terminal, soldering iron capacity <25 W
Datasheet Statusrequest_only

Product Overview

Electrical ratings include 75 mW input emitter power dissipation, 50 mA continuous forward current, 1 A peak forward current for pulse widths up to 100 µs at 1% duty cycle, and 5 V input reverse voltage at Ta=25°C. The detector side is rated for 75 mW power dissipation, 30 V collector-emitter voltage, 5 V emitter-collector voltage, and 20 mA collector current.

Key Features

  • Infrared emitting diode with NPN silicon phototransistor
  • Side-by-side optical package on converging optical axis
  • 940 nm peak infrared wavelength
  • 50 mA continuous forward current rating
  • 1 A pulsed peak forward current rating
  • 30 V collector-emitter voltage rating
  • Typical 15 µs rise and fall times
  • Black thermoplastic housing construction
  • Operating temperature range from -20 to +85 °C
  • MSL 2 moisture sensitivity classification
  • Pb-free and RoHS compliant construction
  • Wave soldering peak of 240±5 °C for 6 s

Typical Applications

  • Through-beam object sensing
  • Optical interruption detection
  • Emitter-detector switching assemblies
  • Infrared beam detection circuits
  • Position sensing with beam interruption
  • Photoelectric switch modules

Procurement Notes

When requesting a quote for XL-ITR20403, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What optical components are inside XL-ITR20403?

XL-ITR20403 contains an infrared emitting diode and an NPN silicon phototransistor. The datasheet describes them as arranged side by side in a package using a converging optical axis.

What wavelength does the XL-ITR20403 emitter use?

The device is specified with a 940 nm peak wavelength. The input peak wavelength is also listed as typical 940 nm at IF=20 mA and Ta=25°C.

What are the main current ratings for XL-ITR20403?

The input emitter is rated for 50 mA continuous forward current at Ta=25°C. Peak forward current is 1 A when pulse width is ≤100 µs and duty cycle is 1%.

What soldering limits are specified for XL-ITR20403?

The datasheet specifies a 260 °C lead soldering temperature for 5 seconds at least 2 mm from the body. Recommended wave soldering is 240±5 °C for 6 seconds, with peak welding not more than once.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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