Specifications
| Type | Description |
|---|---|
| Part Number | XL-GK152 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Component Type | Sensor |
| Package / Case | Black thermoplastic housing; outline dimensions shown in mm with unspecified tolerance ±0.3 mm; exact package dimensions not provided in text |
| Device Composition | Infrared emission diode and NPN silicon phototransistor; packaged side-by-side on converging optical axis |
| Cut-off / Peak Wavelength | 940 nm; λp stated in characteristics |
| Input Emitter Power Dissipation | 75 mW; absolute maximum rating, Ta=25°C |
| Continuous Forward Current | 50 mA; input emitter absolute maximum rating, Ta=25°C |
| Peak Forward Current | 1000 mA; pulse width ≤100 µs, duty cycle 1%, Ta=25°C |
| Reverse Voltage | 5 V; input emitter absolute maximum rating, Ta=25°C |
| Output Detector Power Dissipation | 75 mW; absolute maximum rating, Ta=25°C |
| Collector-Emitter Voltage | 30 V; output detector absolute maximum rating, Ta=25°C |
| Emitter-Collector Voltage | 5 V; output detector absolute maximum rating, Ta=25°C |
| Collector Current | 20 mA; output detector absolute maximum rating, Ta=25°C |
| Operating Temperature | -25 to +85 °C; Topr |
| Storage Temperature | -40 to +85 °C; Tstg |
| Lead Soldering Temperature | 260 °C; Tsol, soldering at least 2 mm from body for 5 seconds |
| Forward Voltage | Typ 1.2 V, Max 1.6 V; IF=20 mA, Ta=25°C |
| Forward Voltage | Typ 1.4 V, Max 1.85 V; IF=100 mA pulsed, Ta=25°C |
| Forward Voltage | Typ 2.6 V, Max 4.0 V; IF=1 A pulsed, Ta=25°C |
| Peak Wavelength | Typ 940 nm; IF=20 mA, Ta=25°C |
| Reverse Current | Max 10 µA; VR=5 V, Ta=25°C |
| Dark Current | Max 100 nA; Ee=0 mW/cm², VCE=20 V, Ta=25°C |
| Collector-Emitter Saturation Voltage | Max 0.4 V; IC=2 mA, Ee=1 mW/cm², Ta=25°C |
| Rise Time | Typ 15 µs; VCE=5 V, IC=1 mA, RL=1000 Ω, Ta=25°C |
| Fall Time | Typ 15 µs; VCE=5 V, IC=1 mA, RL=1000 Ω, Ta=25°C |
| Collector Current / Photocurrent | Min 0.5 mA, Typ 10 mA; IF=20 mA, VCE=5 V, Ta=25°C |
| Voltage Grading Code R2-4 | 1.2 to 1.6 V; IF=20 mA |
| Collector Current Grading Code IC24-29 | 5 to 10 mA; IF=20 mA, VCE=5 V |
| Moisture Sensitivity Level | MSL 2; stated in characteristics |
| Compliance | Pb-free, RoHS compliant; stated in characteristics |
| Recommended Wave Soldering Peak | 240±5 °C for 6 s; maximum recommended product welding temperature |
| Soldering Iron Temperature | <300 °C for ≤3 s; per terminal, soldering iron capacity <25 W |
| Datasheet Status | request_only |
Product Overview
The XL-GK152 is a XINGLIGHT through-beam photoelectric switch in the LED category. Its optical structure combines an infrared emission diode with an NPN silicon phototransistor, packaged side-by-side on a converging optical axis. The peak wavelength is specified at 940 nm, supporting infrared optical sensing across a defined beam path.
Electrical limits include 75 mW power dissipation for both the input emitter and output detector at Ta=25°C. The input emitter is rated for 50 mA continuous forward current, 1000 mA peak forward current under ≤100 µs pulses at 1% duty cycle, and 5 V reverse voltage. The output detector ratings include 30 V collector-emitter voltage, 5 V emitter-collector voltage, and 20 mA collector current.
The device is supplied in a black thermoplastic housing. The datasheet shows outline dimensions in millimeters with unspecified tolerance of ±0.3 mm, but exact package dimensions are not provided in the extracted text. Assembly guidance includes 260°C lead soldering for 5 seconds at least 2 mm from the body, recommended wave soldering at 240±5°C for 6 seconds, and soldering iron use below 300°C for no more than 3 seconds per terminal.
Key Features
- Through-beam photoelectric switch optical sensing structure
- Infrared emitter with NPN silicon phototransistor detector
- Side-by-side devices on converging optical axis
- 940 nm infrared peak wavelength specified
- 50 mA continuous input forward current rating
- 30 V collector-emitter output detector rating
- Typical 15 µs rise and fall times
- Black thermoplastic housing construction
- Operating temperature range from -25 to +85 °C
- MSL 2 moisture sensitivity level
- Pb-free and RoHS compliant device
- Recommended wave soldering peak 240±5 °C for 6 s
Typical Applications
- Object interruption detection
- Through-beam optical sensing
- Position detection modules
- Encoder slot detection
- Automation presence sensing
- Infrared beam-break circuits
- Equipment limit sensing
Procurement Notes
When requesting a quote for XL-GK152, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What type of device is the XL-GK152?
The XL-GK152 is a XINGLIGHT through-beam photoelectric switch. It combines an infrared emission diode and an NPN silicon phototransistor packaged side-by-side on a converging optical axis.
What wavelength does the XL-GK152 use?
The device is specified with a 940 nm infrared peak wavelength. The datasheet also lists typical peak wavelength as 940 nm at IF=20 mA and Ta=25°C.
What are the main detector-side ratings?
The output detector is rated for 75 mW power dissipation, 30 V collector-emitter voltage, 5 V emitter-collector voltage, and 20 mA collector current at Ta=25°C.
What soldering conditions are specified for XL-GK152?
Lead soldering is rated at 260°C for 5 seconds at least 2 mm from the body. Recommended wave soldering is 240±5°C for 6 seconds, and soldering iron use is below 300°C for no more than 3 seconds per terminal.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.