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XL-1606UOC SMD LED: 0603 Orange Bin Parameters & Process Integration

The XINGLIGHT XL-1606UOC is a high-brightness 0603 SMD LED designed for robust indicator and backlight applications. This technical brief consolidates critical optical binning, forward voltage tolerances, and MSL 3 re...

XL-1606UOC SMD LED: 0603 Orange Bin Parameters & Process Integration

📌 Product Overview

The XL-1606UOC from XINGLIGHT is a standard 0603 package Surface Mount Device (SMD) LED, characterized by its compact outline dimensions of 1.7 x 0.6 x 1.1 mm. It features a water-clear colloid that emits high-brightness orange light with a dominant wavelength range of 600–608 nm. 💡 This component is engineered specifically for compatibility with automated SMT assembly lines and supports standard reflow soldering processes to facilitate high-volume production.

🔧 Typical Applications

This component is optimized for applications requiring compact, reliable indicators and efficient backlighting. Key deployment scenarios include:

  • Consumer Electronics: Mobile phone backlights and status indicators for digital products.
  • Display Systems: Electronic display screens requiring high-intensity point light sources.
  • General Indication: Pilot lamps and electronic device status LEDs.
  • Lighting: Supplemental indoor and outdoor lighting solutions where board space is constrained.

📊 Key Technical Specifications

The following table outlines the electro-optical characteristics under standard test conditions (Ta = 25℃, IF = 20mA).

ParameterSymbolMin.Typ.Max.UnitCondition
Luminous IntensityIv80-240mcdIF = 20mA
Dominant Wavelengthλd600-608nmIF = 20mA
Forward VoltageVF1.8-2.4VIF = 20mA
Viewing Angle2Ø1/2-120°-degIF = 20mA
Reverse CurrentIR--≤5μAVR = 5V

Note: Luminous intensity is categorized via brightness codes (D2–D6), and voltage is binned (M17-9 to M18-5) for consistent lot performance. 📈

⚠️ Absolute Maximum Ratings & Process Limits

Exceeding these limits may cause device failure or permanent damage. Designers must ensure the junction temperature remains within safe operating limits during thermal cycling.

ParameterSymbolMax. ValueUnitNotes
Max Power DissipationPD50mW
Max Continuous Forward CurrentIF20mA
Peak Forward CurrentIFP80mAPulse ≤ 0.1ms, Duty ≤ 1/10
Max Reverse VoltageVR5V
ESD ToleranceESD2000VAntistatic ability
Operating TemperatureTOPR-40 ~ +85°C
Storage TemperatureTSTR-40 ~ +85°C
Soldering Temp/TimeTSOL260°C≤ 6 Seconds

📦 Package, Dimensions & Assembly Notes

The XL-1606UOC utilizes EIA standard packaging compliant with Moisture Sensitivity Level (MSL) 3.

  • Dimensions: 1.7mm (L) x 0.6mm (W) x 1.1mm (H).
  • Process Compatibility: Fully compatible with SMT automatic placement machines and reflow soldering profiles. 🔒
  • Reflow Profile: Supports both Lead-free (Peak 255°C) and Lead (Peak 235°C) processes, with specific ramp-up and cooling rate restrictions to prevent thermal shock.
  • Assembly: Designed for In-Board IR-Reflow cycles (up to 2 times) ensuring reliability during double-sided PCB assembly.

🚀 Sourcing & Supply Considerations

When integrating the XL-1606UOC into supply chains, consider the following to manage logistics and quality:

  • Packaging: Verify reel packaging dimensions correspond to standard EIA tape specifications for feeder setup.
  • Binning: Specify brightness (D codes) and voltage (M codes) bins to ensure uniformity in large displays.
  • MSL Handling: As an MSL 3 component, ensure dry storage and manage floor life according to IPC standards to prevent pop-corning during reflow.
  • Authenticity: Source through authorized channels to guarantee ROHS compliance and reliability data adherence.

❓ FAQ

Q: What is the MSL rating of the XL-1606UOC?
A: The XL-1606UOC has a Moisture Sensitivity Level (MSL) of 3. This means it can be exposed to a factory floor life of 168 hours before baking is required prior to reflow soldering.

Q: What are the binning codes for brightness and voltage?
A: Brightness is binned from D2 (80–120 mcd) to D6 (210–240 mcd). Forward voltage is binned from M17-9 (1.8–1.9V) to M18-5 (2.3–2.4V), allowing for precise selection based on power budget and optical requirements.

Q: Is this LED suitable for outdoor lighting applications?
A: While the datasheet lists "Indoor and outdoor lighting" as an application, designers must ensure the specific enclosure provides adequate ingress protection (IP rating) and environmental sealing, as the component itself is a standard open SMD.

Q: What is the maximum soldering temperature for this component?
A: The maximum soldering temperature is 260°C for a duration not exceeding 6 seconds. For infrared reflow, the peak temperature should not exceed 255°C (Lead-free) or 235°C (Leaded process).

Q: How does the viewing angle affect the design?
A: The XL-1606UOC has a typical viewing angle of 120°. This wide angle makes it suitable for indicator lights and backlight diffusion where uniform light spread is preferred over focused beams.

Q: What is the ESD tolerance?
A: The component features an antistatic ability of 2000V. Standard ESD precautions (wrist straps, grounded mats) should be observed during manual handling and assembly to prevent latent damage.

About Leon Zhang

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

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