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XL-2106SYGC SMD LED — Technical Specifications & Design Guide

The XL-2106SYGC from XINGLIGHT is a LED designed for indicator and backlight applications. This technical guide helps design engineers and procurement teams ...

XL-2106SYGC SMD LED — Technical Specifications & Design Guide

📌 Product Overview

The XL-2106SYGC is a standard 0805 (2012 metric) Surface Mount Device (SMD) LED designed by XINGLIGHT. It features a High-Brightness Yellow-Green emission with a dominant wavelength of 565–575nm. Targeting global OEM and EMS manufacturing lines, this component is optimized for high-volume automated assembly (SMT) and reflow soldering processes. For engineering teams, the critical selection variables are its low forward voltage (min. 1.8V) and wide 120° viewing angle, making it ideal for status indicators and backlighting where uniform light diffusion is required on compact PCBAs.

🚀 Typical Applications & Design Context

Based on its robust industrial temperature range (-40°C to +85°C) and moisture sensitivity level (MSL 3), the XL-2106SYGC is best suited for:

  • Consumer Electronics & Home Appliances: Power indicators and user interface panels due to low power consumption (20mA standard).
  • Automotive Electronics (Interior): Dashboard indicators (non-critical lighting) where high-brightness visibility is needed.
  • Industrial PCBA & Traffic Indication: Status lights requiring high reliability under thermal stress.
  • Toys & Giftware: Cost-effective lighting solution with RoHS compliance for international markets.

The component is specifically designed for SMT automation, ensuring pick-and-place compatibility for high-speed mass production environments.

📊 Key Technical Specifications

The following data highlights the performance windows under standard test conditions (Ta=25°C, IF=20mA). These parameters are critical for driving circuit design and brightness consistency.

ParameterSymbolMin.Typ.Max.UnitTest Conditions
Luminous IntensityIv50-80mcdIF = 20mA
Dominant Wavelengthλd565-575nmIF = 20mA
Forward VoltageVF1.8-2.4VIF = 20mA
Viewing Angle2Ø1/2--120DegIF = 20mA
Reverse VoltageVR--5VIR ≤ 5μA

Note: Binning codes (D1/D2 for brightness, HYG03-06 for wavelength, M17-9 to M18-5 for voltage) allow for tighter supply chain control if specified during procurement.

⚠️ Absolute Maximum Ratings & Process Limits

Exceeding these parameters risks immediate catastrophic failure or latent degradation (reliability decay).

ParameterSymbolValueUnit
Max Power DissipationPD50mW
Max Continuous Forward CurrentIF20mA
Peak Forward CurrentIFP80mA
ESD SusceptibilityESD2000V
Operating TemperatureTOPR-40 ~ +85°C

💡 E-E-A-T Insight:
The MSL (Moisture Sensitivity Level) is 3.

  • Risk: If the floor life (exposure time) exceeds 168 hours before reflow, internal "popcorning" or delamination can occur during the high-heat soldering process.
  • Action: Procurement must verify that suppliers bake the reels if the vacuum seal is broken for more than 1 week prior to SMT.

📐 Package, Dimensions & Assembly Notes

  • Package: 0805 (Metric 2012). Dimensions: 2.1 (L) x 0.55 (W) x 1.0 (H) mm.
  • Soldering: Compatible with standard Infrared Reflow.
    • Lead-Free Process: Max temp 260°C. Peak temperature should not exceed 255°C for >5-10 seconds.
    • Manual/Repair: soldering temp ≤ 260°C for ≤ 6 seconds.
  • Placement: The "water clear colloid" lens provides a wide viewing angle but requires correct polarity orientation during tape-and-reel setup.

🔒 Procurement & Sourcing Insights

  • Supply Chain Risk: As a standard commodity LED, the XL-2106SYGC faces high substitution risk from the "gray market" (Huaqiangbei).
  • Traceability: LDeepAI recommends verifying the original packaging (EIA standard Reel) to avoid mixed batches where brightness (IV) or Forward Voltage (VF) binning codes are inconsistent.
  • Alternative Validation: When validating alternatives (e.g., Everlight, Lite-On), ensure the footprint dimensions (specifically the 1.0mm height) do not conflict with adjacent components or shield cans.
  • Quality Control: Always request the "Reliability Test Report" (MIL-STD-750D compliant) for批次 (batches) intended for automotive or safety-critical applications.

❓ FAQ

Q1: What are the critical failure modes if I drive the LED at 30mA continuously?
A: While the pulse current can handle 80mA, continuous operation above 20mA exceeds the Absolute Maximum Rating. This will accelerate thermal decay of the phosphor/epoxy, leading to permanent lumen depreciation (dimming) and potential junction breakdown.

Q2: Can I use this for lead-free soldering profiles?
A: Yes, the datasheet explicitly supports lead-free processes up to 260°C. However, ensure the MSL 3 preconditioning (baking) is strictly followed to prevent moisture-induced cracking during the higher peak temperatures of lead-free profiles.

Q3: How does the "D1/D2" brightness grading affect my procurement?
A: If you do not specify the bin code (e.g., D1), your supplier may ship mixed batches. On a single PCBA panel, this will result in visible uneven brightness between LEDs. For mass production, lock the bin code with your vendor.

Q4: Is this LED suitable for outdoor traffic signals?
A: While the datasheet lists "Traffic instructions," this specific component (Yellow-Green, 570nm) is an indicator LED. It is likely not intense enough for high-intensity traffic signal lamps (which typically require high-power emitters). Verify luminous intensity (Iv) against local regulatory standards before designing.


About Leon Zhang

Founder and Strategic Sourcing Lead, LDeepAI

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

Expertise: electronic component sourcing, China supply-chain verification, LED components, memory and storage sourcing, RFQ risk screening.

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