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XL-2835BGWC-02 SMD LED — Technical Specifications & Design Guide

The XL-2835BGWC-02 is a surface-mount device (SMD) LED from XINGLIGHT, designed within a compact 2.8x3.5x0.8mm package. 💡 It features a green light emitter with a yellow diffused colloid, suitable for high-density integration in modern lighting assemblies.

XL-2835BGWC-02 SMD LED — Technical Specifications & Design Guide

📌 Product Overview

The XL-2835BGWC-02 is a surface-mount device (SMD) LED from XINGLIGHT, designed within a compact 2.8x3.5x0.8mm package. 💡 It features a green light emitter with a yellow diffused colloid, suitable for high-density integration in modern lighting assemblies. While primarily categorized under indoor and commercial lighting, its real design value lies in the balance between luminous intensity and thermal management. ✨ Engineers must focus not just on the 60mA drive current, but on how the Moisture Sensitivity Level (MSL 3) and reflow profiles impact long-term reliability in mass production.

🚀 Typical Applications

Based on its optical characteristics and robust 2835 form factor, this component is optimized for scenarios requiring efficient light distribution and reliability.

  • Indoor Illumination: 💡 Ideal for fluorescent tubes, light strips, and downlights where consistent color rendering is key.
  • Commercial Signage: ✨ High suitability for advertising characters and light boxes due to the 120-degree viewing angle.
  • Backlighting: 📈 Provides stable illumination for LCD backlights in display panels.
  • Decorative Lighting: 🎨 Compatible with flexible light strips for architectural or accent lighting effects.

📊 Key Technical Specifications

The table below outlines the critical optical and electrical parameters under standard test conditions (Ta=25°C).

ParameterSymbolMin.Typ.Max.UnitTest Conditions
Luminous IntensityΦ1017LMIF = 60mA
Forward VoltageVF3.03.4VIF = 60mA
Viewing Angle2θ1/2120DegIF = 60mA
Reverse CurrentIr5μAVR = 5V
Color Coordinatesx0.18IF = 60mA
y0.16IF = 60mA

💡 Design Note: Bin codes (H7/H8 for brightness, N13-4/N13-5 for voltage) allow for tighter selection in specific designs.

🚨 Absolute Maximum Ratings & Process Limits

Exceeding these limits may cause permanent damage or failure. 👇 These values are critical for safety margin calculations.

ParameterSymbolValueUnitNotes
Max Power DissipationPD200mW@ Ta=25°C
Max Forward CurrentIF60mAContinuous DC
Peak Forward CurrentIFP150mAPulse width ≤0.1ms, Duty ≤1/10
Max Reverse VoltageVR5V
ESD AbilityESD2000VHuman Body Model (HBM)
Operating Temp.TOPR-40 ~ +85°C
Storage Temp.TSTR-40 ~ +85°C

🔒 Critical Warning: The soldering temperature must not exceed 260°C for longer than 6 seconds to prevent package delamination.

📦 Package, Dimensions & Assembly Notes

This component utilizes the standard 2835 footprint (2.8x3.5x0.8mm), which is industry-standard for automated assembly.

  • Dimensions: The compact 0.8mm height profile allows for slim lighting fixtures.
  • MSL Level: ⚠️ Rated as MSL 3. Components must be baked and mounted within 168 hours (floor life) of opening the vacuum-sealed bag to prevent "popcorning" during reflow.
  • Soldering: Designed for infrared reflow processes. Ensure the profile complies with the "Lead-free process" mentioned in the datasheet (Peak 255°C) for optimal wetting.
  • Packaging: EIA standard compliant for seamless SMT pick-and-place automation.

🤝 Sourcing & Supply Considerations

To ensure design integrity and supply chain stability, consider the following factors when procuring the XL-2835BGWC-02.

  • Bin Consistency: Verify that the supplier can provide consistent bins (H7/H8) across batches to avoid color or brightness variations in the final product.
  • Authenticity: Source strictly through authorized channels to guarantee ROHS compliance and the 2000V ESD protection rating.
  • Sample Evaluation: ✨ Request samples from the specific production batch before mass production to verify the "Yellow Diffused" colloid compatibility with your light guide design.
  • Technical Support: Engage with XINGLIGHT engineers for detailed reliability test data (MIL-STD-750D) if your application involves harsh environments.

❓ Frequently Asked Questions

Q: What is the forward voltage range I should design my driver for?
A: You should design your driver circuit to accommodate a forward voltage (VF) range of 3.0V to 3.4V. The bin codes N13-4 (3.0-3.2V) and N13-5 (3.2-3.4V) indicate the specific sub-ranges within this window. Always design for the maximum voltage to ensure current regulation remains stable.

Q: Can this LED be used in high-humidity outdoor environments?
A: The datasheet specifies an operating temperature range of -40°C to +85°C and compliance with humidity storage tests. However, for outdoor use, it is strictly dependent on the IP rating of the final fixture. The LED itself is not waterproof; it requires an enclosure with appropriate conformal coating or sealing.

Q: What precautions must I take given the MSL 3 rating?
A: MSL 3 means the component is sensitive to moisture. If the vacuum bag has been open for more than 168 hours, you must bake the LEDs at 125°C for 24 hours before reflow soldering to prevent internal moisture from expanding and cracking the package during the high-temperature reflow process.

Q: What is the difference between the H7 and H8 brightness codes?
A: These codes refer to the Luminous Intensity bins. H7 covers 10-13 Lumens, while H8 covers 13-17 Lumens (at 60mA). Selecting a specific bin allows you to ensure uniform brightness across a light strip or display panel.

Q: Is this LED compatible with lead-free soldering processes?
A: Yes, the datasheet explicitly provides a profile for a "Lead-free process" with a peak temperature of 255°C +0/-5°C. Ensure your reflow oven profile does not exceed this limit or the recommended time above 217°C (60-120 seconds) to avoid damaging the die attach.

About Leon Zhang

Founder and Strategic Sourcing Lead, LDeepAI

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

Expertise: electronic component sourcing, China supply-chain verification, LED components, memory and storage sourcing, RFQ risk screening.

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