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XL-3014UGC-02 SMD LED — Technical Specifications & Design Guide

The XINGLIGHT XL-3014UGC-02 is a high-performance Green SMD LED designed for the 3014 package standard (3.0x1.4x0.8mm). It features a transparent colloid optimized for a dominant wavelength of 520–525nm, delivering a luminous intensity ranging from 3800 to 6000 mcd at 60mA.

XL-3014UGC-02 SMD LED — Technical Specifications & Design Guide

📌 Product Overview

The XINGLIGHT XL-3014UGC-02 is a high-performance Green SMD LED designed for the 3014 package standard (3.0x1.4x0.8mm). It features a transparent colloid optimized for a dominant wavelength of 520–525nm, delivering a luminous intensity ranging from 3800 to 6000 mcd at 60mA. 💡 This component is engineered specifically for applications requiring high brightness and compact form factors.

Target applications include indoor lighting fixtures, commercial signage, and LCD backlights. 🚀 Designers should focus on the 120° viewing angle and forward voltage variance (2.8V–3.4V) to ensure uniform light distribution and efficient driver compatibility in their specific circuit designs.

💡 Typical Applications

Based on its robust optical characteristics and moisture sensitivity level (MSL 3), the XL-3014UGC-02 is suitable for a wide range of environments:

  • Indoor Lighting: Ideal for lamp tubes and flexible light strips where high-intensity output is necessary.
  • Commercial Display: Effective for advertising boards and channel letters requiring consistent green luminosity.
  • LCD Backlighting: Provides reliable color purity for display panels.
  • Decorative & Automotive: Suitable for metal plate hard light strips and internal auxiliary automotive lighting.
  • General Electronics: Useful for status indicators and other display categories requiring SMT automation.

📊 Key Technical Specifications

The table below outlines the optical and electrical characteristics under standard test conditions ($T_a=25^\circ\text{C}$).

ParameterSymbolMin.Typ.Max.UnitTest Conditions
Luminous Intensity$I_V$3800-6000mcd$I_F=60\text{mA}$
Dominant Wave Length$\lambda_d$515-530nm$I_F=60\text{mA}$
Peak Wave Length$\lambda_p$-525-nm$I_F=60\text{mA}$
Forward Voltage$V_F$2.8-3.4V$I_F=60\text{mA}$
Viewing Angle$2\theta_{1/2}$-120-deg$I_F=60\text{mA}$
Reverse Current$I_R$--5$\mu\text{A}$$V_R=5\text{V}$

Note: Color binning codes (HG02-HG04) and voltage grading (N13-3 to N13-5) are available for strict color consistency.

🔒 Absolute Maximum Ratings & Process Limits

To ensure reliability and prevent catastrophic failure, designers must strictly adhere to these absolute maximum ratings ($T_a=25^\circ\text{C}$). 👇 Exceeding these values may cause permanent damage.

ParameterSymbolMax. ValueUnitNotes
Max Power Dissipation$P_D$200mW-
Max Continuous Forward Current$I_F$60mA-
Peak Forward Current$I_{FP}$120mAPulse width $\le 0.1\text{ms}$, Duty $\le 1/10$
Max Reverse Voltage$V_R$5V-
ESD AbilityESD2000VHuman Body Model (HBM)
Operating Temperature$T_{OPR}$-40 ~ +85$^\circ\text{C}$-
Storage Temperature$T_{STR}$-40 ~ +85$^\circ\text{C}$-
Soldering Temp/Time$T_{SOL}$260$^\circ\text{C}$$\le 6\text{ seconds}$

📦 Package, Dimensions & Assembly Notes

The XL-3014UGC-02 utilizes a standard 3014 footprint with compact dimensions of 3.0 x 1.4 x 0.8 mm. This small form factor allows for high-density array designs on PCBs.

  • Soldering Compatibility: Suitable for both infrared reflow soldering and automated SMT production.
  • Reflow Profile:
    • Lead-Free Process: Max temp 255°C ($+0/-5^\circ\text{C}$) for 5-10 seconds.
    • Lead Process: Max temp 235°C ($+5/-0^\circ\text{C}$) for 10-15 seconds.
  • Moisture Sensitivity: Classified as MSL 3. Ensure proper baking and handling if the components have been exposed to ambient humidity for extended periods before reflow to prevent "popcorning" or internal cracking.

📈 Sourcing & Supply Considerations

When integrating the XL-3014UGC-02 into mass production, consider the following supply chain factors:

  • Bin Consistency: Specify brightness (G5-G9) and voltage (N13) codes upfront to ensure batch-to-batch consistency in light output and power consumption.
  • Packaging: Components are shipped in EIA standard compliant packaging, optimized for high-speed SMT pick-and-place machines.
  • Authenticity: Always source through authorized channels to verify ROHS compliance and avoid counterfeit components that may not meet the specified reliability standards.

❓ FAQ

Q: What is the maximum current I can drive the XL-3014UGC-02 with continuously?
A: The absolute maximum continuous forward current is 60mA. While it can handle peaks up to 120mA, this is strictly for pulses $\le 0.1\text{ms}$ with a duty cycle of 1/10. Driving it continuously above 60mA will degrade the lifespan.

Q: Does this LED require a specific soldering profile for lead-free assembly?
A: Yes. For lead-free processes, the peak temperature should not exceed 255°C ($+0/-5^\circ\text{C}$) and should be held for only 5-10 seconds. Exceeding this time or temperature can damage the internal phosphor or bond wires.

Q: What does "MSL 3" mean for my assembly process?
A: Moisture Sensitivity Level 3 means the components are sensitive to moisture absorption. If the floor life (exposed to ambient $<30^\circ\text{C}/60%\text{RH}$) exceeds 168 hours, you must bake the components before reflow soldering to prevent internal damage.

Q: How wide is the light beam for this specific LED?
A: The typical viewing angle ($2\theta_{1/2}$) is 120 degrees. This wide angle makes it suitable for general area lighting and backlighting where diffused light is preferred over a focused spot.

Q: What is the typical forward voltage I should design my driver for?
A: The forward voltage range is broad: 2.8V to 3.4V at 60mA. Your driver should accommodate the maximum (3.4V) to ensure consistent brightness, or you should select the specific voltage bin (e.g., N13-4) for tighter regulation.

About Leon Zhang

Founder and Strategic Sourcing Lead, LDeepAI

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

Expertise: electronic component sourcing, China supply-chain verification, LED components, memory and storage sourcing, RFQ risk screening.

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