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XL-4014SURC-02FJ SMD LED: SMT Integration & Binning Specs

The XINGLIGHT XL-4014SURC-02FJ is a 4.0x1.4mm surface-mount red LED designed for high-intensity illumination in compact commercial and automotive interiors. This technical brief analyzes critical optical parameters, v...

XL-4014SURC-02FJ SMD LED: SMT Integration & Binning Specs

📌 Product Overview

The XL-4014SURC-02FJ is a standard 4014 package SMD LED from XINGLIGHT, featuring a red luminous source with a water-clear lens. 💡 It utilizes an InGaAlP chip architecture to achieve a dominant wavelength of 620nm, making it ideal for status indication and auxiliary illumination where board space is constrained. This component is engineered specifically for compatibility with automated infrared reflow soldering processes.

Target applications primarily include commercial lighting displays, LCD backlights, and automotive interior auxiliary lighting. 👆 Design focus centers on its MSL 3 moisture sensitivity level and compact 0.8mm thickness profile. This ensures the component maintains structural integrity during standard SMT assembly while providing sufficient luminous intensity for indicator or light strip arrays.

🛠 Typical Applications

Based on the 120° viewing angle and 1.4mm width, this model is optimized for the following scenarios:

  • Commercial Signage: High-density dot matrix lighting for advertising boards and channel letters.
  • Automotive Interiors: Dashboard indicators and auxiliary footwell lighting requiring low power consumption.
  • Consumer Electronics: LCD backlighting for household appliances and power status strips.
  • Decorative Arrays: 📉 Rigid metal light strips where consistent color temperature (Red 620nm) is critical.
  • General Indoor Lighting: Linear tube replacements and pilot light assemblies.

⚡ Key Technical Specifications

⚠️ Note: Testing conditions are critical for these parameters. All optical measurements are standardized at $T_a=25^\circ C$ and $I_F=60mA$.

ParameterSymbolMin.Typ.Max.UnitConditions
Luminous Intensity$I_V$100014001800mcd$I_F=60mA$
Dominant Wavelength$\lambda_d$615620630nm$I_F=60mA$
Forward Voltage$V_F$1.8-2.4V$I_F=60mA$
Viewing Angle$2\theta_{1/2}$-120-deg$I_F=60mA$
Peak Wavelength$\lambda_p$-625-nm$I_F=60mA$
Reverse Current$I_R$--5$\mu A$$V_R=5V$

🚨 Absolute Maximum Ratings & Process Limits

Exceeding these ratings risks permanent failure. 🔒 Design engineers must include safety margins in their driver circuits to account for voltage spikes and transient thermal loads.

ParameterSymbolMax ValueUnitNotes
Max Power Dissipation$P_D$200mW@ $T_a=25^\circ C$
Max Continuous Forward Current$I_F$60mADerate above 25°C ambient
Peak Forward Current$I_{FP}$120mAPulse width $\le 0.1ms$, Duty $\le 1/10$
Max Reverse Voltage$V_R$5V-
ESD ToleranceESD2000VHuman Body Model (HBM)
Operating Temperature$T_{OPR}$-40 ~ +85°C-
Storage Temperature$T_{STR}$-40 ~ +85°C-
Soldering Temp/Time$T_{SOL}$260°C$\le 6$ Seconds

📦 Package, Dimensions & Assembly Notes

The component utilizes the standard 4014 form factor (Metric 4014), implying a footprint of 4.0mm x 1.4mm with a height of 0.8mm. 📐 This low profile is suitable for tight optical cavities in backlighting units.

Assembly & Soldering:

  • Package Type: Surface Mount Device (SMD) with EIA standard packaging.
  • Soldering Compatibility: Suitable for infrared reflow processes.
    • Lead-Free Process: Peak temp 255°C (+0/-5°C) for 5-10s.
    • Lead Process: Peak temp 235°C (+5/-0°C) for 10-15s.
  • Moisture Sensitivity: 📉 Classified as MSL Level 3. Floor life is 168 hours; bake before reflow if exposed beyond this limit to prevent popcorn cracking.

📦 Sourcing & Supply Considerations

For procurement teams managing BOMs, verifying the "F1-F5" brightness binning and "N12-7/8/9" voltage binning is essential to prevent color or intensity variation in mass production.

  • Supply Chain Risk: Confirm the moisture barrier bag integrity upon receipt due to the MSL 3 rating.
  • Quality Inspection: Implement sampling for $V_F$ and $I_V$ distribution to verify bin codes match the packing list.
  • Cross-Reference: Contact LDeepAI for drop-in replacements or cross-brand equivalents if lead times extend.
  • Procurement: Verify distributor authenticity to avoid mixed binning or recycled components.

❓ FAQ

Q: Can the XL-4014SURC-02FJ handle a peak current higher than 60mA?
A: Yes, but only in pulsed mode. The Absolute Maximum Ratings allow a peak forward current ($I_{FP}$) of 120mA, provided the pulse width is $\le 0.1ms$ and the duty cycle is $\le 1/10$. Continuous operation above 60mA will degrade the lifespan.

Q: What is the significance of the MSL Level 3 rating?
A: MSL 3 means the component is sensitive to moisture. After the sealed bag is opened, you have 168 hours (1 week) to mount the LEDs using reflow soldering. If not used within this window, the components must be baked at 80°C-125°C for a specified duration to drive out moisture.

Q: How do I interpret the Brightness and Voltage Binning codes?
A: XINGLIGHT sorts these LEDs into specific bins.

  • Brightness: Codes F1 (lowest) to F5 (highest) represent the Luminous Intensity ($I_V$) ranging from 1000mcd to 1800mcd.
  • Voltage: Codes N12-7, N12-8, and N12-9 represent the Forward Voltage ($V_F$) ranges of 1.8-2.0V, 2.0-2.2V, and 2.2-2.4V respectively.
    👉 Ensure your supplier provides consistent bin codes for uniformity across light strips.

Q: Is this component compatible with lead-free soldering profiles?
A: Yes, the datasheet explicitly supports a lead-free process. The recommended profile allows a peak body temperature of 255°C (max 260°C) for a duration of 5 to 10 seconds, aligning with standard J-STD-020C requirements.

Q: What does the "Colorless Transparent" colloid specification mean?
A: This refers to the epoxy encapsulation. Being colorless transparent allows the full light output to pass through without a diffused tint, resulting in higher intensity (brightness) but a narrower, more focused beam compared to diffused lenses.

Q: How should I store these LEDs if I don't use them immediately?
A: Store them in a dry environment with relative humidity $< 60%$ and temperatures between -40°C and +85°C. Ideally, they should remain sealed in the original anti-static moisture barrier bag with desiccant.

About Leon Zhang

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

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