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XL-DZ234UGD 4-SMD LED: 110° Viewing Angle & Thermal Design

The XINGLIGHT XL-DZ234UGD is a 4-SMD Green LED (525nm) designed for storage servers and status indicators. This technical analysis evaluates luminous intensity, forward voltage bins, and thermal dissipation limits for...

XL-DZ234UGD 4-SMD LED: 110° Viewing Angle & Thermal Design

📌 Product Overview

The XINGLIGHT XL-DZ234UGD is a high-efficiency 4-in-one SMD LED device designed for status indication and backlighting applications. 💡 With a compact footprint of 12mm x 5.2mm, this component integrates four independent green LED chips into a single package, offering a typical luminous intensity of 1500 mcd at 20mA.

👇 Designed for industrial reliability, the device operates within a -40℃ to +85℃ range and meets ROHS environmental standards. The 110-degree viewing angle ensures broad visibility for server racks and communication equipment.

🛠 Typical Applications

Based on the provided datasheet parameters (260℃ solder resistance, high humidity endurance), the XL-DZ234UGD is optimized for the following scenarios:

  • Storage Servers & Communication: Ideal for port activity and status LEDs on chassis and RAID enclosures.
  • Status Indicators: Clear visual feedback for IoT devices and consumer electronics.
  • Medical Equipment: Reliable signaling for diagnostic or monitoring interfaces.
  • Electronic Test Instruments: Panel indicators requiring consistent luminosity and wavelength stability.

⚡ Key Technical Specifications

The following table outlines the initial electro-optical characteristics (Ta=25℃) to assist engineers in circuit design and binning selection.

ParameterSymbolMinTypMaxUnitTest Conditions
Luminous IntensityIv-1500-mcdIF=20mA
Dominant Wavelengthλd515-530nmIF=20mA
Peak Wavelengthλp-525-nmIF=20mA
Forward VoltageVF2.6-3.4VIF=20mA
Viewing Angle2Ø1/2-110°-degIF=20mA
Reverse CurrentIR--≤5μAVR=5V

🚨 Absolute Maximum Ratings & Process Limits

Exceeding these ratings may cause permanent device failure. 📉 These limits are critical for establishing safety margins in power supply design and thermal management.

ParameterSymbolValueUnit
Max Power DissipationPD240mW
Max Continuous Forward CurrentIF80 (20*4)mA
Peak Forward CurrentIFP320 (80*4)mA
Max Reverse VoltageVR5V
ESD ToleranceESD2000V
Operating TemperatureTOPR-40 ~ +85

📦 Package, Dimensions & Assembly Notes

The device utilizes a standard 125.214.2mm surface-mount package with EIA standard packaging.
🔒 Moisture Sensitivity: Classified as MSL 2, requiring a floor life of less than one year at <30℃/60% RH. Anti-static foil bags are standard.

Soldering Profile:

  • Max Soldering Temp: 260℃
  • Time: ≤5 Seconds
    ⚠️ Note: Ensure proper grounding during assembly; the datasheet mandates an electrostatic field voltage <100V within a 1-foot radius of the component to prevent latent damage.

🚢 Sourcing & Supply Considerations

To ensure supply chain continuity and manufacturing consistency, verify the following points when procuring the XL-DZ234UGD:

  1. Binning Verification: Confirm brightness (A7-B2) and voltage (N13-2 to N13-5) bin codes to match your PCB power budget and uniformity requirements.
  2. Packaging Integrity: Validate that seals are intact to ensure the MSL 2 rating has not been compromised by moisture exposure.
  3. Authenticity: Source through authorized channels to guarantee ROHS compliance and the specified 2000V ESD protection.

❓ FAQ

Q: What is the forward current limit for the entire 4-SMD chip array?
The maximum continuous forward current is 80mA (calculated as 20mA * 4 chips). Designers must ensure the driving current does not exceed this aggregate limit to prevent thermal runaway.

Q: How should the pins be handled to prevent ESD damage during assembly?
All machinery and personnel must be grounded. Use anti-static wrist straps, mats, and ion fans to keep the electrostatic field below 100V within one foot of the device. Standard plastic containers should be avoided.

Q: What are the storage requirements if the components are not used immediately?
Store in the original packaging at temperatures ≤30℃ and relative humidity ≤70%. If storage exceeds three months, use a desiccant cabinet or nitrogen-filled dry box to prevent moisture ingress.

Q: Can this component withstand high-humidity environments?
Yes, the datasheet specifies successful endurance testing at 85℃ and 85-90% RH for 1000 hours, making it suitable for harsh industrial and server environments.

Q: What is the typical viewing angle for this LED?
The viewing angle (2Ø1/2) is typically 110 degrees. This wide angle is suitable for status indicators that need to be visible from off-axe positions.

About Leon Zhang

Founder and Strategic Sourcing Lead, LDeepAI

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

Expertise: electronic component sourcing, China supply-chain verification, LED components, memory and storage sourcing, RFQ risk screening.

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